Semiconductor device having capacitors for reducing power source noise
First Claim
Patent Images
1. A semiconductor device comprising:
- a BGA substrate having one principal plane furnished with a large number of solder balls and a shield plane connected to ground potential;
a first semiconductor chip having a first side and an opposite side, said first semiconductor chip including bumps and active regions formed on the first side, said first semiconductor chip being attached to another principal plane of said BGA substrate through the bumps; and
a first chip capacitor attached to the active regions of said first semiconductor chip, wherein a thickness of said first chip capacitor is less than a thickness of the bumps.
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Abstract
A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconductor chip being electrically connected to the BGA substrate by metal wires; and chip capacitors mounted on the semiconductor chip to reduce power source noise.
34 Citations
6 Claims
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1. A semiconductor device comprising:
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a BGA substrate having one principal plane furnished with a large number of solder balls and a shield plane connected to ground potential; a first semiconductor chip having a first side and an opposite side, said first semiconductor chip including bumps and active regions formed on the first side, said first semiconductor chip being attached to another principal plane of said BGA substrate through the bumps; and a first chip capacitor attached to the active regions of said first semiconductor chip, wherein a thickness of said first chip capacitor is less than a thickness of the bumps. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification