Package and method for attaching an integrated heat spreader

• US 7,304,381 B2
• Filed: 08/02/2006
• Issued: 12/04/2007
• Est. Priority Date: 05/28/2003
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Rumer, Christopher L., Skeete, Oswald L., Houle, Sabina J., Wienrich, Jeff R., Reiter, Mike T.
• Primary Examiner(s): Zarneke; David A.
• Application Number:
  US11/461,803
• Publication Number:
  US 20060267182A1
• Time in Patent Office: 489 Days
• Field of Search: 257/706, 257/712, 257/713, 257/717, 257/718
• US Class Current: 257/717
• CPC Class Codes: H01L 2023/4062 heatsink to or through board or cabinet
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/40 Mountings or securing means for detachable cooling or heating arrangements heating H01L23/345; fixed by friction, plugs or springs
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16251 Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19106 in a mirrored arrangement on two different side of a common die mounting substrate

Abstract

In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.

Claims

1. An integrated circuit package comprising:

a substrate that includes a top side and a bottom side;

a die mounted to the top side of the substrate;

a heat spreader thermally coupled to the die;

a standoff that includes an upper surface which engages the heat spreader and a lower surface that is adhered to the top side of the substrate, the standoff including an opening that extends into the standoff from the upper surface of the standoff and a cavity that extends into the standoff from the lower surface of the standoff, the cavity being wider than the opening in the standoff and aligned with the opening in the standoff; and

a fastener that secures the standoff to the heat spreader, the fastener including a first portion the extends through the opening in the standoff and a second portion that fits within the cavity in the standoff but is unable to fit within the opening in the standoff.

2. The package of claim 1 further comprising pins attached to a bottom side of the substrate.

3. The package of claim 1 wherein the fastener is a rivet.

4. The package of claim 3 wherein the second portion of the fastener is a head of the rivet.

5. The package of claim 1 further comprising a thermal interface material between the die and the heat spreader.

6. The package of claim 1 wherein the standoff is adhered to the top side of the substrate using an adhesive.

7. The package of claim 1 wherein the heat spreader includes a central region and a perimeter region such that the standoff engages the perimeter region of the heat spreader.

8. The package of claim 7 wherein the perimeter region of the heat spreader has a thickness that is less than a thickness of the central region.

9. The package of claim 8 wherein the fasteners extend through a hole in the perimeter region of the heat spreader.

10. The package of claim 1 wherein the cavity in the standoff is a counter-bored hole.

11. The package of claim 1 wherein the fastener is at least partially positioned within a recess in an upper side of the heat spreader such that the fastener is below the upper side of the heat spreader.

12. The package of claim 1 wherein the first portion of the fastener includes a barbed connector that is embedded in the heat spreader and the second portion of the fastener includes a gripping receiver.

13. The package of claim 12 wherein the gripping receiver is a retaining ring.

14. The package of claim 12 wherein the barbed connector extends at least partially into an opening in the substrate.

15. The package of claim 1 wherein the first portion of the fastener includes a barbed connector that extends through an opening in the heat spreader.

16. The package of claim 1 further comprising a plurality of fasteners that secure the standoff to the heat spreader, wherein the standoff includes a plurality of elements such that each element is secured to the heat spreader by one of the fasteners.

17. A system comprising:

a circuit board; and

an integrated circuit (IC) package mounted on the circuit board, the integrated circuit package including a substrate that includes a top side and a bottom side and a die that is mounted to the top side of the substrate, the integrated circuit package further including a heat spreader that is thermally coupled to the die and a standoff that includes an upper surface which engages the heat spreader and a lower surface that is adhered to the top side of the substrate, the standoff including an opening that extends into the standoff from the upper surface of the standoff and a cavity that extends into the standoff from the lower surface of the standoff, the cavity being wider than the opening in the standoff and aligned with the opening in the standoff, the integrated circuit package further including a fastener that secures the standoff to the heat spreader, the fastener including a first portion the extends through the opening in the standoff and a second portion that fits within the cavity in the standoff but is unable to fit within the opening in the standoff.

18. The system of claim 17 wherein the second portion of the fastener is a head of a rivet such that the head of the rivet is positioned within the cavity in the lower surface of the standoff.

19. The system of claim 17 further comprising a thermal interface material between the die and the heat spreader in the integrated circuit package.

20. The system of claim 17 wherein the integrated circuit package is connected to the circuit board by solder balls.

21. The system of claim 17 wherein the circuit board includes a socket and the integrated circuit package includes lead pins that extend from the bottom side of the substrate such that the lead pins are inserted into the socket.

22. The system of claim 17 wherein the standoff is adhered to the top side of the substrate using an adhesive.

23. The system of claim 17 wherein the heat spreader includes a central region and a perimeter region such that the standoff engages the perimeter region of the heat spreader, the perimeter region of the heat spreader having a thickness that is less than a thickness of the central region such that the fasteners extend through a hole in the perimeter region of the heat spreader.

24. The system of claim 17 wherein the cavity in the standoff is a counter-bored hole.

25. The package of claim 17 wherein the fastener is at least partially positioned within a recess in an upper side of the heat spreader such that the fastener is below the upper side of the heat spreader.