Method of making light emitting device with silicon-containing encapsulant

• US 7,314,770 B2
• Filed: 10/17/2005
• Issued: 01/01/2008
• Est. Priority Date: 11/18/2004
• Status: Expired due to Fees

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Ouderkirk, Andrew J., Leatherdale, Catherine A., Thompson, D. Scott, Boardman, Larry D.
• Primary Examiner(s): Nhu; David
• Application Number:
  US11/252,336
• Publication Number:
  US 20060105481A1
• Time in Patent Office: 806 Days
• Field of Search: 438/30, 438/22, 438/104, 438/106, 438/124, 438/126, 438/118, 438/127, 257/79, 257/82, 257/100, 257/104
• US Class Current: 438/30
• CPC Class Codes: C08G 77/12 containing silicon bound to hydrogen C08G77/045 takes precedence
• CPC Class Codes: C08G 77/20 containing silicon bound to unsaturated aliphatic groups C08G77/045 takes precedence
• CPC Class Codes: C08G 77/70 Siloxanes defined by use of the MDTQ nomenclature
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/04 Polysiloxanes
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A method of making a light emitting device is disclosed. The method includes the steps of providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

Claims

1. A method of making a light emitting device, the method comprising the steps of:

providing a light emitting diode; and

forming an encapsulant in contact with the light emitting diode, wherein forming the encapsulant comprises;

contacting the light emitting diode with a photopolymerizable composition comprising a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation;

applying actinic radiation at a temperature of less than 120°

C. to initiate hydrosilylation within the silicon-containing resin, the actinic radiation having a wavelength of 700 nm or less; and

heating at less than 150°

C.

2. The method of claim 1, wherein heating is at less than 100°

C.

3. The method of claim 2, wherein heating is at less than 60°

C.

4. A light emitting device comprising a light emitting diode and a photopolymerizable composition comprising a silicon-containing resin and a metal-containing catalyst activated by actinic radiation, wherein the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation.

5. The light emitting device of claim 4, wherein the metal-containing catalyst comprises platinum.

6. The light emitting device of claim 4, wherein the photopolymerizable composition is at a temperature of from about 30°

C. to about 120°

C.

7. The light emitting device of claim 6, wherein the metal-containing catalyst comprises platinum.