Method for assembling parts made of materials based on SiC by non-reactive refractory brazing, brazing composition, and joint and assembly obtained by said method

• US 7,318,547 B2
• Filed: 03/13/2001
• Issued: 01/15/2008
• Est. Priority Date: 03/14/2000
• Status: Expired due to Term

• Current Assignee: Energies Alternatives Commissariat A L'Energie Atomique et AUX, Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Original Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Inventors: Gasse, Adrien
• Primary Examiner(s): Kerns; Kevin P.
• Application Number:
  US10/221,347
• Publication Number:
  US 20030038166A1
• Time in Patent Office: 2,499 Days
• Field of Search: 228/247, 228/194, 228/198, 228/56.3, 420/578
• US Class Current: 228/247
• CPC Class Codes: B23K 1/19 taking account of the properties of the materials to be soldered
• CPC Class Codes: B23K 35/30 with the principal constituent melting at less than 1550 degrees C
• CPC Class Codes: C04B 2235/3826 Silicon carbides
• CPC Class Codes: C04B 2235/422 Carbon
• CPC Class Codes: C04B 2235/5244 Silicon carbide
• CPC Class Codes: C04B 2235/5248 Carbon, e.g. graphite
• CPC Class Codes: C04B 2235/5427 millimeter or submillimeter sized, i.e. larger than 0,1 mm
• CPC Class Codes: C04B 2235/5436 micrometer sized, i.e. from 1 to 100 micron
• CPC Class Codes: C04B 2235/652 Reduction treatment C04B2235/664 takes precedence
• CPC Class Codes: C04B 2235/6565 Cooling rate
• CPC Class Codes: C04B 2235/6567 Treatment time
• CPC Class Codes: C04B 2235/6581 Total pressure below 1 atmosphere, e.g. vacuum
• CPC Class Codes: C04B 2237/08 Non-oxidic interlayers
• CPC Class Codes: C04B 2237/083 Carbide interlayers, e.g. silicon carbide interlayers
• CPC Class Codes: C04B 2237/086 Carbon interlayers
• CPC Class Codes: C04B 2237/09 wherein the active component for bonding is not the largest fraction of the interlayer
• CPC Class Codes: C04B 2237/12 Metallic interlayers
• CPC Class Codes: C04B 2237/122 based on refractory metals
• CPC Class Codes: C04B 2237/123 based on iron group metals, e.g. steel
• CPC Class Codes: C04B 2237/125 based on noble metals, e.g. silver
• CPC Class Codes: C04B 2237/126 : wherein the active component for bonding is not the largest fraction of the interlayer
• CPC Class Codes: C04B 2237/127 : The active component for bonding being a refractory metal
• CPC Class Codes: C04B 2237/128 : The active component for bonding being silicon
• CPC Class Codes: C04B 2237/16 : Silicon interlayers
• CPC Class Codes: C04B 2237/363 : Carbon
• CPC Class Codes: C04B 2237/365 : Silicon carbide
• CPC Class Codes: C04B 2237/38 : Fiber or whisker reinforced
• CPC Class Codes: C04B 2237/52 : Pre-treatment of the joining surfaces, e.g. cleaning, machining
• CPC Class Codes: C04B 2237/708 : of one or more of the interlayers
• CPC Class Codes: C04B 2237/72 : Forming laminates or joined articles comprising at least two interlayers directly next to each other
• CPC Class Codes: C04B 37/005 : consisting of glass or ceramic material
• CPC Class Codes: C04B 37/006 : consisting of metals or metal salts

Abstract

Method for assembling at least two pieces of silicon carbide based materials by non reactive refractory brazing, wherein these pieces are put into contact with a non reactive brazing solder composition and the assembly formed by the pieces and the brazing solder composition is heated to a brazing temperature sufficient to fuse the brazing solder composition in order to form a refractory joint, in which the non reactive brazing solder composition is constituted, in atomic percentages, of from 40 to 97% silicon and of from 60 to 3% of another element chosen in the group consisting of chromium, rhenium, vanadium, ruthenium, iridium, rhodium, palladium, cobalt, platinum, cerium and zirconium and wherein, before brazing, a strengthening agent of SiC and/or C is added.

Brazing solder composition, composition for refractory brazing. Refractory joint and assembly obtained by the method.

Claims

1. A non-reactive refractory brazing solder binary silicide composition selected from the group consisting of:

a brazing solder composition consisting, in atomic percentages, of from 40 to 97% silicon and of from 60 to 3% rhenium;

a brazing solder composition consisting, in atomic percentages, of from 45 to 97% silicon and of from 55 to 3% ruthenium;

a brazing solder composition consisting, in atomic percentages, of from 48 to 97% silicon and of from 52 to 3% iridium; and

a brazing solder composition consisting, in atomic percentages, of from 53 to 97% silicon and of from 47 to 3% cerium.

2. A composition for non-reactive refractory brazing of pieces of silicon carbide based materials, said composition comprising about 5 to 60% by weight of a strengthening agent of SiC and/or C, and a non-reactive brazing solder composition selected from the group consisting of the following compositions:

a brazing solder composition comprising, in atomic percentages, of from 40 to 97% silicon and of from 60 to 3% rhenium;

a brazing solder composition comprising, in atomic percentages, of from 45 to 97% silicon and of from 55 to 3% ruthenium;

a brazing solder composition comprising, in atomic percentages, of from 48 to 97% silicon and of from 52 to 3% iridium;

a brazing solder composition comprising, in atomic percentages, of from 53 to 97% silicon and of from 47 to 3% cerium;

a brazing solder composition comprising, in atomic percentages, of from 55 to 97% silicon and of from 45 to 3% vanadium;

a brazing solder composition comprising, in atomic percentages, of from 60 to 97% silicon and of from 40 to 3% zirconium;

a brazing solder composition comprising, in atomic percentages, of from 50 to 97% silicon and of from 50 to 3% rhodium;

a brazing solder composition comprising, in atomic percentages, of from 58 to 97% silicon and of from 42 to 3% cobalt.

3. Refractory joint obtainable by the method comprising assembling at least two pieces of silicon carbide based materials by non-reactive refractory brazing, wherein these pieces are put into contact with a non-reactive brazing solder composition and the assembly formed by the pieces and the brazing solder composition is heated to a brazing temperature sufficient to fuse the composition of the brazing solder in order to form a refractory joint, in which the non-refractory brazing composition is a binary silicide composition comprising, in atomic percentages, of from 40 to 97% silicon and of from 60 to 3% of another element chosen in the group consisting of rhenium, vanadium, ruthenium, iridium, rhodium, cobalt, cerium, and zirconium and wherein, before brazing, about 5 to 60% by weight of a strengthening agent of SiC and/or C is added to the brazing solder composition.

4. Assembly comprising at least two pieces of SiC based materials, obtainable by the method comprising assembling at least two pieces of silicon carbide based materials by non-reactive refractory brazing, wherein these pieces are put into contact with a non-reactive brazing solder composition and the assembly formed by the pieces and the brazing solder composition is heated to a brazing temperature sufficient to fuse the composition of the brazing solder in order to form a refractory joint, in which the non-refractory brazing composition is a binary suicide composition comprising, in atomic percentages, of from 40 to 97% silicon and of from 60 to 3% of another element chosen in the group consisting of rhenium, vanadium, ruthenium, iridium, rhodium, cobalt, cerium, and zirconium and wherein, before brazing, about 5 to 60% by weight of a strengthening agent of SiC and/or C is added to the brazing solder composition.

5. A non-reactive refractory brazing solder silicide composition selected from the group consisting of:

a brazing solder composition consisting, in atomic percentages, of from 40 to 97% silicon and of from 60 to 3% rhenium;

a brazing solder composition consisting, in atomic percentages, of from 45 to 97% silicon and of from 55 to 3% ruthenium;

a brazing solder composition consisting, in atomic percentages, of from 48 to 97% silicon and of from 52 to 3% iridium; and

a brazing solder composition consisting, in atomic percentages, of from 53 to 97% silicon and of from 47 to 3% cerium.

6. Refractory joint obtainable by the method comprising assembling at least two pieces of silicon carbide based materials by non-reactive refractory brazing, wherein these pieces are put into contact with a non-reactive brazing solder composition and the assembly formed by the pieces and the brazing solder composition is heated to a brazing temperature sufficient to fuse the composition of the brazing solder in order to form a refractory joint, in which the non-refractory brazing composition is a binary suicide composition comprising, in atomic percentages, of from 40 to 97% silicon and of from 60 to 3% of another element chosen in the group consisting of rhenium, vanadium, ruthenium, iridium, rhodium, cobalt, cerium, and zirconium and wherein, before brazing, about 5 to 60% by weight of a strengthening agent of SiC and/or C is placed close to and/or between the pieces to be assembled.

7. Assembly comprising at least two pieces of SiC based materials, obtainable by the method comprising assembling at least two pieces of silicon carbide based materials by non-reactive refractory brazing, wherein these pieces are put into contact with a non-reactive brazing solder composition and the assembly formed by the pieces and the brazing solder composition is heated to a brazing temperature sufficient to fuse the composition of the brazing solder in order to form a refractory joint, in which the non-refractory brazing composition is a binary silicide composition comprising, in atomic percentages, of from 40 to 97% silicon and of from 60 to 3% of another element chosen in the group consisting of rhenium, vanadium, ruthenium, iridium, rhodium, cobalt, cerium, and zirconium and wherein, before brazing, about 5 to 60% by weight of a strengthening agent of SiC and/or C is placed close to and/or between the pieces to be assembled.