Method and apparatus for fault detection classification of multiple tools based upon external data
First Claim
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1. A method, comprising:
- monitoring each of a plurality of tools to determine if a fault condition occurs in any of said tools, each of said tools being comprised of at least one integrated metrology device;
monitoring external data regarding at least one parameter that may impact an operation performed in each of said tools; and
determining if an indicated fault condition in at least one of said tools is a valid fault condition or a systemic fault condition associated with a change in a value of said at least one parameter.
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Abstract
The present invention is generally directed to various methods and systems for fault detection control of multiple tools based upon external data. In one illustrative embodiment, the method includes monitoring each of a plurality of tools to determine if a fault condition occurs in any of the tools, each of the tools being comprised of at least one integrated metrology device, monitoring external data regarding at least one parameter that may impact an operation performed in each of the tools, and determining if an indicated fault condition in at least one of the tools is a valid fault condition or a systemic fault condition associated with a change in a value of the at least one parameter.
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Citations
55 Claims
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1. A method, comprising:
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monitoring each of a plurality of tools to determine if a fault condition occurs in any of said tools, each of said tools being comprised of at least one integrated metrology device; monitoring external data regarding at least one parameter that may impact an operation performed in each of said tools; and determining if an indicated fault condition in at least one of said tools is a valid fault condition or a systemic fault condition associated with a change in a value of said at least one parameter. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method, comprising:
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monitoring each of a plurality of tools to determine if a fault condition occurs in any of said tools, each of said tools being comprised of at least one integrated metrology device; monitoring external data regarding at least one environmental parameter that may impact an operation performed in each of said tools; and determining if an indicated fault condition in at least one of said tools is a valid fault condition or a systemic fault condition associated with a change in a value of said at least one parameter. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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25. A method, comprising:
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monitoring each of a plurality of tools that process at least one wafer to determine if a fault condition occurs in any of said tools, each of said tools being comprised of at least one integrated metrology device; monitoring external data regarding at least one parameter that reflects a physical characteristic of said at least one wafer; and determining if an indicated fault condition in at least one of said tools is a valid fault condition or a systemic fault condition associated with a change in a value of said at least one parameter. - View Dependent Claims (26, 27, 28, 29, 30, 31)
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32. A method, comprising:
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monitoring each of a plurality of process tools that process at least one workpiece to determine if a fault condition occurs in any of said process tools, each of said process tools being comprised of at least one integrated metrology device; monitoring external data regarding at least one parameter that may impact a process operation performed in each of said process tools; and determining if an indicated fault condition in at least one of said process tools, is a valid fault condition or a systemic fault condition associated with a change in a value of said at least one parameter. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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44. A method, comprising:
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monitoring each of a plurality of process tools that process at least one semiconducting wafer to determine if a fault condition occurs in any of said process tools, each of said process tools being comprised of at least one integrated metrology device; monitoring external data regarding at least one environmental parameter that may impact a process operation performed in each of said process tools; and determining if an indicated fault condition in at least one of said process tools is a valid fault condition or a systemic fault condition associated with a change in a value of said at least one parameter. - View Dependent Claims (45, 46, 47, 48, 49)
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50. A method, comprising:
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monitoring each of a plurality of process tools that process at least one wafer to determine if a fault condition occurs in any of said process tools, each of said process tools being comprised of at least one integrated metrology device; monitoring external data regarding at least one parameter that reflects a physical characteristic of said at least one wafer; and determining if an indicated fault condition in at least one of said process tools is a valid fault condition or a systemic fault condition associated with a change in a value of said at least one parameter. - View Dependent Claims (51, 52, 53, 54, 55)
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Specification