Electronic device

• US 7,310,236 B2
• Filed: 07/09/2004
• Issued: 12/18/2007
• Est. Priority Date: 07/30/2003
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Takahashi, Yoshitake, Tsuchida, Yoshihisa, Morikawa, Masayoshi
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): Bui, Hung S
• Application Number:
  US10/888,290
• Publication Number:
  US 20050024835A1
• Time in Patent Office: 1,257 Days
• Field of Search: 361/757, 361/752, 361/753
• US Class Current: 361/757
• CPC Class Codes: H01B 1/24 the conductive material comprising carbon-silicon compounds, carbon or silicon
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H05K 9/009 comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Abstract

A casing that has an electronic component housed therein has a conductive layer made of a mixture of carbon fibers and a thermoplastic resin and an insulating layer where only the thermoplastic resin is exposed on a surface of the conductive layer. The casing prevents leakage of unwanted electromagnetic waves from inside, is not affected by external electromagnetic waves, has small thickness, light weight, high strength and high rigidity, and has excellent contactability with a coating.

Claims

1. An electronic device comprising:

a casing having a conductive layer made of a mixture of carbon fibers and a thermoplastic resin and a first insulating layer where only the thermoplastic resin is applied on a surface of the conductive layer, the casing further having a number of holes which extend through the insulating layer and into the conductive layer;

a printed circuit board coupled to the casing such that the printed circuit board is arranged closer to the first insulating layer than to the conductive layer;

one or more electronic components coupled to the printed circuit board;

a driving motor; and

a metal frame supporting the printed circuit board and the driving motor,

the printed circuit board being coupled to the casing by use of a number of screws which are screwed into the number of holes of the casing which extend through the insulating layer and into the conductive layer such that an electrical connection is provided by way of the screws to the conductive layer of the casing.

2. The electronic device as claimed in claim 1, wherein a surface of the casing is coated.

3. The electronic device as claimed in claim 1, wherein the casing is formed by injection-molding the carbon fiber reinforced resin while raising a temperature of a cavity surface of a metal mold to a predetermined temperature so that the carbon fibers are not exposed on the surface.

4. The electronic device as claimed in claim 1, wherein casing is formed from a carbon fiber reinforced resin which contains the carbon fibers at a rate of 10 to 30% by weight of a total weight.

5. The electronic device as in claim 1, further comprising a flexible wiring board electrically connected to the one or more electronic components on the printed circuit board.

6. The electronic device as in claim 5, in which the metal frame and the printed circuit board are coupled to the casing by use of the number of screws which are screwed into the number of holes of the casing such that an electrical connection is provided therefrom to the conductive layer of the casing by way of the screws.

7. The electronic device as in claim 6, in which a distal end of a wiring part of the flexible wiring board is attached between a respective screw and the metal frame such that the flexible wiring board is electrically connected to the conductive layer by way of the screw and the metal frame.

8. The electronic device as in claim 1, further comprising a second insulating layer arranged on a surface on the conductive layer which is opposite to that in which the first insulating layer is arranged.

9. The electronic device as in claim 8, further comprising an ornamental layer arranged on an outer surface of the second insulating layer, said ornamental layer forming an outer surface of the casing.