Chip scale package with heat spreader
First Claim
Patent Images
1. An assembly having a semiconductor die adhesively attached to a portion of a paddle frame comprising:
- a chip-on-board semiconductor die having an active surface having a plurality of bond pads thereon and an opposing second surface;
at least one projection connected to at least one bond pad of said plurality of bond pads on said active surface of said chip-on-board semiconductor die for direct connection using at least one of a thermal process, a pressure process, and a combination of a thermal process and a pressure process to a substrate, said at least one projection including one of at least one of a piece of wire forming a solder ball and at least one solder bump; and
a generally centrally positioned paddle having a size essentially the same as said chip-on-board semiconductor die, said generally centrally positioned paddle of a paddle frame of a plurality of paddle frames solely having side rails and a plurality of cross-members connected to said generally centrally positioned paddle, said generally centrally positioned paddle for use as a heat sink for said chip-on-board semiconductor die for dissipating heat therefrom when said chip-on-board semiconductor die is mounted on a substrate, said opposing second surface of said chip-on-board semiconductor die being secured to said generally centrally positioned paddle, said generally centrally positioned paddle being attached to said side rails by at least a plurality of paddle support bars and being attached to said cross-members by said at least a plurality of paddle support bars.
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Accused Products
Abstract
A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member that is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Semiconductor dice are bonded to the paddles by, e.g., conventional semiconductor die attachment methods, enabling bump attachment and testing to be conducted before detachment from the paddle frame strip.
55 Citations
39 Claims
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1. An assembly having a semiconductor die adhesively attached to a portion of a paddle frame comprising:
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a chip-on-board semiconductor die having an active surface having a plurality of bond pads thereon and an opposing second surface; at least one projection connected to at least one bond pad of said plurality of bond pads on said active surface of said chip-on-board semiconductor die for direct connection using at least one of a thermal process, a pressure process, and a combination of a thermal process and a pressure process to a substrate, said at least one projection including one of at least one of a piece of wire forming a solder ball and at least one solder bump; and a generally centrally positioned paddle having a size essentially the same as said chip-on-board semiconductor die, said generally centrally positioned paddle of a paddle frame of a plurality of paddle frames solely having side rails and a plurality of cross-members connected to said generally centrally positioned paddle, said generally centrally positioned paddle for use as a heat sink for said chip-on-board semiconductor die for dissipating heat therefrom when said chip-on-board semiconductor die is mounted on a substrate, said opposing second surface of said chip-on-board semiconductor die being secured to said generally centrally positioned paddle, said generally centrally positioned paddle being attached to said side rails by at least a plurality of paddle support bars and being attached to said cross-members by said at least a plurality of paddle support bars. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An assembly having a semiconductor die adhesively attached to a portion of a paddle frame comprising:
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a semiconductor die having an active surface having at least one bond pad thereon and an opposing second surface; at least one projection secured to said at least one bond pad on said active surface of said semiconductor die for direct connection using at least one of a thermal process, a pressure process, and a combination of a thermal process and a pressure process to a substrate, said at least one projection including one of at least one of a piece of wire forming a solder ball and at least one solder bump; and a metal paddle having a size essentially the same as said semiconductor die, said metal paddle from a paddle frame having no narrow leads, said opposing second surface of said semiconductor die being attached to said metal paddle, said metal paddle attached to at least one side rail of a paddle frame by at least a plurality of paddle support bars and attached to a plurality of cross-members by said at least a plurality of paddle of support bars. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. An assembly having a semiconductor die and a portion of a paddle frame comprising:
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a chip-on-board semiconductor die having an active surface having a plurality of bond pads thereon and an opposing second surface; a plurality of projections connected to said plurality of bond pads directly for connection using at least one of a thermal process, a pressure process, and a combination of a thermal process and a pressure process to a host circuit board, said plurality of projections including one of a plurality of pieces of wire forming solder balls and a plurality of solder bumps; and a metallic paddle having a size essentially the same as said chip-on-board semiconductor die, said metallic paddle secured to said opposing second surface of said chip-on-board semiconductor die for dissipating heat therefrom during operation thereof when said chip-on-board semiconductor die is attached to a substrate, said metallic paddle being attached to at least one side rail of a paddle frame having no narrow leads by at least a plurality of paddle support bars and being attached to a plurality of cross-members by said at least a plurality of support bars. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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Specification