Adhesion by plasma conditioning of semiconductor chip
First Claim
1. A semiconductor device comprising:
- an integrated circuit chip having active and passive surfaces, said active surface polymer-coated with a roughened surface opposing said active surface and having a plurality of electrical coupling members coupled to said active surface;
a substrate,said chip assembled face-down onto said substrate, said coupling members forming a gap between said polymer coat and said substrate; and
polymeric underfill material filling said gap, said underfill material adhering to said polymer-coat and said substrate;
said adhesion of said underfill material being sufficiently strong so that a force applied externally to said semiconductor device breaks said substrate prior to or rather than breaking the interface between said underfill and said polymer-coat and/or said substrate.
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Abstract
A plasma conditioning method of improving the adhesion between an integrated circuit chip, having active and passive surfaces, the active surface polymer-coated and having a plurality of electrical coupling members, and an insulating underfill material. The method comprises the steps of positioning a wafer having a plurality of integrated circuits, including the coupling members, in a vacuum chamber of a plasma apparatus so that the polymer-coated surface faces the plasma source. Next, a plasma is initiated; the ion mean free path is controlled so that the ions reach the wafer surface with predetermined energy. The wafer surface is then exposed to the plasma for a length of time sufficient to roughen the polymer surface, clean the polymer surface from organic contamination and improve the surface affinity to adhesion. The adhesion ability of this surface to organic underfill material is thus enhanced.
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Citations
10 Claims
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1. A semiconductor device comprising:
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an integrated circuit chip having active and passive surfaces, said active surface polymer-coated with a roughened surface opposing said active surface and having a plurality of electrical coupling members coupled to said active surface; a substrate, said chip assembled face-down onto said substrate, said coupling members forming a gap between said polymer coat and said substrate; and polymeric underfill material filling said gap, said underfill material adhering to said polymer-coat and said substrate; said adhesion of said underfill material being sufficiently strong so that a force applied externally to said semiconductor device breaks said substrate prior to or rather than breaking the interface between said underfill and said polymer-coat and/or said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification