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Adhesion by plasma conditioning of semiconductor chip

  • US 7,319,275 B2
  • Filed: 02/01/2005
  • Issued: 01/15/2008
  • Est. Priority Date: 09/14/2001
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device comprising:

  • an integrated circuit chip having active and passive surfaces, said active surface polymer-coated with a roughened surface opposing said active surface and having a plurality of electrical coupling members coupled to said active surface;

    a substrate,said chip assembled face-down onto said substrate, said coupling members forming a gap between said polymer coat and said substrate; and

    polymeric underfill material filling said gap, said underfill material adhering to said polymer-coat and said substrate;

    said adhesion of said underfill material being sufficiently strong so that a force applied externally to said semiconductor device breaks said substrate prior to or rather than breaking the interface between said underfill and said polymer-coat and/or said substrate.

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