Semiconductor device, magnetic sensor, and magnetic sensor unit

• US 7,309,904 B2
• Filed: 03/22/2005
• Issued: 12/18/2007
• Est. Priority Date: 03/24/2004
• Status: Expired due to Fees

• Current Assignee: Yamaha Corporation
• Original Assignee: Yamaha Corporation
• Inventors: Naito, Hiroshi, Sato, Hideki
• Primary Examiner(s): Purvis, Sue A.
• Assistant Examiner(s): Rodela, Eduardo A.
• Application Number:
  US11/085,573
• Publication Number:
  US 20050230827A1
• Time in Patent Office: 1,001 Days
• Field of Search: 257/421, 257/E43.001
• US Class Current: 257/421
• CPC Class Codes: G01R 33/02 Measuring direction or magnitude of magnetic fields or magnetic flux G01R33/20 takes precedence
• CPC Class Codes: G01R 33/07 Hall effect devices
• CPC Class Codes: G01R 33/09 Magnetoresistive devices
• CPC Class Codes: H01L 2224/02 Bonding areas; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/02377 Fan-in arrangement
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05008 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
• CPC Class Codes: H01L 2224/05024 the internal layer being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05026 the internal layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05171 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/1308 being stacked
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/1403 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/14051 : Bump connectors having different shapes
• CPC Class Codes: H01L 2224/16145 : the bodies being stacked
• CPC Class Codes: H01L 23/3114 : the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 24/02 : Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15159 : Side view
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A semiconductor device, comprising a semiconductor chip; a pad electrode; an electrode portion; a wiring portion. An insulating portion is formed from electrically insulating material, covering the surface of the semiconductor chip and sealing the sensor element, wiring portion and electrode portion, in a state which exposes at least the electrode portion on the surface of the semiconductor chip. The electrode portion is placed in a position which does not overlap with the sensor element in the thickness direction of the semiconductor chip.

Claims

1. A magnetic sensor, comprising a magnetic sensor chip, formed substantially into a sheet shape, which is sensitive to the magnetic field vector component in at least one direction of a magnetic field, and a plurality of electrode portions, protruding from the surface of said magnetic sensor chip, which electrically connect said magnetic sensor chip to a substantially sheet-shaped circuit board, wherein

the electrode portions are arranged in a row on the surface of said magnetic sensor chip;

the magnetic sensor chip has first and second edges substantially parallel and opposite to each other;

the electrode portions are arranged in a single row substantially parallel and adjacent to the first edge; and

the magnetic sensor chip is mounted on the circuit board with the first edge being in contact with the circuit board and with the second edge being apart from the circuit board so that the magnetic sensor chip is inclined with respect to the circuit board.

2. A magnetic sensor unit, comprising two of the magnetic sensors according to claim 1, and a circuit board on which are mounted said magnetic sensors with said electrode portions in contact with the surface, wherein

the magnetic sensor chip of at least one of the magnetic sensors is sensitive to magnetic components of a magnetic field in two directions;

and,

the magnetic sensors are placed on said circuit board, such that the direction of sensitivity of the other magnetic sensor chip intersects the plane comprising the two directions of sensitivity of said one magnetic sensor chip.

3. A magnetic sensor unit, comprising two of the magnetic sensors according to claim 1, and a circuit board on which are mounted said magnetic sensors, wherein

the magnetic sensor chip of at least one of the magnetic sensors is sensitive to magnetic components of a magnetic field in two directions;

and,

the magnetic sensors are placed on said circuit board, at least partially overlapping, such that the direction of sensitivity of the other magnetic sensor chip intersects the plane comprising the two directions of sensitivity of said one magnetic sensor chip.

4. A magnetic sensor, comprising a magnetic sensor chip, formed substantially into a sheet shape, which is sensitive to the magnetic component in at least one direction of a magnetic filed, and a plurality of electrode portions, protruding from the surface of said magnetic sensor chip, which electrically connect said magnetic sensor chip to a substantially sheet-shaped circuit board, wherein

the electrode portions are arranged in a plurality of parallel rows on the surface of said magnetic sensor chip;

and,

the protrusion lengths of said electrode portions decrease gradually in the direction of arrangement of said plurality of rows, and

a circuit board on which are mounted said magnetic sensors with said electrode portions in contact with the surface, wherein

the magnetic sensor chip of at least one of the magnetic sensors is sensitive to magnetic components of a magnetic field in two directions; and

,

the magnetic sensors are placed on said circuit board, at least partially overlapping, such that the direction of sensitivity of the other magnetic sensor chip intersects the plane comprising the two directions of sensitivity of said one magnetic sensor chip.

5. A magnetic sensor, comprising a magnetic sensor chip, formed substantially into a sheet shape, which is sensitive to the magnetic component in at least one direction of a magnetic field, and a plurality of electrode portions, protruding from the surface of said magnetic sesor chip, which electrically connect said magnetic sensor chip to a substantially sheet-shaped circuit board, wherein

the electrode portions are arranged in a plurality of parallel rows on the surface of said magnetic sensor chip;

and,

the protrusion lengths of said electrode portions decrease graudually in the direction of arrangement of said plurality of rows, and a circuit board on which are mounted said magnetic sensors, wherein

the magnetic sensor chip of at least one of the magnetic sensors is sensitive to magnetic components of a magnetic field in two directions; and

,

the magnetic sensors are placed on said circuit board, at least partially overlapping, such that the direction of sensitivity of the other magnetic sensor chip intersects the plane comprising the two directions of sensitivity of said one magnetic sensor chip.

6. A magnetic sensor unit, comprising a first magnetic sensor which is sensitive to the magnetic components of a magnetic field in two directions, a second magnetic sensor which is sensitive to the magnetic component of a magnetic field in at least one direction, and a substantially sheet-shaped circuit board on the surface of which the two magnetic sensors are mounted, wherein

each of the magnetic sensors comprises a magnetic sensor chip formed in substantially a sheet shape, and a plurality of electrode portions, protruding from the surface of the magnetic sensor chip, which are brought into contact with the surface of said circuit board and are electrically connected to said circuit board;

and,

at least one of the magnetic sensor chips is caused to be inclined with respect to the rear surface of said circuit board, such that the direction of sensitivity of said second magnetic sensor intersects the plane comprising the two directions of sensitivity of said first magnetic sensor, and moreover a first sum of the height dimensions, in the thickness direction of said circuit board, of said circuit board and of said electrode portions at one portion of the magnetic sensor chip is different from a second sum of the height dimensions of said circuit board and of said electrode portions at another portion of the magnetic sensor chip.

7. The magnetic sensor unit according to claim 6, wherein a projection is formed on the front surface of the circuit board so as to form a stair-like shape on the front surface of the circuit board and the electrode portions of at least one magnetic sensor are placed on the top faces of separate steps.