Interferometer assemblies having reduced cyclic errors and system using the interferometer assemblies

• US 7,310,152 B2
• Filed: 03/03/2005
• Issued: 12/18/2007
• Est. Priority Date: 03/03/2004
• Status: Expired due to Fees

• Current Assignee: Zygo Corporation (Ametek Incorporated)
• Original Assignee: Zygo Corporation (Ametek Incorporated)
• Inventors: Carlson, Andrew Eric
• Primary Examiner(s): Lyons, Michael A.
• Application Number:
  US11/071,878
• Publication Number:
  US 20050195404A1
• Time in Patent Office: 1,020 Days
• Field of Search: 356/491, 356/492, 356/493, 356/496, 356/498, 356/500
• US Class Current: 356/493
• CPC Class Codes: G01B 2290/70 Using polarization in the interferometer
• CPC Class Codes: G01B 9/02002 using two or more frequencies
• CPC Class Codes: G01B 9/02018 Multipass interferometers, e.g. double-pass
• CPC Class Codes: G01B 9/02059 Reducing effect of parasitic reflections, e.g. cyclic errors
• CPC Class Codes: G03F 7/70775 Position control, e.g. interferometers or encoders for determining the stage position

Abstract

In general, in one aspect, the invention features apparatus that include an interferometer including a main assembly having two laterally displaced polarizing beam splitter interfaces, wherein the interfaces are positioned to receive two spatially separated beams and direct them each to make at least two passes to one or more remote objects. Each interface reflects and transmits each beam at least once, and the interferometer is configured to combine the two beams after they make the at least two passes to the one or more remote objects to produce an output beam including information about an optical path length difference between paths traveled by the two beams.

Claims

1. An apparatus comprising:

an interferometer comprising a main assembly comprising two laterally displaced polarizing beam splitter interfaces, wherein the interfaces are positioned to receive two spatially separated beams and direct them each to make at least two passes to one or more remote objects,

wherein each interface reflects and transmits each beam at least once, and the interferometer is configured to combine the two beams after they make the at least two passes to the one or more remote objects to produce an output beam comprising information about an optical path length difference between paths traveled by the two beams; and

an input assembly configured to derive the spatially separated beams from an input beam and to direct the spatially separated beams towards the main assembly.

2. The apparatus of claim 1, wherein the input assembly is configured so that the spatially separated beams have orthogonal polarizations when exiting the input assembly.

3. The apparatus of claim 1, further comprising a wave plate between the input assembly and the main assembly, the wave plate being configured to rotate the polarization of one of the spatially separated beams as it travels between the input assembly and the main assembly.

4. The apparatus of claim 3, wherein the wave plate is a polymeric wave plate.

5. The apparatus of claim 1, wherein an output surface of the input assembly is optically coupled to an input surface of the main assembly.

6. The apparatus of claim 1, wherein the input assembly is configured to direct the two beams towards the main assembly along parallel paths.

7. The apparatus of claim 1, wherein the input assembly comprises two laterally displaced polarizing beam splitter interfaces.

8. The apparatus of claim 7, wherein the two laterally displaced polarizing beam splitter interfaces of the input assembly are parallel.

9. The apparatus of claim 7, wherein the two laterally displaced polarizing beam splitter interfaces of the input assembly are non-parallel to the two laterally displaced polarizing beam splitter interfaces of the main assembly.

10. The apparatus of claim 1, wherein the interferometer is configured so that the two spatially separated beams have the same polarization when they are received by the main assembly.

11. The apparatus of claim 1, wherein the main assembly is configured to direct the spatially separated beams to make at least two passes along parallel paths to the one or more remote objects.

12. The apparatus of claim 1, further comprising a retroreflector configured to direct the spatially separated beams back towards the main assembly after each beam makes its first pass to the one or more remote objects.

13. The apparatus of claim 1, wherein the interferometer is configured so that each of the spatially separated beams makes at least two passes to different locations on the one or more remote objects.

14. The apparatus of claim 1, wherein the laterally displaced polarizing beam splitter interfaces are parallel.

15. The apparatus of claim 1, wherein the main assembly is monolithic.

16. The apparatus of claim 1, further comprising an output surface configured so that the spatially separated beams intersect the output surface with a non-perpindicular angle of incidence at least once.

17. The apparatus of claim 16, wherein the angle of incidence of the beams at the output surface is about 0.1°

or more.

18. The apparatus of claim 16, wherein the angle of incidence of the beams at the output surface is about 10°

or less.

19. The apparatus of claim 16, wherein the output assembly comprises a wedge.

20. The apparatus of claim 16, further comprising a quarter wave plate positioned between the main assembly and the output assembly.

21. The apparatus of claim 20, wherein the quarter wave plate is a polymeric quarter wave plate.

22. The apparatus of claim 16, wherein the output assembly is optically coupled to the main assembly.

23. The apparatus of claim 1, further comprising a detector positioned to receive the output beam.

24. The apparatus of claim 1, further comprising a source configured to provide an input beam from which the interferometer derives the spatially separated beams.

25. The apparatus of claim 1, wherein the one or more remote objects comprises of a reflecting element.

26. The apparatus of claim 25, wherein the reflecting element is a plane mirror.

27. The apparatus of claim 25, wherein the reflecting element is a retroreflector.

28. A refractometer comprising the apparatus of claim 1.

29. A lithography system for use in fabricating integrated circuits on a wafer, the system comprising:

a stage for supporting the wafer;

an illumination system for imaging spatially patterned radiation onto the wafer;

a positioning system for adjusting the position of the stage relative to the imaged radiation; and

an interferometry system comprising the apparatus of claim 1, the interferometry system being configured to monitor the position of the wafer relative to the imaged radiation.

30. A lithography system for use in fabricating integrated circuits on a wafer, the system comprising:

a stage for supporting the wafer; and

an illumination system including a radiation source, a mask, a positioning system, a lens assembly, and an interferometry system comprising the apparatus of claim 1,

wherein during operation the source directs radiation through the mask to produce spatially patterned radiation, the positioning system adjusts the position of the mask relative to the radiation from the source, the lens assembly images the spatially patterned radiation onto the wafer, and the interferometry system monitors the position of the mask relative to the radiation from the source.

31. A beam writing system for use in fabricating a lithography mask, the system comprising:

a source providing a write beam to pattern a substrate;

a stage supporting the substrate;

a beam directing assembly for delivering the write beam to the substrate;

a positioning system for positioning the stage and beam directing assembly relative one another; and

an interferometry system comprising the apparatus of claim 1, the interferometry system being configured to monitor the position of the stage relative to the beam directing assembly.

32. A method for fabricating integrated circuits, the method comprising using the lithography system of claim 31.

33. A lithography method for use in fabricating integrated circuits on a wafer, the method comprising:

supporting the wafer on a moveable stage;

imaging spatially patterned radiation onto the wafer;

adjusting the position of the stage; and

monitoring the position of the stage using an interferometry system comprising the apparatus of claim 1.

34. A method for fabricating integrated circuits, the method comprising the lithography method of claim 33.

35. A method for fabricating integrated circuits, the method comprising using the lithography system of claim 33.

36. A lithography method for use in the fabrication of integrated circuits comprising:

directing input radiation through a mask to produce spatially patterned radiation;

positioning the mask relative to the input radiation;

monitoring the position of the mask relative to the input radiation using an interferometry system comprising the apparatus of claim 1; and

imaging the spatially patterned radiation onto a wafer.

37. A method for fabricating integrated circuits, the method comprising the lithography method of claim 36.

38. A lithography method for fabricating integrated circuits on a wafer comprising:

positioning a first component of a lithography system relative to a second component of a lithography system to expose the wafer to spatially patterned radiation; and

monitoring the position of the first component relative to the second component using an interferometry system comprising the apparatus of claim 1.

39. A method for fabricating integrated circuits, the method comprising the lithography method of claim 38.

40. A method for fabricating a lithography mask, the method comprising:

directing a write beam to a substrate to pattern the substrate;

positioning the substrate relative to the write beam; and

monitoring the position of the substrate relative to the write beam using an interferometry system comprising the apparatus of claim 1.

41. An interferometer, comprising:

an input assembly comprising two laterally displaced polarizing beam splitter interfaces; and

a main assembly comprising at least one polarizing beam splitter interface,

wherein the interfaces in the input assembly are positioned to derive two spatially separated beams from an input beam, the main assembly directs the spatially separated beams each to make at least two passes to one or more remote objects, and the input assembly combines the two beams after they make the at least two passes to the one or more remote objects to produce an output beam comprising information about an optical path length difference between paths traveled the two beams.

42. The interferometer of claim 41, wherein the two laterally displaced polarizing beam splitter interfaces in the input assembly are parallel.

43. The interferometer of claim 42, wherein the main assembly comprises two polarizing beam splitter interfaces that are non-parallel to the two laterally displaced polarizing beam splitter interfaces in the input assembly.

44. The interferometer of claim 41, further comprising a wave plate between the input assembly and the main assembly, the wave plate being configured to rotate the polarization of one of the spatially separated beams as it travels between the input assembly and the main assembly.

45. The interferometer of claim 41, wherein the main assembly is configured to direct the spatially separated beams to make at least two passes to the one or more remote objects along parallel paths.

46. The interferometer of claim 45, wherein the one or more remote objects is a plane mirror.

47. The interferometer of claim 41, wherein the main assembly is monolithic.

48. The interferometer of claim 41, further comprising an output surface configured so that the spatially separated beams intersect the output surface with a non-perpendicular angle of incidence at least once.

49. The interferometer of claim 48, wherein the output surface is the nearest surface of the interferometer to the one or more remote objects.

50. A lithography system for use in fabricating integrated circuits on a wafer, the system comprising:

a stage for supporting the wafer;

an illumination system for imaging spatially patterned radiation onto the wafer;

a positioning system for adjusting the position of the stage relative to the imaged radiation; and

an interferometry system comprising the interferometer of claim 41, the interferometry system being configured to monitor the position of the wafer relative to the imaged radiation.

51. A method, comprising:

using an input assembly of an interferometer to derive two spatially separated beams from an input beam and to direct the spatially separated beams towards a main assembly of the interferometer;

using the main assembly to direct two spatially separated beams to each make at least two passes to one or more remote objects, wherein the main assembly comprises two laterally displaced polarizing beam splitter interfaces positioned to receive the two beams and each interface reflects and transmits each beam at least once; and

combining the two beams after they make the at least two passes to the one or more remote objects to produce an output beam comprising information about an optical path length difference between the two beams.