Chemical mechanical polishing apparatus with rotating belt

• US 7,303,467 B2
• Filed: 09/12/2006
• Issued: 12/04/2007
• Est. Priority Date: 02/04/1999
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: White, John M., Birang, Manoocher, Somekh, Sasson, Rosenberg, Lawrence M.
• Primary Examiner(s): NGUYEN, DUNG V
• Application Number:
  US11/531,272
• Publication Number:
  US 20070021043A1
• Time in Patent Office: 448 Days
• Field of Search: 451/296, 451285-290, 451/398, 451/301, 451/307, 451/490
• US Class Current: 451/296
• CPC Class Codes: B24B 21/004 using abrasive rolled strips
• CPC Class Codes: B24B 21/008 Machines comprising two or more tools or having several working posts B24B21/006 takes precedence
• CPC Class Codes: B24B 21/04 for grinding plane surfaces
• CPC Class Codes: B24B 27/0023 grinding machines with a plurality of working posts
• CPC Class Codes: B24B 37/04 designed for working plane surfaces
• CPC Class Codes: B24B 37/16 characterised by the shape of the lapping plate surface, e.g. grooved
• CPC Class Codes: B24B 37/24 characterised by the composition or properties of the pad materials
• CPC Class Codes: B24B 37/245 Pads with fixed abrasives
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: B24D 7/12 with apertures for inspecting the surface to be abraded
• CPC Class Codes: H01L 21/30625 With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Abstract

A chemical mechanical polishing apparatus has a movable platen, a drive mechanism and a chucking mechanism. The drive mechanism is attached to the platen, is configured to support a generally linear polishing sheet with a portion of the polishing sheet extending over the platen, and is configured to incrementally advance the polishing sheet in a linear direction relative to the platen. The chucking mechanism is configured to intermittently secure the portion of the polishing sheet to the platen.

Claims

1. A chemical mechanical polishing apparatus, comprising:

a movable platen;

a drive mechanism attached to the platen and configured to support a generally linear polishing sheet with a portion of the polishing sheet extending over the platen, the drive mechanism configured to incrementally advance the polishing sheet in a linear direction relative to the platen; and

a chucking mechanism to intermittently secure the portion of the polishing sheet to the platen.

2. The apparatus of claim 1, further comprising a carrier head to hold a substrate.

3. The apparatus of claim 2, further comprising a carrier head drive motor to rotate the carrier head.

4. The apparatus of claim 2, wherein the drive mechanism is configured to support a generally linear polishing sheet having a width greater than a diameter of the substrate.

5. The apparatus of claim 1, wherein the chucking mechanism includes a vacuum source and at least one passage extending through the platen to apply vacuum to an underside of the polishing sheet.

6. The apparatus of claim 5, further comprising a channel formed in a top surface of the platen, the channel connected to the passage.

7. The apparatus of claim 6, wherein the channel extends along edges of the platen.

8. The apparatus of claim 1, wherein the chucking mechanism includes a clamp to clamp edges of the polishing sheet to the platen.

9. The apparatus of claim 1, wherein the platen is rectangular.

10. The apparatus of claim 1, wherein the drive mechanism is configured to support a feed roller and a take-up roller with the polishing sheet extending between the feed roller and the take-up roller.

11. The apparatus of claim 10, wherein the drive mechanism is configured to permit rotation of the feed roller and take-up roller.

12. The apparatus of claim 11, wherein the drive mechanism is configured to rotate the take-up roller to incrementally advance the polishing sheet.

13. The apparatus of claim 10, wherein the drive mechanism is configured to support the feed roller and the take-up roller below the top surface of the platen.

14. The apparatus of claim 10, further comprising a guard to prevent contamination of an unused portion of the polishing sheet.

15. The apparatus of claim 14, wherein the guard includes a frame positioned to cover the feed roller and be spaced from the polishing sheet by a gap, and further comprising a source of pressurized gas to direct gas through the gap.

16. The apparatus of claim 1, wherein the platen is rotatable.