Cooling airflow distribution device

• US 7,309,279 B2
• Filed: 07/12/2005
• Issued: 12/18/2007
• Est. Priority Date: 05/16/2001
• Status: Expired due to Fees

• Current Assignee: Sanmina-SCI Corporation
• Original Assignee: Sanmina-SCI Corporation
• Inventors: Hudz, Andrew, Sharp, Anthony C., Jeffery, Peter
• Primary Examiner(s): BOLES, DEREK
• Application Number:
  US11/179,374
• Publication Number:
  US 20050250435A1
• Time in Patent Office: 889 Days
• Field of Search: 454/184, 454/195, 361/695, 361/696, 165/122, 165/80.2, 165/104.33, 165/104.34, 312/236
• US Class Current: 454/184
• CPC Class Codes: H05K 7/20754 Air circulating in closed loop within cabinets

Abstract

A system for removing heat from a plurality of electronic assemblies including a cabinet having brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path and a second vertical air flow path of the cabinet, and a plinth underlying the cabinet and having an input port receiving air from the first vertical airflow path of the cabinet, an output port transmitting air to the second vertical air flow path, a heat exchanger positioned in an air flow path extending between the input and the output ports, and a fan assembly for driving air through the heat exchanger and towards the input port. The system further includes at least one air flow distribution device establishing a predetermined flow rate distribution through electronic assemblies supported by the brackets.

Claims

1. A cabinet for supporting electronic assemblies, comprising:

A. a base,

B. a top panel vertically spaced from said base,

C. a front panel, a back panel and two side panels extending between said top panel and said base, and defining an interior region for containing said electronic assemblies,

D. a bracket assembly adapted to support said electronic assemblies in a vertical array in said interior region,

E. a first vertical flow path disposed between said front panel and said interior region,

F. a second vertical flow path disposed between said back panel and said interior region,

wherein said first vertical flow path and said second vertical flow path are in fluid communication by way of a plurality of transverse flow paths extending through said interior region from said first vertical flow path to said second vertical flow path,

G. a plurality of fans in an array supported by a panel disposed between said interior region and said second vertical flow path, each of said fans having an inlet in fluid communication with said transverse flow paths and an outlet in fluid communication with said second vertical flow path,

H. a cap flow path extending from said second vertical flow path to said first vertical flow path, thereby forming a plurality of closed flow paths, each closed flow path including at least a portion of said first vertical flow path, one of said transverse flow paths, at least a portion of said second vertical flow path, and said cap flow path, and

I. a heat exchanger disposed along said cap flow path.

2. A cabinet according to claim 1 wherein said array of fans is a vertical array.

3. A cabinet according to claim 1 wherein said array of fans is a horizontal array.

4. A cabinet according to claim 1 wherein said first vertical flow path extends in a direction toward said top panel, said second vertical flow path extends in a direction toward said base, and said cap flow path is adjacent to said base.

5. A cabinet according to claim 4 wherein said array of fans is a vertical array.

6. A cabinet according to claim 4 wherein said array of fans is a horizontal array.

7. A cabinet according to claim 1 wherein said first vertical flow path extends in a direction toward said base, said second vertical flow path extends in a direction toward said top panel, and said cap flow path is near said top panel.

8. A cabinet according to claim 7 wherein said array of fans is a vertical array.

9. A cabinet according to claim 7 wherein said array of fans is a horizontal array.