Wireless receiving device

• US 7,302,239 B2
• Filed: 01/27/2003
• Issued: 11/27/2007
• Est. Priority Date: 06/19/2002
• Status: Expired due to Fees

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Jitsuhara, Tsutomu
• Primary Examiner(s): Kelley; Chris
• Assistant Examiner(s): FUTEL, GAYLA S
• Application Number:
  US10/351,384
• Publication Number:
  US 20030236078A1
• Time in Patent Office: 1,765 Days
• Field of Search: 455/130, 455/296, 455/300, 455/301, 455/3.02, 455/550.1, 725/81, 725/85, 725/133, 725/141, 725/153, 725/131, 725/139, 725/151
• US Class Current: 455/130
• CPC Class Codes: H04B 1/40 Circuits
• CPC Class Codes: H04W 4/18 Information format or content conversion, e.g. adaptation by the network of the transmitted or received information for the purpose of wireless delivery to users or terminals
• CPC Class Codes: H04W 84/12 WLAN [Wireless Local Area Networks]
• CPC Class Codes: H04W 88/02 Terminal devices
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/0723 provided by an inner layer of PCB
• CPC Class Codes: H05K 2201/09972 Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently

Abstract

A wireless receiving device of the present invention is so arranged that (i) a high-frequency circuit section is provided on a front surface of a printed board and (ii) a digital video signal processing section and a wireless LAN digital signal processing section are provided on a back surface of the printed board. Further, an earth pattern is provided in a middle position between the front and back surfaces of the printed board, so that (i) the high-frequency circuit section and (ii) the digital video signal processing section and the wireless LAN digital signal processing section are shielded from one another using electromagnetic shielding by the earth pattern. Thus, when members that are commonly used for the wireless LAN and for wireless video reception are formed on a single printed board in order to reduce the size of the printed board, it is possible to effectively reduce the lowering of signal quality caused by the noise.

Claims

1. A wireless receiving device, comprising a printed board on which (a) a high-frequency circuit section for converting a received high-frequency signal into an analog signal, (b) an analog signal switching section for switching the analog signal from said high-frequency circuit section into first and second analog signals, (c) a first baseband processing circuit section for converting the first analog signal into a video data baseband signal, (d) a second baseband processing circuit section for converting the second analog signal into a wireless LAN baseband signal, (e) a digital video signal processing section for converting the baseband signal into a digital video signal, (f) a wireless LAN digital signal processing section for converting the baseband signal into a wireless LAN digital signal, and (g) an interface circuit section for outputting the digital video signal and the wireless LAN digital signal are provided,

said high-frequency circuit section being provided on a front surface of said printed board;

and

said digital video signal processing section and said wireless LAN digital signal processing section being provided on a back surface of said printed board.

2. The wireless receiving device as set forth in claim 1, wherein:

said analog signal switching section and said first baseband processing circuit section are further provided on said front surface of said printed board; and

said second baseband processing circuit section and said interface circuit section are further provided on said back surface of said printed board.

3. The wireless receiving device as set forth in claim 1, further comprising an antenna section provided on said printed board,

said antenna section being further provided on said front surface of said printed board.

4. The wireless receiving device as set forth in claim 1, wherein said printed board has a multilayer structure of three or more layers which are respectively indicated by a first layer, a second layer, . . . , and an n-th layer (n is a positive integer), where 2≦

a (an integer)≦

(n−

1), wherein;

an outer surface of the first layer is said front surface;

an earth pattern is formed at an a-th layer; and

an outer surface of the n-th layer is said back surface.

5. The wireless receiving device as set forth in claim 4, wherein:

at least one of layers, which are sandwiched between the a-th layer at which the earth pattern is formed and the n-th layer, is provided with a power supply pattern.

6. The wireless receiving device as set forth in claim 4, wherein:

at least one of layers, which are sandwiched between the a-th layer at which the earth pattern is formed and the n-th layer, is provided with a signal pattern of said digital video signal processing section and a signal pattern of said wireless LAN digital signal processing section.

7. The wireless receiving device as set forth in claim 1, wherein said printed board has a multilayer structure of three or more layers which are respectively indicated by a first layer, a second layer, . . . , and an n-th layer (n is a positive integer), where 2≦

b (an integer)≦

(n−

1), wherein;

an outer surface of the first layer is said front surface;

a power supply pattern is formed at a b-th layer; and

an outer surface of the n-th layer is said back surface.

8. The wireless receiving device as set forth in claim 1, wherein said printed board has a multilayer structure of three or more layers which are respectively indicated by a first layer, a second layer, . . . , and an n-th layer (n is a positive integer), where 2≦

c (an integer)≦

(n−

1), wherein;

an outer surface of the first layer is said front surface;

a signal pattern of said high-frequency circuit section is formed at a c-th layer; and

an outer surface of the n-th layer is said back surface.

9. The wireless receiving device as set forth in claim 1, wherein said interface circuit section is provided on said back surface of said printed board, said printed board having a multilayer structure of three or more layers which are respectively indicated by a first layer, a second layer, . . . , and an n-th layer (n is a positive integer), where 2≦

d (an integer)≦

(n−

1), wherein;

an outer surface of the first layer is said front surface;

a signal pattern of said interface circuit section is formed at a d-th layer; and

an outer surface of the n-th layer is said back surface.

10. The wireless receiving device as set forth in claim 1, wherein said printed board has a multilayer structure of three or more layers which are respectively indicated by a first layer, a second layer, . . . , and an n-th layer (n is a positive integer), where 2≦

e (an integer)≦

(n−

1), wherein;

an outer surface of the first layer is said front surface;

a signal pattern of said digital video signal processing section and a signal pattern of said wireless LAN digital signal processing section are formed at an e-th layer; and

an outer surface of the n-th layer is said back surface.

11. The wireless receiving device as set forth in claim 1, wherein said printed board has a multilayer structure of three or more layers, wherein:

an earth pattern, a power supply pattern, a signal pattern of said high-frequency circuit section, and a signal pattern of said interface circuit section are respectively formed at different layers.

12. The wireless receiving device as set forth in claim 1, wherein said printed board has a multilayer structure of three or more layers, and

the layers are respectively separated by an insulation layer.

13. The wireless receiving device as set forth in claim 1, wherein said printed board has a multilayer structure of three or more layers which are respectively indicated by a first layer, a second layer, . . . , and an n-th layer (n is a positive integer), wherein:

the first through n-th layers are made of metal.