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Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor

  • US 7,311,797 B2
  • Filed: 06/27/2002
  • Issued: 12/25/2007
  • Est. Priority Date: 06/27/2002
  • Status: Expired due to Term
First Claim
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1. A component of a semiconductor processing apparatus, comprising:

  • an aluminum substrate of an aluminum material having a sealed anodized surface; and

    a thermal sprayed coating consisting essentially of yttria disposed over the sealed anodized surface without an intermediate layer of another material disposed between the coating and the sealed anodized surface of the substrate, the coating forming an outermost surface of the component.

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