Three-axis integrated MEMS accelerometer

• US 7,318,349 B2
• Filed: 06/04/2005
• Issued: 01/15/2008
• Est. Priority Date: 06/04/2005
• Status: Expired due to Fees

• Current Assignee: Nickolai Belov, Vladimir Vaganov
• Original Assignee: Nickolai Belov, Vladimir Vaganov
• Inventors: Belov, Nickolai, Vaganov, Vladimir
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US11/160,004
• Publication Number:
  US 20060272413A1
• Time in Patent Office: 955 Days
• Field of Search: 735/143.3, 735/143.6, 735/143.8
• US Class Current: 73/514.33
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/084 the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass

Abstract

3D accelerometer for measuring three components of inertial force (or acceleration) vector with respect to an orthogonal coordinate system, which has high sensitivity due to a big proof mass located within a cavity beneath the surface of the sensor die. The size of the cavity and the size of the proof mass exceed the corresponding overall dimensions of the elastic element. The sensor structure occupies a very small area at the surface of the die increasing the area for ICs need to be integrated on the same chip.

Claims

1. A three-axis accelerometer for determining components of an inertial force vector with respect to an orthogonal coordinate system, the accelerometer comprising:

a sensor die having side 1 and opposite side 2, die made of a semiconductor substrate consisting of layer 1 and layer 2 of semiconductor materials attached to each other and having a at least one cavity at the interface between the layer 1 and layer 2, cavity made within the thickness of at least one of the layers 1 or 2;

the cavity has overall dimensions and has a projection on the plane of side 1 of the sensor die;

the sensor die comprising;

a frame element consisting of part 1 having thickness and part 2 having uniform thickness smaller than thickness of part 1;

part 2 is located within the projection of the cavity, surrounded by part 1 in the plane of side 1 and occupies an area on the side 1 of the sensor die;

a proof mass element located within the semiconductor substrate, having overall dimensions, having a projection on the plane of side 1 of the sensor die and occupying an area on the side 1 of the sensor die;

an elastic element having overall dimensions and occupying an area on the side 1 of the sensor die;

elastic element mechanically couples the frame element and the proof mass element on side 1, wherein an inertial force applied to the proof mass element induces stress in the elastic element;

mechanical-stress sensitive IC components located on elastic element and providing signals for determining components of applied inertial force;

at least one digital signal processing circuit coupled to accelerometer for processing signals from stress-sensitive IC components;

at least one cap having thickness and mechanically coupled to the frame element from at least the side 2 of the sensor die,

whereby for the purpose of minimizing the area occupied by both proof mass element and elastic element on the side 1 of the sensor die without decreasing the sensor sensitivity;

the area occupying by both proof mass element and elastic element on the side 1 of the sensor die is made smaller than the area occupying by part 2 of the frame on the side 1 of the sensor die;

at least one digital signal processing circuit is integrated within part 2 of the sensor die frame;

the overall dimensions of the cavity in the plane of side 1 of the sensor die exceed the corresponding overall dimensions of the elastic element and the elastic element is located within the projection of the cavity;

at least two overall dimensions of the proof mass element exceed the corresponding overall dimensions of the elastic element and

part 2 of the frame at least partially is located within the projection of the proof mass element.

2. A three-axis accelerometer of claim 1, further comprising a proof mass, thickness of which exceeds thickness of part 1 of the frame but is less than the combined thickness of the part 1 of the frame and the cap coupled to the side 2 of the sensor die.

3. A three-axis accelerometer of claim 1, wherein the elastic element has at least one opening in its thickness dimension.

4. A three-axis accelerometer of claim 1, wherein the elastic element has at least two portions of different thickness.

5. A three-axis accelerometer of claim 1, where the elastic element in the sensor die has the shape chosen from the group of shapes consisting of:

ring, perforated ring, n-sided faceted geometry, beams, tethers, springs and combinations of these shapes.

6. A three-axis accelerometer of claim 1, wherein the elastic element contains at least one stress concentrating element having a shape selected from a group of shapes consisting of:

V-groove, trapezoidal groove, a groove with the sidewalls forming an angle in the range of 85 degrees to 95 degrees with the surface of the elastic element, pyramid, prism, ridge, rim, boss, mesa and combinations of these shapes.

7. A three-axis accelerometer of claim 1, wherein at least one digital signal processing circuit providing one or more functions from a group of functions consisting of:

providing reference signals, signal conditioning, signal amplification, multiplexing, signal filtering, analog-to-digital conversion, analog-to-frequency conversion, acceleration dependent oscillation, signal processing, synchronization, voltage stabilization, current stabilization, memory, temperature compensation, digital interface, power management, transmitting and receiving radio-signals.

8. A three-axis accelerometer of claim 1, further comprising components used in other sensors chosen from the group of sensors consisting of:

temperature sensor, magnetic sensor, radiation sensor, optical sensor, image sensor, humidity sensor, chemical sensor, pressure sensor, tactile sensor, force sensor, acoustic sensor, angular rate sensor, mass flow sensor.

9. A three-axis accelerometer of claim 1, wherein the stress sensitive IC components are chosen from the group consisting of:

a piezoresistor, a p-n junction, a tunnel diode, a Schottky diode, a shear stress component, a piezoresistive Wheatstone bridge, a MOS transistor, a complementary pair of CMOS transistors, a bipolar transistor, a pair of p-n-p and n-p-n bipolar transistors, a bipolar transistor and at least one piezoresistor, a MOS transistor and at least one piezoresistor connected to transistor, a bipolar transistor circuit, and a CMOS transistor circuit.

10. A three-axis accelerometer of claim 1, wherein the inertial force induces stress in the elastic element not exceeding critical stress and the elastic element creates a restoring force applied to the proof mass, further comprising at least four mechanical stops limiting linear and angular displacements of a proof mass element caused by inertial force applied in any direction;

at least four mechanical stops;

have contact area and characterized by a specific sticking force, equals to sticking force per unit area, originating within a contact area between a contact surface of stops and a contact surface of the other parts of accelerometer at the moment of contact;

have contact area smaller than the ratio of the restoring force at the moment of contact to the specific sticking force and;

have the distance between the contact surface of stops and a contact surface of the other parts of accelerometer greater than the displacement of the proof mass corresponding to the range of measurement plus the additional displacement of the proof mass creating the restoring force greater than the specific sticking force multiplied by the contact area of the stops and smaller than the displacement of the proof mass corresponding to the critical mechanical stress in the elastic element;

whereby at least part of at least one stop is located within at least one cavity.

11. A three-axis accelerometer of claim 10, wherein at least one mechanical stop consists of two parts of different height, part 1 and part 2, part 1 limIts displacement of the proof mass element under applied inertial force exceeding the measurement range in lateral X or Y directions and part 2 limits displacement of the proof mass element under applied inertial force exceeding the measurement range in normal Z direction.