MEMS device and method of forming MEMS device
First Claim
1. A micro-mirror device, comprising:
- a substructure;
conductive material patterned on the substructure;
a hinge element supported over the substructure and communicated with the conductive material;
a reflective element supported over the hinge element; and
a support extended between the hinge element and the reflective element,wherein the support includes a protective material forming a cavity open to the reflective element and a plug material filling the cavity, wherein a surface of the protective material and a surface of the plug material form a substantially planar surface, wherein the reflective element is formed over the substantially planar surface, and contacts the protective material and the plug material, and wherein the plug material is enclosed by the reflective element and the protective material.
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Accused Products
Abstract
A method of forming a MEMS device includes depositing a conductive material on a substructure, forming a first sacrificial layer over the conductive material, including forming a substantially planar surface of the first sacrificial layer, and forming a first element over the substantially planar surface of the first sacrificial layer, including communicating the first element with the conductive material through the first sacrificial layer. In addition, the method includes forming a second sacrificial layer over the first element, including forming a substantially planar surface of the second sacrificial layer, forming a support through the second sacrificial layer to the first element after forming the second sacrificial layer, including, filling the support, and forming a second element over the support and the substantially planar surface of the second sacrificial layer. As such, the method further includes substantially removing the first sacrificial layer and the second sacrificial layer, thereby supporting the second element relative to the first element with the support.
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Citations
23 Claims
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1. A micro-mirror device, comprising:
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a substructure; conductive material patterned on the substructure; a hinge element supported over the substructure and communicated with the conductive material; a reflective element supported over the hinge element; and a support extended between the hinge element and the reflective element, wherein the support includes a protective material forming a cavity open to the reflective element and a plug material filling the cavity, wherein a surface of the protective material and a surface of the plug material form a substantially planar surface, wherein the reflective element is formed over the substantially planar surface, and contacts the protective material and the plug material, and wherein the plug material is enclosed by the reflective element and the protective material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A micro-mirror device, comprising:
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a substructure; conductive material patterned on the substructure; a hinge element extended over the substructure and communicated with the conductive material; a reflective element extended over the hinge element; and means for supporting the reflective element relative to the hinge element, including means for forming a cavity open to the reflective element, and means for filling the cavity, wherein a surface of the means for forming the cavity and a surface of the means for filling the cavity form a substantially planar surface for supporting the reflective element, wherein the reflective element is formed over the substantially planar surface, and contacts the means for forming the cavity and the means for filling the cavity, wherein the means for filling the cavity is enclosed by the reflective element and the means for forming the cavity, and wherein the reflective element has a substantially planar surface over an entirety thereof. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A micro-mirror device, comprising:
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a substructure; conductive material patterned on the substructure; a hinge element supported over the substructure and communicated with the conductive material; a reflective element supported over the hinge element; and a support extended between the hinge element and the reflective element, wherein the support includes a conductive via open to the reflective element and a plug material filling the conductive via, wherein a surface of the conductive via and a surface of the plug material form a substantially planar surface of the support, wherein the reflective element is formed over the substantially planar surface of the support, and contacts the surface of the conductive via and the surface of the plug material, and wherein the plug material is enclosed by the reflective element and the conductive via. - View Dependent Claims (22, 23)
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Specification