Micromachined fluidic device and method for making same

• US 7,311,503 B2
• Filed: 09/26/2005
• Issued: 12/25/2007
• Est. Priority Date: 05/25/2000
• Status: Expired due to Term

• Current Assignee: Debiotech S.A.
• Original Assignee: Debiotech S.A.
• Inventors: Van Lintel, Harald T., Maillefer, Didier, Gamper, Stephan
• Primary Examiner(s): Vinh, Lan
• Application Number:
  US11/235,713
• Publication Number:
  US 20060027523A1
• Time in Patent Office: 820 Days
• Field of Search: 216/2, 216/27, 216/41, 216/56, 216/80, 216/95, 417/413.1, 417/2, 417/3
• US Class Current: 417/413.1
• CPC Class Codes: A61M 5/14244 adapted to be carried by the patient, e.g. portable on the body
• CPC Class Codes: F04B 43/043 Micropumps

Abstract

The fluid-flow device (100) of the invention comprises a stack (30) covered by a closure wafer (20), said stack (30) comprising a support wafer (36), a layer of insulating material (34), and a silicon layer (32). The closure wafer (20) and/or said silicon layer (32) are machined so as to define a cavity (38) between said closure wafer (20) and said silicon layer (32), said support wafer (36) has at least one duct (102) passing right through it, said layer of insulating material (34) presenting at least one zone (35) that is entirely free of material placed at least in line with said duct (102) so as to co-operate with said cavity (38) to define a moving member (40) in said silicon layer (32), the moving member being suitable under the pressure of liquid in said cavity (38) for reversibly moving towards said support wafer (36) until contact is made between said moving member (40) and said support wafer (36).

Claims

1. A micropump comprising:

a Silicon On Insulator stack covered in a closure wafer, said stack comprising;

a support wafer, a layer of insulating material covering at least part of said support wafer, and a layer of single-crystal or polycrystalline silicon covering said layer of insulating material and covered by said closure wafer;

said layer of insulating material connecting said support wafer to said silicon layer;

said closure wafer and/or said silicon layer being machined so as to define a cavity between said closure wafer and said silicon layer, the cavity being for filling with liquid and including a pump chamber;

said support wafer comprising at least a first duct passing right through it and situated in register with said cavity;

said layer of insulating material having at least one first zone that is entirely free of material placed at least in line with said first duct so as to co-operate with said cavity to define a first moving member in said silicon layer, the first moving member being suitable, due to its elasticity and under pressure of liquid in said pump chamber, for moving reversibly towards said support wafer, said first moving member forming part of the flap of a liquid inlet control member; and

said micropump further comprising a pumping portion comprising control means fitted with a pump diaphragm to cause the volume of the pump chamber to vary periodically, and liquid outlet control means.

2. A micropump according to claim 1, wherein said liquid inlet control member is forming a non-return check valve, the member comprising a stack covered in a closure wafer, said stack comprising a support wafer, a layer of insulating material covering at least part of said support wafer, and a layer of single-crystal or polycrystalline silicon covering said layer of insulating material and covered by said closure wafer;

said closure wafer and/or said silicon layer being machined so as to define a cavity between said closure wafer and said silicon layer, said cavity being designed to be filled with liquid and presenting at least one gap machined in the entire thickness of the silicon layer;

said support wafer having at least one liquid inlet duct passing right through it and situated at least in register with said cavity; and

said layer of insulating material having at least one zone entirely free of material extending at least in line with said duct and said gap so as to co-operate with said cavity to define a moving member in said silicon layer to form a flap for said valve, a portion of said silicon layer surrounding said moving member presenting elasticity making it possible in the event of a difference in liquid pressure between said liquid inlet duct and said cavity to allow said moving member to move reversibly towards said support wafer.

3. A micropump according to claim 1, wherein the micropump further comprises:

at least one liquid pressure detection member comprising a stack covering a closure wafer, said stack comprising a support wafer, a layer of insulating material covering at least part of said support wafer, and a layer of single-crystal or polycrystalline silicon covering said layer of insulating material and covered by said closure wafer, said closure wafer and/or said silicon layer being machined so as to define a cavity for filling with liquid between said closure wafer and said silicon layer;

said support wafer having as least one duct passing right through it and situated in register with said cavity; and

said layer of insulating material having at least one zone that is entirely free of material placed at least in line with said duct so as to co-operate with said cavity to define a moving member in said layer of silicon, said silicon support wafer presenting a portion in register with the moving member forming an island that is separated from the remainder of the support wafer by said duct, said moving member being capable, by virtue of its elasticity and under pressure of liquid in said cavity, of moving reversibly towards the support wafer.

4. A micropump according to claim 1, wherein said micropump control means are external to the micropump and are connected indirectly to said pump diaphragm.

5. A micropump according to claim 1, wherein said control means operate in piezoelectric, electromagnetic, or pneumatic manner.

6. A micropump according to claim 1, wherein said layer of insulating material is of constant thickness and connects said support wafer to said silicon layer with a constant spacing.

7. A micropump according to claim 1, wherein said first moving member is suitable for coming into leaktight contact against said support wafer, said first moving member constituting the flap of said liquid inlet control member.

8. A micropump according to claim 7, wherein said layer of insulating material further presents a second zone that is entirely free of material which co-operates with said cavity to define a second moving member in said silicon layer, the second moving member being suitable under the pressure of liquid in said pump chamber for moving towards said support wafer, said second moving member constituting the flap of a liquid outlet control member.

9. A micropump according to claim 7, wherein said micropump control means are situated facing the pump chamber and are integrated directly in the micropump by being fixed to the face of the second closure wafer facing away from the stack.

10. A micropump according to claim 1, wherein said closure wafer is a first closure wafer made of glass.

11. A micropump according to claim 10, wherein the micropump further comprises a second closure wafer made of glass fixed on the face of the support wafer facing away from said first closure wafer made of glass.

12. A micropump according to claim 1, wherein a moving portion of the pump is made in said support wafer in register with the pump chamber, an annular volume free of material machined in said support wafer separating the moving pump portion from the remainder of the support wafer and in that said micropump control means are situated in register with the pump chamber and directly integrated in the micropump by being fixed to said moving pump portion.

13. A micropump according to claim 12, wherein said silicon layer forms said pump diaphragm in register with the pump chamber, and in that said moving pump portion is pierced right through by a passage which is suitable for receiving a control rod having one end fixed to the diaphragm and having its opposite end forming a handle.

14. A micropump according to claim 12, wherein said moving portion includes at least one liquid pressure detection member.

15. A micropump according to claim 14, wherein said pumping portion is provided with at least two liquid pressure detectors each forming a liquid pressure detection member, said members being regularly spaced apart angularly in said moving pumping portion which is pierced right through by at least two series of ducts.

16. A micropump according to claim 14, wherein said pumping portion is provided with an annular liquid pressure detector presenting ducts passing right through said moving portion in an annular zone.

17. The use of a micropump according to claim 1, as a medical pump for continuously delivering a liquid medicine.

18. The use of a micropump according to claim 17, wherein said micropump is disposed beneath the skin of a patient, said micropump being of implantable.

19. The use of a micropump according to claim 17, wherein the inlet control member of said micropump is connected to the blood circulation system of the patient via an inlet port through the skin, said micropump being external to said skin.

20. A micropump comprising:

a stack covered in a closure wafer, said stack comprising;

a support wafer, a layer of insulating material covering at least part of said support wafer, and a layer of single-crystal or polycrystalline silicon covering said layer of insulating material and covered by said closure wafer;

said closure wafer and/or said silicon layer being machined so as to define a cavity between said closure wafer and said silicon layer, the cavity being for filling with liquid and including a pump chamber;

said support wafer comprising at least a first duct passing right through it and situated in register with said cavity;

said layer of insulating material having at least one first zone that is entirely free of material placed at least in line with said first duct so as to co-operate with said cavity to define a first moving member in said silicon layer, the first moving member being suitable under pressure of liquid in said pump chamber, for moving reversibly towards said support wafer, said first moving member forming part of the flap of a liquid inlet control member; and

said micropump further comprising a pumping portion comprising control means fitted with a pump diaphragm to cause the volume of the pump chamber to vary periodically, and liquid outlet control means,

wherein a moving portion of the pump is made in said support wafer in register with the pump chamber, an annular volume free of material machined in said support wafer separating the moving pump portion from the remainder of the support wafer, and in that said micropump control means are situated in register with the pump chamber and directly integrated in the micropump by being fixed to said moving pump portion,

wherein said moving portion includes at least one liquid pressure detection member, and

wherein said pumping portion is provided with an annular liquid pressure detector presenting ducts passing right through said moving portion in an annular zone.