Infrared sensor having no package can

• US 7,304,304 B2
• Filed: 12/13/2005
• Issued: 12/04/2007
• Est. Priority Date: 01/14/2005
• Status: Expired due to Fees

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Yamauchi, Shigenori, Mizuno, Tiaki
• Primary Examiner(s): Hannaher; Constantine
• Application Number:
  US11/299,726
• Publication Number:
  US 20060157651A1
• Time in Patent Office: 721 Days
• Field of Search: 250/338.1
• US Class Current: 250/338.1
• CPC Class Codes: G01J 5/04 Casings
• CPC Class Codes: G01J 5/045 Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements getter arrangements per se H01L23/26 and H01L21/3221
• CPC Class Codes: G01J 5/08 Optical arrangements
• CPC Class Codes: G01J 5/0802 Optical filters
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10155 being other than a cuboid
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

An infrared sensor is composed of an optical filter plate, an infrared-detecting plate and a supporting member positioned between both plates. A detecting element for detecting infrared rays passing through the optical filter plate is formed on a front surface of the infrared-detecting plate facing the optical filter plate. The supporting member is positioned to surround the detector element on the infrared-detecting plate to firmly connect both plates and to form a predetermined gap between both plates. The supporting member may be composed of a number of discrete dots positioned to surround the detector element or of a continuous ring surrounding the detector element.

Claims

1. An infrared sensor comprising:

an optical filter plate that allows selected infrared rays to pass therethrough;

an infrared-detecting plate having a detector element that detects the infrared rays passing through the optical filter plate; and

a supporting member, disposed between the optical filter plate and the infrared-detecting plate, for connecting the optical filter plate and the infrared-detecting plate and for forming a predetermined gap between both plates, the supporting member being made of solder and positioned to surround the detector element on the infrared-detecting plate.

2. The infrared sensor as in claim 1, wherein:

the infrared-detecting plate has a front surface facing the optical filter plate and a rear surface on which a depressed portion is formed, thereby forming a thin membrane on the front surface on which the detector element is disposed.

3. The infrared sensor as in claim 1, further including a substrate on which the infrared-detecting plate is mounted, wherein:

the infrared sensor is entirely covered with insulating resin, except a front surface of the optical filter plate, from which the infrared rays enter, and the substrate.

4. The infrared sensor as in claim 3, wherein:

the infrared-detecting plate is electrically connected to the substrate through bonding wires which are covered with the insulating resin.

5. The infrared sensor as in claim 1, wherein:

the supporting member is composed of a number of discrete dots.

6. The infrared sensor as in claim 1, wherein:

the supporting member is composed of a continuous line surrounding the detector element.

7. The infrared sensor as in claim 1, wherein the solder of the supporting member includes lead and tin.

8. The infrared sensor as in claim 1, wherein the lead-free solder alloy of the supporting member includes one of Sn—

Ag, Sn—

Bi, Sn—

Zn and Sn—

Cu.

9. An infrared sensor comprising:

an optical filter plate that allows selected infrared rays to pass therethrough;

an infrared-detecting plate having a detector element that detects the infrared rays passing through the optical filter plate; and

a supporting member disposed between the optical filter plate and the infrared-detecting plate for connecting the optical filter plate and the infrared-detecting plate and forming a predetermined gap between the optical filter plate and the infrared-detecting plate, wherein the supporting member is made of solder to electrically connect the optical filter plate to the infrared-detecting plate, wherein the supporting member is positioned to surround the detector element on the infrared-detecting plate.

10. An infrared sensor comprising:

an optical filter plate that allows selected infrared rays to pass therethrough;

an infrared-detecting plate having a detector element that detects the infrared rays passing through the optical filter plate; and

a supporting member disposed between the optical filter plate and the infrared-detecting plate for connecting the optical filter plate and the infrared-detecting plate and forming a predetermined gap between the optical filter plate and the infrared-detecting plate, wherein the supporting member is made of a lead-free solder alloy to electrically connect the optical filter plate to the infrared-detecting plate, wherein the supporting member is positioned to surround the detector element on the infrared-detecting plate.