Semiconductor light emitting device and fabrication method thereof

• US 7,301,176 B2
• Filed: 04/22/2005
• Issued: 11/27/2007
• Est. Priority Date: 04/27/2004
• Status: Active Grant

• Current Assignee: LedComm LLC (IPValuation Partners, LLC)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Abe, Munezo, Yoshida, Toshihiko
• Primary Examiner(s): Parekh, Nitin
• Application Number:
  US11/112,215
• Publication Number:
  US 20050236639A1
• Time in Patent Office: 949 Days
• Field of Search: 257 98-100, 257/666, 257/432, 257/E25.032
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A semiconductor light emitting device includes an LED element, a lead frame on which the LED is mounted, a lead frame electrically connected to the LED element via a wire, transparent resin formed on the LED element and on the lead frames, and light shielding resin having a reflectance higher than the reflectance of the transparent resin, surrounding the perimeter of the LED. The transparent resin includes a lens portion constituting a lens on the LED, and a holding portion holding the lead frame.

Claims

1. A semiconductor light emitting device comprising:

a semiconductor light emitting element,

a first lead frame on which said semiconductor light emitting element is mounted,

a second lead frame electrically connected to said semiconductor light emitting element via a wire, and

light transmitting resin formed on said semiconductor light emitting element and on said first and second lead frames,

wherein said light emitting element is surrounded by a light shielding resin,

wherein leading ends of said first and second lead frames are inserted into said light transmitting resin to provide a holding portion holding said first and second lead frames,

wherein said light shielding resin has a reflectance higher than a reflectance of said light transmitting resin, and

wherein said light shielding resin is formed to cover a bottom surface and a side surface of said holding portion provided in said light transmitting resin.

2. The semiconductor light emitting device according to claim 1, wherein said light transmitting resin comprises a lens portion constituting a lens on said semiconductor light emitting element, and

wherein said lens portion has a width smaller than the width of said holding portion.

3. The semiconductor light emitting device according to claim 1, wherein

a leading end of said first lead frame and a leading end of said second lead frame constitute a concave,

said semiconductor light emitting element is provided on a bottom surface of said concave, and

said holding portion receives at least a portion of said concave.

4. The semiconductor light emitting device according to claim 1,

wherein said light transmitting resin comprises a lens portion constituting a lens on said semiconductor light emitting element, and

wherein said semiconductor light emitting element is provided on an optical axis of said lens portion.

5. The semiconductor light emitting device according to claim 1, wherein a backside portion of said first lead frame corresponding to a region where said semiconductor light emitting element is mounted is exposed outside of said light transmitting resin.

6. The semiconductor light emitting device according to claim 1, wherein a material for scattering light is mixed into said light transmitting resin.

7. The semiconductor light emitting device according to claim 1, wherein said holding portion has a sectional shape of an upside-down trapezoid, and is received in a concave of said light shielding resin.