Architecture for power modules such as power inverters

• US 7,301,755 B2
• Filed: 12/13/2004
• Issued: 11/27/2007
• Est. Priority Date: 12/17/2003
• Status: Expired due to Fees

• Current Assignee: Continental Automotive Systems, Inc. (Continental AG)
• Original Assignee: Siemens VDO Automotive Corporation (Siemens AG)
• Inventors: Rodriguez, Pablo, Flett, Fred, Ahmed, Sayeed, Patwardhan, Ajay V., Maly, Douglas K., Chen, Kanghua, Jimenez, Gerardo
• Primary Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US11/010,561
• Publication Number:
  US 20050162875A1
• Time in Patent Office: 1,079 Days
• Field of Search: 361702-710, 361717-719, 361721-723, 361/801, 361/807, 361/820, 361/728, 361/746, 361/809, 361/812, 361/720, 257/678, 257/687, 257/690, 257/696, 257706-726, 257691-963, 257762-764, 257/770, 174/16.3, 174/52.1, 174/52.4, 174/15.1, 363/40, 363/55, 363/58, 363/132, 363/141, 363/131, 363144-147, 363/112, 363/149
• US Class Current: 361/676
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 wherein the control and power circuits of a power converter are arranged within the same casing

Abstract

Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Claims

1. A power converter, comprising:

a first phase terminal; and

at least two switch modules, each of the switch modules comprising;

a housing forming an interior compartment;

a conductive base plate;

a number of switches, each of the switches comprising a first active terminal, a second active terminal, and a control terminal, the first active terminals surface mounted to the conductive base plate;

a conductive member supported by the housing, the conductive member comprising at least one portion extending externally from the housing and at least one portion extending internally in the interior compartment of the housing; and

a number of wire bonds electrically coupling the second active terminal of the switches to the portion of the conductive member that extends internally in the interior compartment of the housing;

wherein the conductive base plate of a first one of the switch modules comprises an upright portion extending at an approximately right angle with respect to the respective conductive base plate, and the conductive member of a second one of the switch modules comprises an upright portion extending at an approximately right angle with respect to the respective conductive base plate, and wherein the upright portions of the first and the second ones of the switch modules are parallel to each other and are electrically connected to the first phase terminal.

2. The power converter of claim 1 wherein the housings of the first and the second ones of the switch modules are identical in shape.

3. The power converter of claim 1 wherein each of the switch modules further comprises:

an insulating substrate carried by the conductive base plate;

a conductive pattern carried by the insulating substrate, the insulating substrate electrically insulating the conductive pattern from the conductive base plate;

a number of resistors electrically coupled to the conductive pattern;

a terminal block comprising a number of terminals electrically coupled to the conductive pattern; and

a number of wire bonds electrically coupling the control terminals of the switches to the conductive pattern.

4. The power converter of claim 1 wherein the insulating substrate is centered in the interior compartment and the switches are arranged in two rows, one row on each of a pair of opposed sides of the insulating substrate.

5. The power converter of claim 1 wherein the portion of the conductive member extending externally from the housing is located proximate a first end of the housing, and wherein a portion of the conductive base plate is exposed at a second end of the housing, the second end of the housing opposite from the first end of the housing.

6. The power converter of claim 1 wherein the first phase terminal comprises an elongated metal structure, and further comprising:

a positive DC terminal which is elongated; and

a negative DC terminal which is elongated, the negative DC terminal closely spaced from and approximately parallel to the positive DC terminal, the positive and negative DC terminals approximately perpendicular to the first phase terminal.

7. The power converter of claim 1, further comprising:

at least two additional pairs of switch modules, a conductive base plate of a first one of the switch modules of each of the additional pairs comprising an upright portion extending at an approximately right angle with respect to the respective conductive base plate and a conductive member of a second one of the switch modules of each of the additional pairs comprising an upright portion extending at an approximately right angle with respect to the respective conductive base plate;

a second phase terminal electrically coupled to the first and second switch modules of one of the additional pairs of switch modules; and

a third phase terminal electrically coupled to the first and the second switch modules of another one of the additional pairs of switch modules.

8. A power converter, comprising:

at least a first switch module comprising;

a first housing of an electrically insulative material forming an interior and an exterior, the interior of the first housing open to the exterior at a first end and at a second end;

a first conductive base plate comprising a first surface and a second surface opposed to the first surface;

a first number of semiconductor switches each comprising a first active terminal, a second active terminal and a control terminal, the first active terminal of each of the first number of semiconductor switches surface mounted to the first surface of the first conductive base plate wherein the first conductive base plate is coupled to the first housing such that the first conductive base plate closes the opening at the second end of the first housing with the first number of semiconductor switches disposed in the interior of the first housing and the second surface of the first conductive base plate is exposed to the exterior of the first housing to transfer heat from the first housing;

a first conductive member supported by the first housing, the first conductive member comprising an exterior portion extending from the first housing into the exterior, a perimeter portion forming at least one shelf extending from the first housing into the interior of the first housing, and an upright portion extending upright with respect to the first surface of the first conductive base plate from the first housing into the exterior; and

a number of wire bonds electrically coupling the second active terminal of each of the first number of semiconductor switches to the shelf of the first conductive member;

at least a second switch module comprising;

a second housing of an electrically insulative material forming an interior and an exterior, the interior of the second housing open to the exterior at a first end and at a second end;

a second conductive base plate comprising a first surface, a second surface opposed to the first surface, and an upright portion extending upright with respect to the first surface of the second conductive base plate from the second housing into the exterior;

a second number of semiconductor switches each comprising a first active terminal, a second active terminal and a control terminal, the first active terminal of each of the second number of semiconductor switches surface mounted to the first surface of the second conductive base plate wherein the second conductive base plate is coupled to the second housing such that the second conductive base plate closes the opening at the second end of the second housing with the second number of semiconductor switches disposed in the interior of the second housing and the second surface of the second conductive base plate is exposed to the exterior of the second housing to transfer heat from the second housing;

a second conductive member supported by the second housing, the second conductive member comprising an exterior portion extending from the second housing into the exterior and a perimeter portion forming at least one shelf extending from the second housing into the interior of the second housing; and

a number of wire bonds electrically coupling the second active terminal of each of the second number of semiconductor switches to the shelf of the second conductive member; and

a first terminal, wherein the first conductive base plate of the first switch module and the second conductive member of the second switch module are electrically coupled to the first terminal.

9. The power converter of claim 8 wherein the second housing has a shape identical to a shape of the first housing.

10. The power converter of claim 8 wherein the first switch module further comprises:

a first insulating substrate carried by the first surface of the first conductive base plate;

a conductive pattern carried by the first insulating substrate, the first insulating substrate electrically insulating the conductive pattern from the first conductive base plate;

a number of resistors electrically coupled to the conductive pattern;

a terminal block comprising a number of terminals electrically coupled to the conductive pattern; and

a number of wire bonds electrically coupling the control terminals of the first number of semiconductor switches to the conductive pattern.

11. The power converter of claim 10 wherein the second switch module further comprises:

a second insulating substrate carried by the second surface of the second conductive base plate;

a conductive pattern carried by the second insulating substrate, the second insulating substrate electrically insulating the conductive pattern from the second conductive base plate;

a number of resistors electrically coupled to the conductive pattern;

a terminal block comprising a number of terminals electrically coupled to the conductive pattern; and

a number of wire bonds electrically coupling the control terminals of the second number of semiconductor switches to the conductive pattern.

12. The power converter of claim 8 wherein the upright portions of the conductive base plate and the conductive member each comprise a number of fingers formed at a distal end thereof, and further comprising:

a circuit board comprising at least one conductive trace electrically coupled to at least one of the number of fingers of at least one of the upright portions.

13. The power converter of claim 12, further comprising:

a number of capacitors carried by the circuit board and electrically coupled to at least one of the upright portions by the at least one conductive trace.

14. The power converter of claim 8 wherein a single phase of the power converter includes the first switch module, the second switch module, a third switch module and a fourth switch module.

15. The power converter of claim 8 wherein the first surface of the first conductive base plate is thermally coupled to the second surface of the first conductive base plate without an intervening thermally resistive material.

16. The power converter of claim 8 wherein the first conductive base plate consists of a plate of a metal.

17. The power converter of claim 8 wherein the first terminal is elongated, and further comprising:

a second terminal which is elongated; and

a third terminal which is elongated, the third terminal approximately parallel to the second terminal and approximately perpendicular to the first terminal.

18. The power converter of claim 17, further comprising:

a mounting plate formed from an electrically and thermally conductive material; and

a number of electrically non-conductive isolation pads electrically isolating the first and second conductive base plates from the mounting plate.

19. The power converter of claim 8 wherein the first insulating substrate and the first conductive pattern comprise two layers of either a direct bond copper substrate or a direct bond aluminum substrate.

20. The power converter of claim 8 wherein the first number of semiconductor switches comprises unpackaged bare silicon die transistors.