Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same

• US 7,317,233 B2
• Filed: 06/21/2005
• Issued: 01/08/2008
• Est. Priority Date: 07/25/2003
• Status: Expired due to Fees

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Partridge, Aaron, Lutz, Markus, Kronmueller, Silvia
• Primary Examiner(s): Soward; Ida M.
• Application Number:
  US11/157,582
• Publication Number:
  US 20050253209A1
• Time in Patent Office: 931 Days
• Field of Search: 257415-417, 257/254, 257/514.21, 735/142.1
• US Class Current: 257/415
• CPC Class Codes: B81B 2203/0307 Anchors
• CPC Class Codes: B81B 3/0054 For holding or placing an element in a given position
• CPC Class Codes: B81C 1/00126 Static structures not provided for in groups B81C1/00031 - B81C1/00119

Abstract

There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.

Claims

1. A microelectromechanical device comprising:

a substrate;

an insulation layer disposed on the substrate;

a first semiconductor layer disposed on or above the insulation layer;

an anchor that is disposed in an opening in the insulation layer and the first semiconductor layer and contacts the substrate, wherein the anchor includes a material that is different from the insulation layer;

a second semiconductor layer disposed on the anchor;

a fixed electrode, formed, in part, from the first and second semiconductor layers, wherein the fixed electrode is affixed to the substrate via the anchor;

a moveable electrode, formed, in part, from the second semiconductor layer, wherein the moveable electrode is disposed, at least in part, in a chamber;

a first encapsulation layer disposed over the moveable electrode, wherein the first encapsulation layer is at least a portion of a wall of the chamber; and

a second encapsulation layer, deposited on the first encapsulation layer, to seal the chamber.

2. The device of claim 1 wherein the insulation layer includes silicon nitride or silicon oxide.

3. The device of claim 1 wherein the insulation layer includes silicon oxide and the anchor material includes silicon nitride, silicon carbide, germanium, silicon/germanium or gallium arsenide.

4. The device of claim 1 wherein the insulation layer includes silicon nitride and the anchor material includes silicon, silicon oxide, silicon carbide, germanium, silicon/germanium or gallium arsenide.

5. The device of claim 1 wherein a substantial portion of the fixed electrode overlying the anchor material includes a monocrystalline silicon.

6. The device of claim 1 wherein a substantial portion of the fixed electrode overlying the anchor material includes a polycrystalline silicon.

7. The device of claim 1 further including a third encapsulation layer disposed on the second encapsulation layer.

8. The device of claim 7 wherein the third encapsulation layer is a metal material including aluminum, chromium, gold, silver, molybdenum, platinum, palladium, tungsten, titanium, silicide and/or copper.

9. The device of claim 7 wherein the third encapsulation layer is an insulating material including silicon oxide, silicon nitride, BPSG, PSG and/or SOG.

10. A microelectromechanical device comprising:

a substrate;

an insulation layer disposed on the substrate;

a first semiconductor layer disposed on or above the insulation layer;

an anchor that is disposed in an opening in the insulation layer and the first semiconductor layer and contacts the substrate, wherein the anchor includes a material that is different from the insulation layer;

a second semiconductor layer disposed on the anchor and on the first semiconductor layer;

a fixed electrode, formed, in part, from the first and second semiconductor layers, wherein the fixed electrode is affixed to the substrate via the anchor;

a moveable electrode, formed, in part, from the second semiconductor layer, wherein the moveable electrode is disposed, at least in part, in a chamber;

a first encapsulation layer, disposed over at a portion of the moveable electrode, wherein the first encapsulation layer is at least a portion of a wall of the chamber; and

a second encapsulation layer, deposited on the first encapsulation layer, to seal the chamber, wherein the second encapsulation layer includes a semiconductor material.

11. The device of claim 10 wherein the first encapsulation layer includes a porous semiconductor material.

12. The device of claim 10 wherein the second encapsulation layer includes polycrystalline silicon, silicon carbide, silicon/germanium, germanium, or gallium arsenide.

13. The device of claim 10 wherein the insulation layer includes silicon oxide and the anchor material includes silicon nitride, silicon carbide, germanium, silicon/germanium or gallium arsenide.

14. The device of claim 10 wherein the insulation layer includes silicon nitride and the anchor material includes silicon, silicon oxide, silicon carbide, germanium, silicon/germanium or gallium arsenide.

15. The device of claim 10 wherein the second encapsulation layer includes an epitaxially deposited polycrystalline silicon.

16. The device of claim 10 further including a third encapsulation layer disposed on the second encapsulation layer to further seal the chamber.

17. The device of claim 16 wherein the third encapsulation layer is a metal material including aluminum, chromium, gold, silver, molybdenum, platinum, palladium, tungsten, titanium, silicide and/or copper.

18. The device of claim 16 wherein the third encapsulation layer is an insulating material including silicon oxide, silicon nitride, BPSG, PSG and/or SOG.

19. The device of claim 10 further including:

a contact; and

a trench, disposed around at least a portion of the contact, wherein the trench is disposed outside the chamber and wherein the trench includes an insulating material disposed therein.

20. The device of claim 19 wherein the trench surrounds a portion of the contact that is disposed outside of the chamber.

21. The device of claim 19 wherein the insulating material disposed in the trench is silicon nitride or silicon oxide.

22. A microelectromechanical device comprising:

a substrate;

an insulation layer disposed on the substrate;

a first semiconductor layer disposed on or above the insulation layer;

an anchor that is disposed in an opening in the insulation layer and the first semiconductor layer and contacts the substrate, wherein the anchor includes a material that is different from the insulation layer;

a second semiconductor layer, disposed on the anchor;

a fixed electrode, formed, in part, from the second semiconductor layer, wherein the fixed electrode is affixed to the substrate via the anchor;

a moveable electrode, formed, in part, from the second semiconductor layer, wherein the moveable electrode is disposed, at least in part, in a chamber;

a first encapsulation layer, disposed over at least a portion of the moveable electrode, wherein the first encapsulation layer is at least a portion of a wall of the chamber; and

a second encapsulation layer, deposited on the first encapsulation layer, to seal the chamber, wherein the second encapsulation layer includes a semiconductor material.

23. The device of claim 22 wherein the first encapsulation layer includes a porous semiconductor material.

24. The device of claim 23 wherein the second encapsulation layer includes polycrystalline silicon, silicon carbide, silicon/germanium, germanium, or gallium arsenide.

25. The device of claim 22 wherein the insulation layer includes silicon oxide and the anchor material includes silicon nitride, silicon carbide, germanium, silicon/germanium or gallium arsenide.

26. The device of claim 22 wherein the insulation layer includes silicon nitride and the anchor material includes silicon, silicon oxide, silicon carbide, germanium, silicon/germanium or gallium arsenide.

27. The device of claim 22 wherein a substantial portion of the fixed electrode overlying the anchor material is a monocrystalline silicon or a polycrystalline silicon.

28. The device of claim 22 wherein the second encapsulation layer is an epitaxially deposited polycrystalline silicon.

29. The device of claim 22 further including a third encapsulation layer disposed on the second encapsulation layer.

30. The device of claim 29 wherein the third encapsulation layer is a metal material including aluminum, chromium, gold, silver, molybdenum, platinum, palladium, tungsten, titanium, silicide and/or copper.

31. The device of claim 29 wherein the third encapsulation layer is an insulating material including silicon oxide, silicon nitride, BPSG, PSG and/or SOG.

32. The device of claim 22 further including:

a contact; and

a trench, disposed around at least a portion of the contact, wherein the trench is disposed outside the chamber and wherein the trench includes an insulating material disposed therein.

33. The device of claim 32 wherein the trench surrounds a portion of the contact that is disposed outside of the chamber.

34. The device of claim 32 wherein the insulating material disposed in the trench is silicon nitride or silicon oxide.