Print assembly for a wide format pagewidth printer
First Claim
1. A print assembly for a wide format printer, the print assembly comprisinga plurality of printhead modules, each of the plurality of printhead modules incorporating a printhead chip and an elongate carrier that is mountable on a support structure of the printer in an operative position with respect to a platen of the wide format printer andthe plurality of modules together incorporating at least fifty thousand nozzle arrangements, the printhead chip of each of the plurality of modules being positioned so that the printhead chips are capable of ejecting ink drops into a printing zone defined by the platen;
- and,a flexible printed circuit board (PCB) that is also positioned on each of the plurality of printhead modules and that is configured to control operation of the printhead chips;
wherein each printhead chip is the product of an integrated circuit fabrication process, and each printhead chip includes a wafer substrate and a CMOS drive circuitry layer positioned on the water substrate with the nozzle arrangements positioned on the wafer substrate and the CMOS drive circuitry layer.
4 Assignments
0 Petitions
Accused Products
Abstract
A print assembly (14) for a wide format printer (10) includes a carrier (187) that is mountable on a support structure (12) of the wide format printer (10) in an operative position with respect to a platen (106) of the wide format printer (10). A number of printhead chips (186) are positioned on the carrier (187), the printhead chips (186) together incorporating at least fifty thousand nozzle arrangements (210). The printhead chips (186) are positioned so that the printhead chips (186) are capable of ejecting ink drops into a printing zone (120) defined by the platen (106). Control circuitry (190) is also positioned on the carrier (187) and is configured to control operation of the printhead chips (186).
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Citations
8 Claims
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1. A print assembly for a wide format printer, the print assembly comprising
a plurality of printhead modules, each of the plurality of printhead modules incorporating a printhead chip and an elongate carrier that is mountable on a support structure of the printer in an operative position with respect to a platen of the wide format printer and the plurality of modules together incorporating at least fifty thousand nozzle arrangements, the printhead chip of each of the plurality of modules being positioned so that the printhead chips are capable of ejecting ink drops into a printing zone defined by the platen; - and,
a flexible printed circuit board (PCB) that is also positioned on each of the plurality of printhead modules and that is configured to control operation of the printhead chips; wherein each printhead chip is the product of an integrated circuit fabrication process, and each printhead chip includes a wafer substrate and a CMOS drive circuitry layer positioned on the water substrate with the nozzle arrangements positioned on the wafer substrate and the CMOS drive circuitry layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A wide format printer that comprises
a support structure; -
a print assembly positioned on the support structure, the print assembly comprising a plurality of printhead modules, each of the plurality of printhead modules incorporating a printhead chip and a carrier that is mounted in an operative position with respect to a platen of the wide format printer, the plurality of modules together incorporating at least fifty thousand nozzle arrangements, the printhead chip of each of the plurality of modules being positioned so that the printhead chips are capable of ejecting ink drops into a printing zone defined by the platen; a flexible printed circuit board (PCB) that is also positioned on each of the plurality of modules and that is configured to control operation of the printhead chips; and
,a media feed mechanism positioned on the support structure to feed media into the print assembly; wherein each printhead chip is the product of an integrated circuit fabrication process and each printhead chip includes a wafer substrate and a CMOS drive circuitry layer positioned on the wafer substrate with the nozzle arrangements positioned on the wafer substrate and the CMOS drive circuitry layer.
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Specification