Cooling apparatus having low profile extrusion

• US 7,322,400 B2
• Filed: 12/23/2002
• Issued: 01/29/2008
• Est. Priority Date: 06/08/1998
• Status: Expired due to Fees

• Current Assignee: The Thermotek Incorporated
• Original Assignee: The Thermotek Incorporated
• Inventors: DeVilbiss, Roger S., Parish, Overton L. IV
• Primary Examiner(s): Walberg; Teresa J.
• Application Number:
  US10/328,438
• Publication Number:
  US 20030089486A1
• Time in Patent Office: 1,863 Days
• Field of Search: 165/104.14, 165/104.21, 165/104.33, 165/104.26, 165/104.19, 165/80.4, 361/700, 361/697, 361/699, 361/704, 257714-716, 174/15.1
• US Class Current: 165/104.21
• CPC Class Codes: F28D 1/0246 heat-exchange elements having several adjacent conduits forming a whole, e.g. blocks
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0283 Means for filling or sealing heat pipes
• CPC Class Codes: F28D 2015/0225 Microheat pipes
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28D 2021/0031 Radiators for recooling a coolant of cooling systems
• CPC Class Codes: F28F 1/022 with multiple channels
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49353 Heat pipe device making
• CPC Class Codes: Y10T 29/49377 Tube with heat transfer means
• CPC Class Codes: Y10T 29/49378 Finned tube
• CPC Class Codes: Y10T 29/49385 Made from unitary workpiece, i.e., no assembly
• CPC Class Codes: Y10T 29/49396 Condenser, evaporator or vaporizer making

Abstract

A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.

Claims

1. A pumped cooling system for removing heat from at least one heat generating component, said cooling apparatus comprising:

a pumped adapted for pumping a heat transfer fluid;

a heat exchanger;

a low profile extrusion having a profile not greater than about 0.1 inch and defining an interior space, said low profile extrusion having a first exterior surface adapted for receiving heat from the at least one heat generating component, said low profile extrusion connected in fluid communication with the pump and the heat exchanger;

said interior space comprising a plurality of microtubes adapted for receiving the heat transfer fluid therein for flow therethrough for the transfer of heat received from the at least one heat generating component, wherein each microtube has an inlet and an outlet;

said heat exchanger adapted to receive the heat transfer liquid from the interior space and remove heat from the heat transfer fluid;

an inlet end cap in fluid communication with the plurality of microtubes and fluidly interconnecting the microtube inlets;

an outlet end cap in fluid communication with the plurality of microtubes and fluidly interconnecting the microtube outlets; and

wherein at least one of the inlet end cap and the outlet end cap is in direct contact with the at least one heat generating component.

2. The pumped cooling system of claim 1, wherein said interior space is divided by at least one longitudinal member.

3. The pumped cooling system of claim 2, wherein said at least one longitudinal member is offset from vertical.

4. The pumped cooling system of claim 3, wherein said low profile member defines a first end and a second end, wherein said interior space of said low profile member is sealed at each of said first end and said second end.

5. The pumped cooling system of claim 4, wherein said condenser section is elevated with respect to said evaporator section.

6. The pumped cooling system according to claim 1 further comprising:

at least one capillary groove on an interior surface of each of said plurality of micro tubes.

7. The pumped cooling system of claim 1, wherein each of said plurality of micro tubes are connected in fluid communication.

8. The pumped cooling system of claim 7, further comprising a wick within each of said micro tubes.

9. The pumped cooling system of claim 8, wherein said wick is a metal screen.

10. The pumped cooling system of claim 9, wherein a plurality of said low profile extrusions are mounted as fins on a heat sink.

11. The pumped cooling system of claim 10, further comprising:

at least one fin on an interior surface of said interior space.

12. The pumped cooling system of claim 11, further comprising at least one wick within said interior space.

13. The pumped cooling system of claim 12, wherein said wick is a metal screen.

14. The pumped cooling system of claim 1, further comprising at least one thermoelectric cooling unit disposed between said at least one heat generating component and said first exterior extrusion surface.

15. A pumped cooling system and heat generating component combination comprising:

a pump adapted for pumping a heat transfer fluid;

a heat exchanger;

at least one heat generating component;

a low profile extrusion having a profile not greater than about 0.1 and defining an interior space, said low profile extrusion having a first exterior surface adapted for receiving heat from said at least one heat generating component, said low profile extrusion connected in fluid communication with the pump and the heat exchanger;

the interior space comprising a plurality of microtubes adapted for receiving the heat transfer fluid therein for absorbing heat from said at least one heat generating component, said heat transfer fluid being circulated to the heat exchanger from the interior space, wherein the plurality of microtubes are interconnected at their ends so as to provide communication of the heat transfer fluid between each of the plurality of microtubes; and

said heat exchanger adapted to remove heat from the heat transfer fluid,

an inlet end cap in fluid communication with the plurality of microtubes and fluidly interconnecting the microtube inlets;

an outlet end cap in fluid communication with the plurality of microtubes and fluidly interconnecting the microtube outlets; and

wherein at least one of the inlet end cap and the outlet end cap is in direct contact with the at least one heat generating component.

16. The pumped cooling system of claim 15, wherein said interior space is divided by at least one longitudinal member.

17. The pumped cooling system of claim 16, wherein said at least one longitudinal member is offset from vertical.

18. The pumped cooling system of claim 17, wherein said low profile member defines a first end and a second end, wherein said interior space of said low profile member is sealed at each of said first end and said second end.

19. The pumped cooling system of claim 18, wherein the extrusion includes a condenser section which is elevated with respect to an evaporator section.

20. The pumped cooling system according to claim 15 further comprising:

at least one fin on an interior surface of each of said plurality of micro tubes.

21. The pumped cooling system of claim 15, wherein each of said plurality of micro tubes are connected in fluid communication.

22. The pumped cooling system of claim 21, further comprising a wick within each of said micro tubes.

23. The pumped cooling system of claim 22, wherein said wick is a metal screen.

24. The pumped cooling system of claim 23, further comprising:

at least one fin on an interior surface of said interior space.

25. The pumped cooling system of claim 24, wherein a plurality of said low profile extrusions are mounted as fins on a heat sink.

26. The pumped cooling system of claim 25, further comprising at least one wick within said interior space.

27. The pumped cooling system of claim 26, wherein said wick is a metal screen.