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Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same

  • US 7,303,987 B2
  • Filed: 04/02/2002
  • Issued: 12/04/2007
  • Est. Priority Date: 04/26/2001
  • Status: Expired due to Term
First Claim
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1. A method of forming a wiring line contact structure, the method comprising:

  • forming a wiring line assembly having a first a conductive layer on a surface of a substrate, wherein the first conductive layer has at least two layers having the same planar shape and a sidewall that is inclined relative to the surface;

    depositing an insulating layer onto the wiring line assembly such that the insulating layer covers the wiring line assembly;

    patterning the insulating layer to thereby form a contact hole exposing the sidewall of the wiring line assembly; and

    ,forming a second conductive layer such that the second conductive layer contacts the sidewall of the wiring line assembly through the contact hole.

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