MEMS RF switch module including a vertical via
First Claim
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1. A system, comprising:
- a printed circuit board (PCB);
a Micro-electromechanical System (MEMS) Radio Frequency (RF) switch module coupled to the PCB, the MEMS RF switch module comprising;
an RF switch array,at least one vertical via to electrically couple the RF switch array to the PCB, anda trace ring to electrically couple the RF switch array to a first vertical via of the at least one vertical via, the trace ring surrounding at least a portion of the RF switch array to allow a signal to transit the MEMS RF switch module using a second vertical via of the at least one vertical via without crossing the trace ring; and
an amplifier electrically coupled to the MEMS RF switch module.
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Abstract
An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.
47 Citations
3 Claims
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1. A system, comprising:
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a printed circuit board (PCB); a Micro-electromechanical System (MEMS) Radio Frequency (RF) switch module coupled to the PCB, the MEMS RF switch module comprising; an RF switch array, at least one vertical via to electrically couple the RF switch array to the PCB, and a trace ring to electrically couple the RF switch array to a first vertical via of the at least one vertical via, the trace ring surrounding at least a portion of the RF switch array to allow a signal to transit the MEMS RF switch module using a second vertical via of the at least one vertical via without crossing the trace ring; and an amplifier electrically coupled to the MEMS RF switch module. - View Dependent Claims (2, 3)
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Specification
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Current AssigneeIntel Corporation
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Original AssigneeIntel Corporation
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InventorsHeck, John M., Hayden, Joseph S. III, Chou, Tsung-Kuan Allen
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Primary Examiner(s)Dinh; Tuan T.
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Assistant Examiner(s)NGUYEN, HOA CAO
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Application NumberUS11/546,595Publication NumberTime in Patent Office475 DaysField of Search361/760, 361/781, 361/783, 174/253, 333/101, 333/105, 333/258, 333/259, 335/78US Class Current361/760CPC Class CodesB81B 2201/018 Switches not provided for i...B81B 7/007 Interconnections between th...H01H 1/0036 Switches making use of micr...H01H 1/5805 Connections to printed circ...H01L 2224/16 of an individual bump conne...
