Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins
First Claim
1. A cooling apparatus comprising:
- a thermally conductive base having a main surface;
a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base, wherein each pin fin of the plurality of thermally conductive pin fins is bonded to the main surface of the thermally conductive base via a metallurgical diffusion bond of the pin fin to the main surface of the thermally conductive base, the plurality of thermally conductive pin fins being disposed to facilitate transfer of heat from the thermally conductive base; and
wherein the plurality of thermally conductive pin fins comprise a plurality of discrete, looped pin fins, each discrete, looped pin fin comprising a first end and a second end, and being separately wire-bonded at its first end and its second end to the main surface of the thermally conductive base employing a first metallurgical diffusion bond at its first end and a second metallurgical diffusion bond at its second end.
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Accused Products
Abstract
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.
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Citations
20 Claims
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1. A cooling apparatus comprising:
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a thermally conductive base having a main surface; a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base, wherein each pin fin of the plurality of thermally conductive pin fins is bonded to the main surface of the thermally conductive base via a metallurgical diffusion bond of the pin fin to the main surface of the thermally conductive base, the plurality of thermally conductive pin fins being disposed to facilitate transfer of heat from the thermally conductive base; and wherein the plurality of thermally conductive pin fins comprise a plurality of discrete, looped pin fins, each discrete, looped pin fin comprising a first end and a second end, and being separately wire-bonded at its first end and its second end to the main surface of the thermally conductive base employing a first metallurgical diffusion bond at its first end and a second metallurgical diffusion bond at its second end. - View Dependent Claims (2, 3, 5, 6)
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4. The cooling apparatus of claim I, wherein the thermally conductive base comprises a non-metallic structure and has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of an electronic device to be cooled by the cooling apparatus, the defined range being ±
- 1.5×
10−
61/K.
- 1.5×
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7. A cooled electronic module comprising:
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a substrate and at least one heat generating electronic device attached thereto; and a cooling apparatus for cooling the at least one heat generating electronic device, the cooling apparatus comprising; a plurality of thermally conductive pin fins wire-bonded to one of a surface of the at least one heat generating electronic device or a thermally conductive base coupled to a surface of the at least one heat generating electronic device, wherein each pin fin of the plurality of thermally conductive pin fins is bonded to the one of the surface of the at least one heat generating electronic device or the thermally conductive base coupled thereto via a metallurgical diffusion bond of the pin fin thereto, and wherein the plurality of thermally conductive pin fins are disposed to facilitate transfer of heat from the at least one heat generating electronic device; and wherein the plurality of thermally conductive pin fins comprise a plurality of discrete, looped pin fins, each discrete, looped pin fin comprising a first end and a second end, and being separately wire-bonded at its first end and its second end to the one of the surface of the at least one heat generating electronic device or the thermally conductive base coupled to the surface of the at least one heat generating electronic device employing a first metallurgical diffusion bond at its first end and a second metallurgical diffusion bond at its second end. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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15. A method of fabricating a cooling apparatus comprising:
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providing a thermally conductive base having a main surface; wire-bonding a plurality of thermally conductive pin fins to the main surface of the thermally conductive base, wherein each pin fin of the plurality of thermally conductive pin fins is bonded to the main surface of the thermally conductive base via a metallurgical diffusion bond of the pin fin to the main surface of the thermally conductive base, and wherein the plurality of thermally conductive pin fins are disposed across the main surface to facilitate transfer of heat from the thermally conductive base; and wherein the plurality of thermally conductive pin fins comprise a plurality of discrete, looped pin fins, each discrete, looped pin fin comprising a first end and a second end, and being separately wire-bonded at its first end and its second end to the main surface of the thermally conductive base employing a first metallurgical diffusion bond at its first end and a second metallurgical diffusion bond at its second end. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification