Hinged bonding of micromechanical devices
First Claim
1. A partially completed electronic circuit controllable MEMS device comprising the combination of:
- an edge hinges-inclusive multi layer covered sacrificial first substrate member;
a MEMS module protective shield member pivotally received on said sacrificial first substrate edge hinges;
a MEMS module suspended from said MEMS module protective shield member by a plurality of severable tether members;
a MEMS module protective shield member latch assembly supporting said MEMS module protective shield member and said MEMS module in a selected substrate-removed location; and
a second substrate member-received MEMS controller electronic circuit die located in said selected substrate-removed location within severable tether members distance of a said latch assembly-stabilized MEMS module protective shield member in an orientation of subsequently-electable aligned physical unification engagement with said MEMS module;
said MEMS module protective shield member enabling safe manipulative positioning and safe liquid bath-engagement of said MEMS module during removed substrate, tethered, handling, positioning and processing of said module.
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Accused Products
Abstract
A locked hinge based technique for controllably holding surface-micromachined modules off the edge of a substrate for subsequent processing. The mechanism enables reliable, accurate, and low-cost fabrication of even complex multi layer flip-chip MEMS devices using for example only a simple two-layer module processing sequence, a sequence involving materials already in use in the process. The sequence is also free from the interference of an alignment-hindering sacrificial substrate member. The technique is disclosed by way of a micromirror example and is arranged for convenient bypassing where use of another bonding technique is desired.
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Citations
8 Claims
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1. A partially completed electronic circuit controllable MEMS device comprising the combination of:
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an edge hinges-inclusive multi layer covered sacrificial first substrate member; a MEMS module protective shield member pivotally received on said sacrificial first substrate edge hinges; a MEMS module suspended from said MEMS module protective shield member by a plurality of severable tether members; a MEMS module protective shield member latch assembly supporting said MEMS module protective shield member and said MEMS module in a selected substrate-removed location; and a second substrate member-received MEMS controller electronic circuit die located in said selected substrate-removed location within severable tether members distance of a said latch assembly-stabilized MEMS module protective shield member in an orientation of subsequently-electable aligned physical unification engagement with said MEMS module; said MEMS module protective shield member enabling safe manipulative positioning and safe liquid bath-engagement of said MEMS module during removed substrate, tethered, handling, positioning and processing of said module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification