System and method for analyzing electrical failure data

• US 7,319,935 B2
• Filed: 02/12/2003
• Issued: 01/15/2008
• Est. Priority Date: 02/12/2003
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Major, Karl L., Eyolfson, Mark, Langworthy, Chris, Sun, Xueqing
• Primary Examiner(s): Hoff; Marc S.
• Assistant Examiner(s): Charioui; Mohamed
• Application Number:
  US10/365,997
• Publication Number:
  US 20040158783A1
• Time in Patent Office: 1,798 Days
• Field of Search: 702 57- 59, 702/68, 702/81, 702117-120, 702/150, 702/179, 702/62, 702/80, 702/90, 702/122, 702/168, 702182-184, 702/188, 700/58, 700/83, 700/95, 438/10, 438/14, 438/17, 714/25, 714/37, 365/201, 382/141, 356/237.1, 356/237.2, 356/237.4
• US Class Current: 702/59
• CPC Class Codes: G01R 31/318511 Wafer Test
• CPC Class Codes: G01R 31/319 Tester hardware, i.e. output processing circuits
• CPC Class Codes: G11C 2029/5604 Display of error information
• CPC Class Codes: G11C 2029/5606 Error catch memory
• CPC Class Codes: G11C 29/006 at wafer scale level, i.e. wafer scale integration [WSI]
• CPC Class Codes: G11C 29/56 External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
• CPC Class Codes: H01L 2223/54406 comprising alphanumeric information
• CPC Class Codes: H01L 2223/5442 comprising non digital, non alphanumeric information, e.g. symbols

Abstract

A system and method to perform analysis on test results of multiple integrated circuits. Based on the analysis, the system and method display a wafer map having map indicators representing statistical values of the test results.

Claims

1. A method comprising:

inputting requested information;

retrieving data associated with a group of wafers based on the requested information, wherein each wafer in the group of wafers includes one or more circuit dice, wherein each of the circuit dice is located at a coordinate;

performing a calculation on the data;

displaying a wafer map, wherein the wafer map includes a plurality of map sections representing the circuit dice of the group of wafers, wherein each of the map sections includes a single symbol representing a calculation result for electrical failure for the circuit dice, wherein each of the circuit dice belongs to a separate wafer among the group of wafers, and wherein the circuit dice are located at the same coordinate.

2. The method of claim 1, wherein the single symbol represents a total number of all failures of a particular type of circuit dice at the same coordinate.

3. The method of claim 1, wherein the single symbol represents a number of circuit dice at the same coordinate with at least one failure of any type.

4. The method of claim 1, wherein the single symbol represents an average number of failures of a particular type of circuit dice at the same coordinate.

5. The method of claim 1, wherein the single symbol represents a mean value of circuit dice at the same coordinate with at least one failure of a particular type.

6. The method of claim 1, wherein the requested information includes one or more of the following:

a statistical category, failure category used during testing of the wafers, type of the wafers, and range of date of the data associated with a group of wafers.

7. The method of claim 1, wherein the data associated with a group of wafers includes a number of failures of a certain failure category recorded during a test of the group of wafers.

8. The method of claim 1, wherein the coordinate is a two dimensional coordinate.

9. The method of claim 1, wherein the single symbol represents a range of values of the calculation result.

61. The system of claim 1, wherein the data associated with the group of wafers includes test results of the group of wafers.

62. The system of claim 61, wherein the test results include results of electrical function tested on the group of wafers.

63. The system of claim 1, wherein the requested information includes one or more of the following:

a statistical category, failure category used during testing of the group of wafers, type of the group of wafers, and range of date of the data associated with the group of wafers.

64. The system of claim 1, wherein the calculating unit includes any combination of a memory device for holding programming instructions and a logic circuit for performing math functions.

10. A system comprising:

a tester for testing a plurality of wafers;

a storage unit connected to the tester for storing test results from testing the wafers; and

an analyzer connected to the storage unit for analyzing the test results, the analyzer including;

a calculating unit for performing a calculation on the test results; and

a display unit for displaying results from the calculation in the form of a wafer map, wherein the wafer map includes a plurality of map sections representing the circuit dice of the plurality of wafers, wherein each of the map sections includes a single indicator representing a calculation result for electrical failure for the circuit dice, wherein each of the circuit dice belongs to a separate wafer among the plurality of wafers, and wherein the circuit dice are located at the same coordinate.

11. The system of claim 10, further comprising a communication interface for communicating data to and from the system.

12. The system of claim 11, wherein the communication interface includes any combination of a modem, a network card, a wireless receiver, and a wireless transmitter.

13. The system of claim 10, wherein the input device is selected from the group consisting of a keyboard, a computer mouse, and a touch pad.

14. The system of claim 10, wherein the analyzer includes a processor.

15. The system of claim 10, wherein the calculating unit includes any combination of a memory device for holding programming instructions and logic circuits for performing math functions.

16. The system of claim 10, wherein the circuit dice of the plurality of wafers include memory devices.

17. The system of claim 10, wherein the circuit dice of the plurality of wafers include processors.

18. A machine-readable medium having instructions stored thereon for causing a machine to perform a method, the method comprising:

inputting requested information;

retrieving data associated with a group of wafers based on the requested information, wherein each wafer in the group of wafers includes one or more circuit dice, wherein each of the circuit dice is located at a coordinate;

performing a calculation on the data associated with the group of wafers;

displaying a wafer map, wherein the wafer map includes a plurality of map sections representing the circuit dice of the group of wafers, wherein each of the map sections includes a single indicator representing a calculation result for electrical failure for the circuit dice, wherein each of the circuit dice belongs to a separate wafer among the group of wafers, and wherein the circuit dice are located at the same coordinate.

19. The machine-readable medium of claim 18 includes an optical disk.

20. The machine-readable medium of claim 18 includes a magnetic disk.

21. The machine-readable medium of claim 18, wherein the requested information includes one or more of the following:

a statistical category, failure category used during testing of the wafers, type of the wafers, and range of date of the data associated with the group of wafers.

22. The machine-readable medium of claim 18, wherein the data associated with the group of wafers includes a number of failures of a certain failure category recorded during a test of the group of wafers.

23. The machine-readable medium of claim 18, wherein the calculation result include one of the following:

a total number of failures of circuit dice at the same coordinate, a number of circuit dice at the same coordinate with at least one failure, an average number of failures of circuit dice at the same coordinate, and a mean value of circuit dice at the same coordinate with at least one failure.

24. The machine-readable medium of claim 18, wherein each of the map sections is located at a coordinate matching a coordinate of one of the circuit dice of each wafer of the group of wafers.

25. The machine-readable medium of claim 18, wherein the coordinate is a two dimensional coordinate.

26. A method comprising:

inputting requested information;

retrieving data associated with a group of wafers based on the requested information, wherein each wafer in the group of wafers includes one or more circuit dice, wherein each of the circuit dice is located at a coordinate;

performing a calculation on the data;

displaying a wafer map, wherein the wafer map includes a plurality of map sections representing the circuit dice of the group of wafers, wherein each of the map sections includes a number representing a calculation result for circuit dice located at the same coordinate among the wafers.

27. The method of claim 26, wherein the number represents a total number of all failures of a particular type of circuit dice at the same coordinate.

28. The method of claim 26, wherein the number represents a number of circuit dice at the same coordinate with at least one failure of any type.

29. The method of claim 26, wherein the number represents an average number of failures of a particular type of circuit dice at the same coordinate.

30. The method of claim 26, wherein the number represents a mean value of circuit dice at the same coordinate with at least one failure of a particular type.

31. The method of claim 26, wherein the requested information includes one or more of the following:

a statistical category, failure category used during testing of the wafers, type of the wafers, and range of date of the data.

32. The method of claim 26, wherein the data includes a number of failures of a certain failure category recorded during a test of the group of wafers.

33. The method of claim 26, wherein the coordinate is a two dimensional coordinate.

34. A method comprising:

inputting requested information;

retrieving data associated with a group of wafers based on the requested information, wherein each wafer in the group of wafers includes one or more circuit dice, wherein each of the circuit dice is located at a coordinate;

performing a calculation on the data associated with a group of wafers;

displaying a wafer map, wherein the wafer map includes a plurality of map sections representing the circuit dice of the group of wafers, wherein each of the map sections includes a single color representing a calculation result for electrical failure for the circuit dice, wherein each of the circuit dice belongs to a separate wafer among the group of wafers, and wherein the circuit dice are located at the same coordinate.

35. The method of claim 34, wherein the single color represents a total number of all failures of a particular type of circuit dice at the same coordinate.

36. The method of claim 34, wherein the single color represents a number of circuit dice at the same coordinate with at least one failure of any type.

37. The method of claim 34, wherein the single color represents an average number of failures of a particular type of circuit dice at the same coordinate.

38. The method of claim 34, wherein the single color represents a mean value of circuit dice at the same coordinate with at least one failure of a particular type.

39. The method of claim 34, wherein the requested information includes one or more of the following:

a statistical category, failure category used during testing of the wafers, type of the wafers, and range of date of the data associated with a group of wafers.

40. The method of claim 34, wherein the data associated with a group of wafers includes a number of failures of a certain failure category recorded during a test of the group of wafers.

41. The method of claim 34, wherein the coordinate is a two dimensional coordinate.

42. A system comprising:

an input device for inputting requested information;

a controller connected to the input unit for retrieving data associated with a group of wafers based on the requested information, wherein each wafer in the group of wafers includes at least one circuit dice, wherein each of the circuit dice is located at a coordinate;

a calculating unit for performing a calculation on the data associated with the group of wafers; and

a display unit for displaying results from the calculation in the form of a wafer map, wherein the wafer map includes a plurality of map sections representing the circuit dice of the group of wafers, wherein each of the map sections is configured for simultaneously displaying a first displaying element and a second displaying element, wherein each of the first and second displaying elements represents a calculation result for electrical failure of the circuit dice, wherein each of the circuit dice belongs to a separate wafer among the group of wafers, and wherein the circuit dice are located at the same coordinate.

43. The system of claim 42, wherein the first displaying element includes a symbol, and wherein the second displaying element includes a number.

44. The system of claim 42, wherein the first displaying element includes a symbol, and wherein the second displaying element includes a color.

45. The system of claim 42, wherein the calculation result represented by each of the first and second displaying elements includes a total number for electrical failures for the circuit dice at the same coordinate.

46. The system of claim 42, wherein the calculation result represented by each of the first and second displaying elements includes a number of circuit dice at the same coordinate with at least one electrical failure.

47. The system of claim 42, wherein the calculation result represented by each of the first and second displaying elements includes an average number for electrical failures for the circuit dice at the same coordinate.

48. The system of claim 42, wherein calculation result represented by each of the first and second displaying elements includes a mean value of circuit dice at the same coordinate with at least one electrical failure.

49. A method comprising:

inputting requested information;

retrieving data associated with a group of wafers based on the requested information, wherein each wafer in the group of wafers includes one or more circuit dice, wherein each of the circuit dice is located at a coordinate;

performing a calculation on the data associated with the group of wafers;

displaying a wafer map, wherein the wafer map includes a plurality of map sections representing the circuit dice of the group of wafers, wherein each of the map sections includes a single indicator representing a calculation result for electrical failure for the circuit dice, wherein each of the circuit dice belongs to a separate wafer among the group of wafers, and wherein the circuit dice are located at the same coordinate.

50. The method of claim 49, wherein the requested information includes one or more of the following:

a statistical category, failure category used during testing of the wafers, type of the wafers, and range of date of the data associated with a group of wafers.

51. The method of claim 49, wherein the data associated with the group of wafers includes a number of failures of a certain failure category recorded during a test of the group of wafers.

52. The method of claim 49, wherein the calculation result include one of the following:

a total number of failures of circuit dice at the same coordinate, a number of circuit dice at the same coordinate with at least one failure, an average number of failures of circuit dice at the same coordinate, and a mean value of circuit dice at the same coordinate with at least one failure.

53. The method of claim 49, wherein each of the map sections is located at a coordinate matching a coordinate of one of the circuit dice of each wafer of the group of wafers.

54. The method of claim 49, wherein the coordinate is a two dimensional coordinate.

55. A system comprising:

an input device for inputting requested information;

a controller connected to the input unit for retrieving data associated with a group of wafers based on the requested information, wherein each wafer in the group of wafers includes at least one circuit dice, wherein each of the circuit dice is located at a coordinate;

a calculating unit for performing a calculation on the data associated with the group of wafers; and

a display unit for displaying results from the calculation in the form of a wafer map, wherein the wafer map includes a plurality of map sections representing the circuit dice of the group of wafers, wherein each of the map sections is configured for displaying a displaying number within a border of each of the map sections, wherein the displaying number represents a calculation result for electrical failure for the circuit dice, wherein each of the circuit dice belongs to a separate wafer among the group of wafers, and wherein the circuit dice are located at the same coordinate.

56. The system of claim 55, wherein the calculation result represented by the displaying number includes a total number for electrical failures for the circuit dice at the same coordinate.

57. The system of claim 55, wherein the calculation result represented by the displaying number includes a number of circuit dice at the same coordinate with at least one electrical failure.

58. The system of claim 55, wherein the calculation result represented by the displaying number includes an average number for electrical failures for the circuit dice at the same coordinate.

59. The system of claim 55, wherein calculation result represented by the displaying number includes a mean value of circuit dice at the same coordinate with at least one electrical failure.

60. A system comprising:

an input device for inputting requested information;

a controller connected to the input unit for retrieving data associated with a group of wafers based on the requested information, wherein each wafer in the group of wafers includes one or more circuit dice, wherein each of the circuit dice is located at a coordinate;

a calculating unit for performing a calculation on the data associated with the group of wafers; and

a display unit for displaying results from the calculation in the form of a wafer map, wherein the wafer map includes a plurality of map sections representing the circuit dice of the group of wafers, wherein each of the map sections includes a single indicator representing a calculation result for electrical failure for the circuit dice, wherein each of the circuit dice belongs to a separate wafer among the group of wafers, and wherein the circuit dice are located at the same coordinate.

65. A method comprising:

inputting requested information;

retrieving data associated with a group of wafers based on the requested information, wherein each wafer in the group of wafers includes one or more circuit dice, wherein each of the circuit dice is located at a coordinate;

performing a calculation on the data;

displaying a wafer map, wherein the wafer map includes a plurality of map sections representing the circuit dice of the group of wafers, wherein each of the map sections includes a color representing a calculation result for circuit dice located at the same coordinate among the wafers, wherein each of the map sections further includes a number representing one of the following;

a total number of failures of circuit dice at the same coordinate, a number of circuit dice at the same coordinate with at least one failure, an average number of failures of circuit dice at the same coordinate, and a mean value of circuit dice at the same coordinate with at least one failure.

66. The method of claim 65, wherein an intensity, brightness, and contrast of the color is controlled by a value of the number in each of the map sections.