Optical information processing circuit assembly
First Claim
1. An optical information processing circuit assembly, the assembly comprising:
- an optically transmissive first substrate;
a resiliently compressible circuit member affixed to said first substrate and defining a first opening therethrough with a number of electrically conductive leads disposed about said first opening; and
an integrated circuit having a surface defining a number of electrically conductive pads disposed about an imaging circuit, each of said number of electrically conductive pads electrically contacting corresponding ones of said number of electrically conductive leads with said surface of said integrated circuit facing said first substrate through said first opening defined through said resiliently compressible circuit member.
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Accused Products
Abstract
An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.
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Citations
23 Claims
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1. An optical information processing circuit assembly, the assembly comprising:
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an optically transmissive first substrate; a resiliently compressible circuit member affixed to said first substrate and defining a first opening therethrough with a number of electrically conductive leads disposed about said first opening; and an integrated circuit having a surface defining a number of electrically conductive pads disposed about an imaging circuit, each of said number of electrically conductive pads electrically contacting corresponding ones of said number of electrically conductive leads with said surface of said integrated circuit facing said first substrate through said first opening defined through said resiliently compressible circuit member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. An optical information processing circuit assembly, the assembly comprising:
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an optically transmissive first substrate; a resiliently compressible circuit member affixed to said first substrate and defining a first opening therethrough with a number of electrically conductive leads disposed about said first opening; and circuitry comprising a surface defining a number of electrically conductive pads disposed about an electrooptical device, each of said number of electrically conductive pads electrically contacting corresponding ones of said number of electrically conductive leads with said surface of said circuitry facing said first substrate through said first opening defined through said resiliently compressible circuit member. - View Dependent Claims (22, 23)
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Specification