Ink jet printhead chip with predetermined micro-electromechanical systems height
First Claim
1. An inkjet printhead chip comprising:
- a wafer substrate,a CMOS drive circuitry layer positioned on the wafer substrate, anda plurality of nozzle arrangements, each having a chamber for containing ink, an ink ejection port and a thermal bend actuator electrically connected to, and spaced from, the CMOS drive circuitry layer such that actuation of the thermal bend actuator causes it to move relative to the wafer substrate and thereby eject ink through the ink ejection port;
wherein,in its quiescent state, the thermal bend actuator is spaced between 2 microns and 15microns from the CMOS drive circuitry layer.
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Accused Products
Abstract
An inkjet printhead chip includes a wafer substrate (12). A CMOS drive circuitry layer is positioned on the wafer substrate. A plurality of nozzle arrangements is positioned on the wafer substrate and the CMOS drive circuitry layer. Each nozzle arrangement includes nozzle chamber walls and a roof wall that define a nozzle chamber and an ink ejection port (35) defined in the roof wall. A micro-electromechanical actuator (14) is connected to the CMOS drive circuitry layer. The actuator has at least one movable member (14) that is positioned to act on ink in the nozzle chamber to eject the ink from the ink ejection port on receipt of a signal from the drive circuitry layer. The movable member is spaced between 2 microns and 15 microns from the CMOS drive circuitry layer.
13 Citations
6 Claims
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1. An inkjet printhead chip comprising:
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a wafer substrate, a CMOS drive circuitry layer positioned on the wafer substrate, and a plurality of nozzle arrangements, each having a chamber for containing ink, an ink ejection port and a thermal bend actuator electrically connected to, and spaced from, the CMOS drive circuitry layer such that actuation of the thermal bend actuator causes it to move relative to the wafer substrate and thereby eject ink through the ink ejection port;
wherein,in its quiescent state, the thermal bend actuator is spaced between 2 microns and 15microns from the CMOS drive circuitry layer. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification