MEM switching device
First Claim
1. A micro-machined structure for enclosing at least one MEM device, said structure comprising:
- a structure extending from a substrate and at least partially enclosing said at least one MEM device; and
a cover structure residing on a portion of said substrate structure,a contact region, said contact region provided on said cover substrate structure, saidcontact region acting as a pull-back contact for a MEM device residing on said substrate;
wherein said micro-machined structure defines at least one tortuous path, wherein said tortuous path provides for a removal of material residing along said substrate structure.
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Accused Products
Abstract
A MEM device and method for fabricating a MEM device. A MEM device comprising a lever mechanism residing along a substrate is disclosed. A contact material is deposited on a first surface of the lever mechanism. In one arrangment, the first surface is disposed towards the substrate. A first contact region may be deposited on the substrate. The first contact region attracts the lever mechanism towards the substrate such that the contact material becomes operationally coupled to a second contact region. The MEM device may also comprise a first anchor portion and a second anchor portion. The first and second anchor portions may be integral to a top surface of the substrate. Aspects of the invention are also particularly useful in providing an encapsulated MEM switching device.
42 Citations
11 Claims
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1. A micro-machined structure for enclosing at least one MEM device, said structure comprising:
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a structure extending from a substrate and at least partially enclosing said at least one MEM device; and a cover structure residing on a portion of said substrate structure, a contact region, said contact region provided on said cover substrate structure, said contact region acting as a pull-back contact for a MEM device residing on said substrate; wherein said micro-machined structure defines at least one tortuous path, wherein said tortuous path provides for a removal of material residing along said substrate structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification