Electronic assemblies with filled no-flow underfill

• US 7,323,360 B2
• Filed: 10/26/2001
• Issued: 01/29/2008
• Est. Priority Date: 10/26/2001
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Intel Corporation
• Inventors: Djukic, Milan, Gonzalez, Carlos A., Shi, Song-Hua
• Primary Examiner(s): Lebentritt; Michael
• Assistant Examiner(s): Mitchell; James M
• Application Number:
  US10/003,238
• Publication Number:
  US 20030080437A1
• Time in Patent Office: 2,286 Days
• Field of Search: 438/108, 438/112, 438/106, 438/124, 438/126, 438/127, 438/FOR.384, 257/778, 257/787, 257/779
• US Class Current: 438/108
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/29036 covering only the central area of the surface to be connected
• CPC Class Codes: H01L 2224/29075 Plural core members
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29386 with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/325 Material
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81193 wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81903 by means of a layer connector
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/05442 : SiO2
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

High yield, high reliability, flip-chip integrated circuit (IC) packages are achieved utilizing a combination of heat and pressure to bond flip-chip die and to cure no-flow underfill material. The underfill comprises a filler or low coefficient of thermal expansion (CTE) material to decrease CTE of the cured underfill. The filler material can be selected from the group comprising silica, silicon oxide, silicon dioxide, silicon nitride, aluminum oxide, aluminum nitride, or a mixture thereof. The filler material may also increase the viscosity of the uncured underfill and/or increase the modulus of elasticity of the cured underfill. In some method embodiments, a thermocompression bonder is used to simultaneously provide solder bump reflow and underfill curing. Application of various methods to a component package, an electronic assembly, and an electronic system are also described.

Claims

1. A component package fabricated by:

depositing an underfill material over a plurality of pads in a component-mounting area of a substrate, the underfill material comprising a filler material containing particles;

placing a component on the component-mounting area, such that terminals of the component are aligned with corresponding pads and substantially enveloped in the underfill material, the particles potentially inhibiting a suitable connection between corresponding terminals and pads unless the particles are substantially removed;

applying suitable pressure to cause the terminals to physically contact the pads and to remove most but not all potentially inhibiting particles from between corresponding terminals and pads, with one or more particles being embedded in one of the terminals, in its corresponding pad, or in both the one terminal and its corresponding pad without preventing adequate physical and electrical contact; and

applying suitable heat to melt solder situated between the terminals and pads, which when cooled results in an electrical and mechanical connection between corresponding terminals and pads.

2. The component package recited in claim 1 and fabricated such that the operations of applying suitable pressure and suitable heat are performed substantially concurrently by apparatus from the group comprising a thermocompression bonder, an ultrasonic bonder, and a component placement tool.

3. The component package recited in claim 1 and fabricated such that the pads are pre-coated with solder, and wherein, in applying suitable heat, the terminals become attached to the pads through the solder.

4. The component package recited in claim 1 and fabricated such that the terminals are pre-coated with solder, and wherein, in applying suitable heat, the terminals become attached to the pads through the solder.

5. The component package recited in claim 1, wherein the filler material is selected from the group consisting of silica, silicon oxide, silicon dioxide, silicon nitride, aluminum oxide, and aluminum nitride.

6. The component package recited in claim 1, wherein the underfill material further comprises a fluxing agent, and wherein, in the operation of applying suitable heat, the fluxing agent cleans the terminals and the pads.

7. An electronic assembly comprising at least one integrated circuit (IC) package fabricated by:

depositing an underfill material over a plurality of pads in an IC mounting area of a substrate, the underfill material comprising a filler material containing particles;

placing an IC on the IC mounting area, such that terminals of the IC are aligned with corresponding pads and substantially enveloped in the underfill material, the particles potentially inhibiting a suitable connection between corresponding terminals and pads unless the particles are substantially removed;

applying suitable pressure to cause the terminals to physically contact the pads and to squeeze out most but not all potentially inhibiting particles from between corresponding terminals and pads, with one or more particles being embedded in one of the terminals, in its corresponding pad, or in both the one terminal and its corresponding pad without preventing adequate physical and electrical contact; and

applying suitable heat to melt solder situated between the terminals and pads, which when cooled results in an electrical and mechanical connection between corresponding terminals and pads.

8. The electronic assembly recited in claim 7 and fabricated such that the operations of applying suitable pressure and suitable heat are performed substantially concurrently by apparatus from the group comprising a thermocompression bonder, an ultrasonic bonder, and a component placement tool.

9. The electronic assembly recited in claim 7, wherein the underfill material comprises a filler material selected from the group consisting of silica, silicon oxide, silicon dioxide, silicon nitride, aluminum oxide, and aluminum nitride.

10. The electronic assembly recited in claim 7, wherein the underfill material further comprises a fluxing agent, and wherein, in the operation of applying suitable heat, the fluxing agent cleans the terminals and the pads.