Transducer arrays with an integrated sensor and methods of use

• US 7,303,530 B2
• Filed: 05/22/2003
• Issued: 12/04/2007
• Est. Priority Date: 05/22/2003
• Status: Active Grant

• Current Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Original Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Inventors: Bolorforosh, Mirsaid, Barnes, Stephen R.
• Primary Examiner(s): IMAM, ALI M
• Application Number:
  US10/443,257
• Publication Number:
  US 20040236223A1
• Time in Patent Office: 1,657 Days
• Field of Search: 600437-472, 73570-579, 736/25, 736/26, 735/97, 374/100, 374/117, 601/2, 601/3, 367/7, 367/11, 367/130, 367/138, 29/253.5, 310330-334
• US Class Current: 600/459
• CPC Class Codes: A61B 2562/02 Details of sensors specially adapted for in-vivo measurements
• CPC Class Codes: A61B 2562/028 Microscale sensors, e.g. electromechanical sensors [MEMS]
• CPC Class Codes: A61B 5/0048 Detecting, measuring or recording by applying mechanical forces or stimuli A61B5/021, A61B5/4884 and A61B9/00 take precedence
• CPC Class Codes: A61B 5/01 Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue clinical contact thermometers G01K13/20
• CPC Class Codes: A61B 5/14539 for measuring pH
• CPC Class Codes: A61B 5/14542 for measuring blood gases A61B5/14551 takes precedence
• CPC Class Codes: A61B 5/441 Skin evaluation, e.g. for skin disorder diagnosis
• CPC Class Codes: A61B 7/003 Detecting lung or respiration noise
• CPC Class Codes: A61B 7/04 Electric stethoscopes microphones, acoustic transducers therefor H04R
• CPC Class Codes: A61B 8/00 Diagnosis using ultrasonic, sonic or infrasonic waves imaging of objects using sonar G01S15/00
• CPC Class Codes: A61B 8/04 Measuring blood pressure
• CPC Class Codes: A61B 8/06 Measuring blood flow measuring volume flow in general G01F, e.g. G01F1/66, G01F1/72; measuring speed of fluids in general G01P5/00
• CPC Class Codes: A61B 8/0833 involving detecting or locating foreign bodies or organic structures
• CPC Class Codes: A61B 8/12 in body cavities or body tracts, e.g. by using catheters catheters per se A61M25/00
• CPC Class Codes: A61B 8/4245 involving determining the position of the probe, e.g. with respect to an external reference frame or to the patient
• CPC Class Codes: A61B 8/4254 using sensors mounted on the probe
• CPC Class Codes: A61B 8/4483 characterised by features of the ultrasound transducer
• CPC Class Codes: A61B 8/4494 characterised by the arrangement of the transducer elements devices for short-range imaging using particular transducer elements arrangements under G01S15/8909; arrangements of transducers in generation of mechanical vibrations of infrasonic, sonic or ultrasonic frequency B06B1/0607
• CPC Class Codes: A61B 8/485 involving measuring strain or elastic properties
• CPC Class Codes: A61B 8/546 involving monitoring or regulation of device temperature
• CPC Class Codes: B06B 1/0292 : Electrostatic transducers, e.g. electret-type

Abstract

Methods and systems for obtaining ultrasound and sensing other patient characteristics are provided from summary. One or more sensors are provided in a same transducer probe as an array of elements. For example, sensors are formed on a same semiconductor substrate, such as a silicon substrate, as microelectromechanical devices or a capacitive membrane ultrasonic transducer (CMUT). As another example, a sensor is provided separate from or attached to transducer materials. Possible sensors include temperature, pressure, microphone, chemical and/or other sensors.

Claims

1. A transducer probe for ultrasound detection, the transducer probe comprising:

a probe housing;

an imaging array of transducer elements connected with the probe housing, the transducer elements being on or within a substrate; and

a temperature sensor integrated on or within the substrate.

2. The probe of claim 1 wherein the transducer elements comprise a capacitive membrane ultrasonic transducer and the substrate comprises a semiconductor substrate.

3. The probe of claim 2 wherein the temperature sensor comprises a microelectromechanical device formed on the semiconductor substrate.

4. The probe of claim 2 wherein the temperature sensor comprises at least in part an integrated circuit component on the semiconductor substrate.

5. The probe of claim 1 wherein the temperature sensor is integrated between at least two of the transducer elements.

6. The probe of claim 1 wherein the temperature sensor is positioned to measure a temperature of the probe housing.

7. The probe of claim 1 wherein the temperature sensor is positioned to measure a temperature of a subject being examined.

8. The probe of claim 1 wherein the temperature sensor integrated on or within the substrate comprises the temperature sensor formed on or within the substrate.

9. The probe of claim 8 wherein the temperature sensor is formed on the substrate.

10. The probe of claim 8 wherein the temperature sensor is formed within the substrate.