Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor
First Claim
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1. A component of a semiconductor processing apparatus, comprising:
- an aluminum substrate of an aluminum material having a sealed anodized surface; and
a thermal sprayed coating consisting essentially of yttria disposed over the sealed anodized surface without an intermediate layer of another material disposed between the coating and the sealed anodized surface of the substrate, the coating forming an outermost surface of the component.
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Abstract
Components of semiconductor processing apparatus comprise thermal sprayed yttria-containing coatings that provide erosion, corrosion and/or corrosion-erosion resistance in plasma atmospheres. The coatings can protect substrates from physical and/or chemical attack.
75 Citations
19 Claims
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1. A component of a semiconductor processing apparatus, comprising:
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an aluminum substrate of an aluminum material having a sealed anodized surface; and a thermal sprayed coating consisting essentially of yttria disposed over the sealed anodized surface without an intermediate layer of another material disposed between the coating and the sealed anodized surface of the substrate, the coating forming an outermost surface of the component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A chamber wall of a semiconductor processing apparatus, comprising:
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an anodized aluminum substrate of an aluminum material having a sealed anodized surface; and a thermal sprayed coating consisting essentially of yttria disposed directly on the sealed anodized surface, the coating forming an outermost surface of the chamber wall. - View Dependent Claims (10, 11, 12, 13)
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14. A plasma etch reactor, comprising:
at least one component including; an aluminum substrate of an aluminum material having a sealed anodized surface; and a thermal sprayed coating consisting essentially of yttria disposed directly on the sealed anodized surface without an intermediate layer of another material disposed between the coating and the sealed anodized surface of the substrate, the coating forming an outermost surface of the component. - View Dependent Claims (15, 16, 17, 18, 19)
Specification