Method and machine for replicating holographic gratings on a substrate

• US 7,306,827 B2
• Filed: 07/23/2002
• Issued: 12/11/2007
• Est. Priority Date: 10/30/2000
• Status: Active Grant

• Current Assignee: X-Body Incorporated (Bristol-Myers Squibb Company)
• Original Assignee: Sru Biosystems Incorporated
• Inventors: Borsody, Alex, Li, Peter Y., Qiu, Jean
• Primary Examiner(s): FLETCHER III, WILLIAM P
• Application Number:
  US10/201,818
• Publication Number:
  US 20030017581A1
• Time in Patent Office: 1,967 Days
• Field of Search: 427/264
• US Class Current: 427/264
• CPC Class Codes: B01L 3/5085 for multiple samples, e.g. microtitration plates
• CPC Class Codes: G01N 21/253 for batch operation, i.e. multisample apparatus analytical automats G01N35/00
• CPC Class Codes: G01N 21/4788 Diffraction for sizing particles G01N15/0205
• CPC Class Codes: G01N 21/7743 the reagent-coated grating coupling light in or out of the waveguide
• CPC Class Codes: G01N 33/54373 involving physiochemical end-point determination, e.g. wave-guides, FETS, gratings
• CPC Class Codes: G02B 5/1809 with pitch less than or comparable to the wavelength

Abstract

A machine and process for a pattern, such as a submicron grating pattern onto a substrate.

Claims

1. A method for replicating a colorimetric resonant reflectance sensor grating pattern, the method comprising:

(a) advancing a substrate supply roll until a substrate roll section is produced;

(b) applying a liquid between the substrate roll section and a tool having the pattern to form a substrate roll section with a liquid layer;

(c) rolling a shuttle mechanism having a pressure roller such that the substrate roll section with the liquid layer is rolled between the pressure roller and the tool, wherein the shuttle mechanism advances in a direction to cover the tool with the substrate roll section with a liquid layer while the substrate supply roll remains stationary,

(d) wherein the pattern on the tool is transferred to the liquid layer to create a pattern coated substrate;

(e) hardening the pattern coated substrate to form a cured pattern substrate;

(f) detaching the cured pattern substrate from the tool by retracting the shuttle mechanism while the substrate supply roll remains stationary;

(g) depositing a dielectric film on the cured pattern substrate.

2. The method of claim 1 wherein detaching the cured pattern substrate from the tool is by peeling the cured pattern substrate from the tool.

3. The method of claim 2 wherein peeling the cured pattern substrate from the tool is by unrolling the pressure roller as the shuttle mechanism retracts, wherein the cured pattern substrate is lifted by the pressure roller as the shuttle mechanism retracts.

4. The method of claim 1 wherein the tool comprises a master wafer having a master wafer grating pattern.

5. The method of claim 4 wherein the master wafer grating pattern is substantially flat and wherein the shuttle mechanism advances and retracts substantially in a plane.

6. The method of claim 4 wherein the master wafer grating pattern is curved and wherein the shuttle mechanism advances and retracts by following the curved master wafer.

7. The method of claim 4 wherein the master wafer is a master silicon wafer.

8. The method of claim 1 wherein the liquid is selected from the group consisting of an epoxy, a polymer, a cement solvent free radiation addition polymerizable crosslinikable material and a resin.

9. The method of claim 8 wherein the crosslinikable material is an acrylate epoxy ureathane based material.

10. The method of claim 1 wherein hardening the pattern coated substrate comprises exposing the pattern coated substrate to an electron beam, ultraviolet light or heat.

11. The method of claim 1 wherein the substrate supply roll comprises a substrate material selected from the group consisting of glass, plastic, polycarbonate, polyester, polyurethane, epoxy, metal, paper, composite plastic and glass, composite plastic and metal, and composite plastic and paper.

12. The method of claim 11 wherein the substrate material comprises at least one liner.

13. The method of claim 12 comprising removing the at least one liner from the substrate material as the substrate roll is advanced.

14. The method of claim 1 comprising:

advancing the cured pattern substrate onto a take-up spool to form a cured substrate roll while the shuttle mechanism remains stationary.

15. The method of claim 1 wherein the pattern has a periodic spacing wherein the spacing is between 0.1 microns to 2.0 microns.

16. The method of claim 1, wherein the pattern is a submicron grating pattern.

17. The method of claim 1 wherein the pattern has a periodic spacing wherein the spacing is between 0.2 microns to 0.6 microns.

18. The method of claim 14 wherein the dielectric film is deposited on the cured pattern substrate before the cured pattern is advanced onto a take-up spool.

19. The method of claim 14 wherein the dielectric film is deposited on the cured pattern substrate after the cured pattern is advanced onto a take-up spool.

20. The method of claim 1 wherein (a) through (g) are repeated on a next substrate roll section.