Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method
First Claim
1. An anisotropically conductive connector comprisingan elastic anisotropically conductive film, in which a plurality of conductive parts for connection containing conductive particles and extending in a thickness-wise direction of the film have been formed,wherein the conductive particles contained in the conductive parts for connection are obtained by laminating an intermediate coating layer and a surface coating layer each formed of a high-conductive metal on a surface of core particle exhibiting magnetism, and the outermost coating layer is a coating layer having a high hardness and the intermediate coating layer is a coating layer having a lower hardness than the outermost coating layer.
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Accused Products
Abstract
An anisotropically conductive connector, and applications thereof, by which good conductivity is retained over a long period of time even when it is used in electrical inspection of a plurality of integrated circuits formed on a wafer repeatedly over a great number of times, and thus high durability and long service life are achieved. The anisotropically conductive connector includes elastic anisotropically conductive films, in each of which a plurality of conductive parts for connection containing conductive particles and extending in a thickness-wise direction of the film are formed. The conductive particles contained in the conductive parts for connection in the anisotropically conductive connector are obtained by laminating surfaces of core particles exhibiting magnetism with a coating layer formed of a high-conductive metal, and the coating layer is a coating layer having a high hardness.
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Citations
13 Claims
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1. An anisotropically conductive connector comprising
an elastic anisotropically conductive film, in which a plurality of conductive parts for connection containing conductive particles and extending in a thickness-wise direction of the film have been formed, wherein the conductive particles contained in the conductive parts for connection are obtained by laminating an intermediate coating layer and a surface coating layer each formed of a high-conductive metal on a surface of core particle exhibiting magnetism, and the outermost coating layer is a coating layer having a high hardness and the intermediate coating layer is a coating layer having a lower hardness than the outermost coating layer.
Specification