Method and system for sizing a load plate

• US 7,323,358 B1
• Filed: 08/13/2003
• Issued: 01/29/2008
• Est. Priority Date: 08/13/2003
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Cromwell, Stephen Daniel
• Primary Examiner(s): Whitehead, Jr.; Carl
• Assistant Examiner(s): Mitchell; James M
• Application Number:
  US10/639,853
• Time in Patent Office: 1,630 Days
• Field of Search: None
• US Class Current: 438/106
• CPC Class Codes: H01L 2023/4081 Compliant clamping elements not primarily serving heat-conduction
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly includes compressing the load plate prior to installation in the ASIC assembly. The compression is adjusted to cause the load plate to provide a target load when installed in the ASIC assembly.

Claims

1. A method of adjusting a load delivered by a load plate for an Application Specific Integrated Circuit (ASIC) assembly, said method comprising:

providing said load plate formed with a curvature; and

after providing said load plate with said curvature, compressing said load plate prior to installing said load plate in said ASIC assembly, said compressing being adjusted to plastically and permanently deform said curvature with which said load plate was originally formed to cause said load plate to provide a target load when installed in said ASIC assembly; and

installing the plate in said ASIC assembly.

2. The method of claim 1, further comprising determining said target load prior to compressing said load plate.

3. The method of claim 2, further comprising compressing a sample of load plates at a variety of different compressions.

4. The method of claim 3, further comprising testing each of said sample of load plates after compression to determine which compression resulted in a load plate providing said target load.

5. The method of claim 4, further comprising compressing other load plates at said compression which resulted in a load plate providing said target load.

6. The method of claim 3, further comprising repeating said compressing of a sample of load plates at a variety of different compressions for each new run of load plates.

7. The method of claim 1, wherein said compressing further comprises compressing said load plate beyond a compression that would be experienced by said load plate when installed in said ASIC assembly.

8. A method of adjusting a load delivered by a load plate in an Application Specific Integrated Circuit (ASIC) assembly, said method comprising:

compressing said load plate prior to installing said load plate in said ASIC assembly, said compressing being adjusted to cause said load plate to provide a target load when installed in said ASIC assembly, and

adjusting a thickness of a load washer based on said target load to be applied by said load plate; and

installing the plate in said ASIC assembly.

9. The method of claim 8, further comprising determining said target load.

10. The method of claim 8, further comprising measuring a spring rate of said load plate.

11. The method of claim 10, further comprising selecting said thickness of said load washer in accordance with said target load and said spring rate of said load plate.

12. The method of claim 9, further comprising compressing a sample of load plates at a variety of different compressions.

13. The method of claim 12, further comprising testing each of said sample of load plates after compression to determine which compression resulted in a load plate providing said target load.

14. The method of claim 13, further comprising compressing other load plates at said compression which resulted in a load plate providing said target load.

15. The method of claim 14, further comprising repeating said compressing of a sample of load plates at a variety of different compressions for each new run of load plates.

16. The method of claim 8, further comprising using said load washer to limit deflection of said load plate to control a load applied to said ASIC assembly in accordance with said target load.

17. The method of claim 8, further comprising sandwiching an ASIC and a circuit board between a bolster plate and a load plate, wherein a load screw is driven into said load plate through said washer.

18. The method of claim 8, further comprising plastically deforming said load plate with said compression of said load plate.

19. A method of adjusting a load delivered by a load plate in an Application Specific Integrated Circuit (ASIC) assembly, said method comprising:

compressing said load plate prior to installing said load plate in said ASIC assembly, said compressing being adjusted to cause said load plate to provide a target load when installed in said ASIC assembly; and

adjusting a thickness of a load washer based on said target load to be applied by said load plate;

wherein said compressing further comprises compressing said load plate beyond a compression that would be experienced by said load plate when installed in said ASIC assembly; and

installing the plate in said ASIC assembly.

20. A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly, said method comprising:

forming a load plate with a curvature; and

after forming said load plate, but prior to installing said load plate in said ASIC assembly, compressing said load plate, said compressing causing said load plate to plastically deform; and

installing the plate in said ASIC assembly.

21. The method of claim 20, wherein said compressing further, comprises compressing said load plate beyond a compression that would be experienced by said load plate when installed in said ASIC assembly.

22. The method of claim 20, wherein said compressing said load plate to plastically deform said load plate is adjusted such that said load plate will provide a target load when installed in said ASIC assembly.