Method of fabricating a rat's nest RFID antenna

• US 7,302,751 B2
• Filed: 04/30/2004
• Issued: 12/04/2007
• Est. Priority Date: 04/30/2004
• Status: Expired due to Fees

• Current Assignee: Round Rock Research LLC
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Hamburgen, William
• Primary Examiner(s): Trinh; Minh
• Application Number:
  US10/837,336
• Publication Number:
  US 20050241146A1
• Time in Patent Office: 1,313 Days
• Field of Search: 29825-834, 298/55, 298/58, 296/00, 296/01, 296/021, 340/572.7, 340/572.8, 340/572.5, 343/872, 343/873, 834/95, 834/77, 235/492, 235/462, 235/13
• US Class Current: 29/600
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/48699 Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
• CPC Class Codes: H01L 2224/48799 Principal constituent of the connecting portion of the wire connector being Copper (Cu)
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A method of fabricating a radio frequency identification (RFID) antenna on a substrate is disclosed. The antenna is fabricated on a substrate that includes already fabricated RFID chips. The substrate is connected with a carrier substrate and singulated to separate the plurality of RFID chips into a plurality of diesites. The antenna is connected to a RFID chip in an assembly order to form an a RFID tag. The method is repeated such that each successively connected antenna overlaps a previously connected antenna.

Claims

1. A method of fabricating an antenna on a substrate including a plurality of previously fabricated RFID chips, comprising:

connecting the substrate with a carrier substrate;

singulating the substrate to separate the plurality of RFID chips into a plurality of diesites;

connecting in an assembly order, the antenna with a selected RFID chip to form a RFID tag; and

repeating the connecting of another antenna with another RFID chip in the assembly order with each successively connected antenna overlapping a previously connected antenna.

2. The method as set forth in claim 1 and further comprising:

removing each RFID tag from the carrier substrate in a disassembly order.

3. The method as set forth in claim 2, wherein the disassembly order is opposite the assembly order.

4. The method as set forth in claim 2, wherein the removing comprises heating a selected one of the substrate, the carrier substrate, or the substrate and the carrier substrate to effectuate the removing of each RFID tag from the carrier substrate.

5. The method as set forth in claim 2, wherein the removing comprises using a pick-and-place machine to remove the RFID tag from the carrier substrate.

6. The method as set forth in claim 5 and further comprising:

using the pick-and-place machine to attach the RFID tag to a host object.

7. The method as set forth in claim 2 and further comprising after the removing:

encapsulating the RFID tag.

8. The method as set forth in claim 2 and further comprising after the removing:

attaching the RFID tag with a host object.

9. The method as set forth in claim 8 and further comprising after the attaching:

encapsulating the RFID tag.

10. The method as set forth in claim 1, wherein the connecting the substrate with the carrier substrate comprises a selected one of adhesively connecting the substrate with the carrier substrate or gluing the substrate and the carrier substrate to each other.

11. The method as set forth in claim 10, wherein the adhesively connecting comprises connecting the substrate with the carrier substrate using a layer of a double sided adhesive material.

12. The method as set forth in claim 1, wherein the connecting the antenna comprises electrically connecting a first node of the antenna with a first node of the RFID chip and electrically connecting a second node of the antenna with a second node of the RFID chip.

13. The method as set forth in claim 12, wherein the connecting comprises using a wire bonding machine to connect the first and second nodes of the antenna with the first and second nodes of the RFID chip.

14. The method as set forth in claim 1, wherein the antenna is a loop antenna.

15. The method as set forth in claim 1, wherein after the connecting, the antenna is positioned entirely within a quadrant defined by a diesite corner.

16. The method as set forth in claim 15, wherein the antenna includes a first portion positioned inside a perimeter of the AFID chip and opposite the quadrant defined by the diesite corner and a second portion positioned outside the perimeter of the RFID chip the antenna is connected with, and the second portion includes an area that is greater than an area of the RFID chip.

17. The method as set forth in claim 1, wherein a selected one of a shape of the antenna, a size of the antenna, or a shape of the antenna and a size of the antenna varies among the diesites.