Ball assignment system

• US 7,319,272 B2
• Filed: 04/01/2005
• Issued: 01/15/2008
• Est. Priority Date: 04/01/2005
• Status: Active Grant
• 

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Ramakrishnan, Arun, Miller, Leah M., Ghahghahi, Farshad, Thurairajaratnam, Aritharan
• Primary Examiner(s): Parekh; Nitin
• Application Number:
  US11/097,895
• Publication Number:
  US 20060223341A1
• Time in Patent Office: 1,019 Days
• Field of Search: 257/773, 257/786, 257/698, 257/728, 257/690, 257/E23.07
• US Class Current: 257/773
• CPC Class Codes: H01L 2223/6638 Differential pair signal lines
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/112 directly combined with via connections
• CPC Class Codes: H05K 2201/09227 Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
• CPC Class Codes: H05K 2201/09236 Parallel layout
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array

Abstract

A pattern of contacts that includes high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in transmitter differential pairs. High speed receiver contacts are disposed in a second portion of the pattern, where the first portion of the pattern is not interspersed with the second portion of the pattern, and the high speed receiver contacts are disposed in receiver differential pairs. At least one unbroken line of other contacts is disposed between the first portion of the pattern and the second portion of the pattern, where the other contacts do not contain any high speed transmitter contacts and high speed receiver contacts. Low speed IO contacts are disposed in a third portion of the pattern, where the third portion of the pattern is disposed in an interior portion of the pattern relative to both the first portion of the pattern and the second portion of the pattern. Substantially all of the contacts are disposed at a standard pitch one from another on a single contact surface.

Claims

1. A pattern of contacts comprising:

high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in transmitter differential pairs,

high speed receiver contacts disposed in a second portion of the pattern, where the first portion of the pattern is not interspersed with the second portion of the pattern, and the high speed receiver contacts are disposed in receiver differential pairs,

at least one unbroken line of other contacts disposed between the first portion of the pattern and the second portion of the pattern, where the other contacts do not contain any high speed transmitter contacts and high speed receiver contacts, and

low speed IO contacts disposed in a third portion of the pattern, where a part of the third portion of the pattern is disposed in an interior portion of the pattern relative to both the first portion of the pattern and the second portion of the pattern,

where substantially all of the contacts are disposed at a first pitch one from another on a single contact surface.

2. The pattern of claim 1, wherein the other contacts comprise at least one of VSS contacts and VDD contacts.

3. The pattern of claim 1, wherein adjacent sets of the transmitter differential pairs are offset one from another by at least one contact position.

4. The pattern of claim 1, wherein adjacent sets of the receiver differential pairs are offset one from another by at least one contact position.

5. The pattern of claim 1, further comprising transmitter via lands electrically connected to the high speed transmitter contacts, where only one each of the transmitter via lands is electrically connected to only one each of the high speed transmitter contacts, and the transmitter via lands for two adjacent sets of transmitter differential pairs are disposed one from another at a distance of at least about the first pitch times the square root of two.

6. The pattern of claim 1, further comprising receiver via lands electrically connected to the high speed receiver contacts, where only one each of the receiver via lands is electrically connected to only one each of the high speed receiver contacts, and the receiver via lands for two adjacent sets of receiver differential pairs are disposed one from another at a distance of at least about the first pitch times the square root of two.

7. The pattern of claim 1, further comprising transmitter via lands electrically connecting the high speed transmitter contacts on the contact surface to transmitter leads on only one transmitter routing surface, where two each of the transmitter leads are routed out of the pattern between adjacent lines of transmitter via lands.

8. The pattern of claim 1, further comprising receiver via lands electrically connecting the high speed receiver contacts on the contact surface to receiver leads on only one receiver routing surface, where two each of the receiver leads are routed out of the pattern between adjacent lines of receiver via lands.

9. The pattern of claim 1, further comprising transmitter via lands electrically connecting the high speed transmitter contacts on the contact surface to transmitter leads on only two transmitter routing surfaces, where only one each of the transmitter leads are routed out of the pattern between adjacent lines of transmitter via lands.

10. The pattern of claim 1, further comprising receiver via lands electrically connecting the high speed receiver contacts on the contact surface to receiver leads on only two receiver routing surfaces, where only one each of the receiver leads are routed out of the pattern between adjacent lines of receiver via lands.

11. A printed circuit board having a pattern of contacts comprising:

high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in transmitter differential pairs,

high speed receiver contacts disposed in a second portion of the pattern, where the first portion of the pattern is not interspersed with the second portion of the pattern, and the high speed receiver contacts are disposed in receiver differential pairs,

at least one unbroken line of other contacts disposed between the first portion of the pattern and the second portion of the pattern, where the other contacts do not contain any high speed transmitter contacts and high speed receiver contacts, and

low speed IO contacts disposed in a third portion of the pattern, where a part of the third portion of the pattern is disposed in an interior portion of the pattern relative to both the first portion of the pattern and the second portion of the pattern,

where substantially all of the contacts are disposed at a first pitch one from another on a single contact surface.

12. The printed circuit board of claim 11, wherein the other contacts comprise at least one of VSS contacts and VDD contacts.

13. The printed circuit board of claim 11, wherein:

adjacent sets of the transmitter differential pairs are offset one from another by at least one contact position, and

adjacent sets of the receiver differential pairs are offset one from another by at least one contact position.

14. The printed circuit board of claim 11, further comprising:

transmitter via lands electrically connected to the high speed transmitter contacts, where only one each of the transmitter via lands is electrically connected to only one each of the high speed transmitter contacts, and the transmitter via lands for two adjacent sets of transmitter differential pairs are disposed one from another at a distance of at least about the first pitch times the square root of two, and

receiver via lands electrically connected to the high speed receiver contacts, where only one each of the receiver via lands is electrically connected to only one each of the high speed receiver contacts, and the receiver via lands for two adjacent sets of receiver differential pairs are disposed one from another at a distance of at least about the first pitch times the square root of two.

15. The printed circuit board of claim 11, further comprising:

transmitter via lands electrically connecting the high speed transmitter contacts on the contact surface to transmitter leads on only one transmitter routing surface, where two each of the transmitter leads are routed out of the pattern between adjacent lines of transmitter via lands, and

receiver via lands electrically connecting the high speed receiver contacts on the contact surface to receiver leads on only one receiver routing surface, where two each of the receiver leads are routed out of the pattern between adjacent lines of receiver via lands.

16. The printed circuit board of claim 11, further comprising:

transmitter via lands electrically connecting the high speed transmitter contacts on the contact surface to transmitter leads on only two transmitter routing surfaces, where only one each of the transmitter leads are routed out of the pattern between adjacent lines of transmitter via lands, and

receiver via lands electrically connecting the high speed receiver contacts on the contact surface to receiver leads on only two receiver routing surfaces, where only one each of the receiver leads are routed out of the pattern between adjacent lines of receiver via lands.

17. A package substrate having a pattern of contacts comprising:

high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in transmitter differential pairs,

high speed receiver contacts disposed in a second portion of the pattern, where the first portion of the pattern is not interspersed with the second portion of the pattern, and the high speed receiver contacts are disposed in receiver differential pairs,

at least one unbroken line of other contacts disposed between the first portion of the pattern and the second portion of the pattern, where the other contacts do not contain any high speed transmitter contacts and high speed receiver contacts, and

low speed IO contacts disposed in a third portion of the pattern, where a part of the third portion of the pattern is disposed in an interior portion of the pattern relative to both the first portion of the pattern and the second portion of the pattern,

where substantially all of the contacts are disposed at a first pitch one from another on a single contact surface.

18. The package substrate of claim 17, wherein the other contacts comprise at least one of VSS contacts and VDD contacts.

19. The package substrate of claim 17, wherein:

adjacent sets of the transmitter differential pairs are offset one from another by at least one contact position, and

adjacent sets of the receiver differential pairs are offset one from another by at least one contact position.

20. The package substrate of claim 17, further comprising:

transmitter via lands electrically connected to the high speed transmitter contacts, where only one each of the transmitter via lands is electrically connected to only one each of the high speed transmitter contacts, and the transmitter via lands for two adjacent sets of transmitter differential pairs are disposed one from another at a distance of at least about the first pitch times the square root of two, and

receiver via lands electrically connected to the high speed receiver contacts, where only one each of the receiver via lands is electrically connected to only one each of the high speed receiver contacts, and the receiver via lands for two adjacent sets of receiver differential pairs are disposed one from another at a distance of at least about the first pitch times the square root of two.