High serviceability liquid cooling loop using flexible bellows

• US 7,325,588 B2
• Filed: 04/29/2004
• Issued: 02/05/2008
• Est. Priority Date: 04/29/2004
• Status: Active Grant

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Barsun, Stephan K., Simon, Glenn C., Malone, Christopher G.
• Primary Examiner(s): Ciric; Ljiljana
• Application Number:
  US10/837,459
• Publication Number:
  US 20050241799A1
• Time in Patent Office: 1,377 Days
• Field of Search: 165/80.2, 165/80.3, 165/80.4, 165/80.5, 165/80.1, 361/688, 361/689, 361/702, 257/712
• US Class Current: 165/80.2
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source
• CPC Class Codes: H05K 7/20772 within server blades for removing heat from heat source

Abstract

A liquid loop cooling apparatus includes tubing enclosing an interior bore or lumen within which a cooling fluid can circulate, a moveable cold plate rigidly coupled to the tubing, and at least one flexible bellows coupled to the tubing and flexibly enabling movement of the moveable cold plate.

Claims

1. A liquid loop cooling apparatus comprising:

a tubing enclosing an interior lumen within which a cooling fluid can circulate;

a moveable cold plate that rotates between an open position and a closed position rigidly coupled to the tubing; and

at least one flexible bellows coupled to the tubing that flexibly enables movement of the moveable cold plate between the open and closed positions.

2. The cooling apparatus according to claim 1 further comprising:

a heat-dissipating component associated with the moveable cold plate, the cold plate being moveable between the open and closed positions to enable addition, replacement, or removal of the heat-dissipating component.

3. The cooling apparatus according to claim 2 wherein:

the cold plate configured for rotation up and away from the heat-dissipating component to enable access to the heat-dissipating component.

4. The cooling apparatus according to claim 1 further comprising:

a pump coupled to the tubing; and

a liquid-to-air heat exchanger coupled to the tubing.

5. The cooling apparatus according to claim 1 further comprising:

a reservoir coupled to the tubing and capable of accumulating cooling fluid.

6. A computer server comprising:

a chassis;

a plurality of components mounted within the chassis including at least one heat-dissipating component;

a tubing enclosing an interior lumen within which a cooling fluid can circulate;

a moveable cold plate that rotates between an open position and a closed position rigidly coupled to the tubing; and

at least one flexible bellows coupled to the tubing that flexibly enables movement of the moveable cold plate between the open and closed positions.

7. The server according to claim 6 further comprising:

airflow inlet and outlet vents in the chassis; and

at least one fan capable of circulating air from the inlet vents to the outlet vents.

8. The server according to claim 6 further comprising:

a heat-dissipating component associated with the moveable cold plate, the cold plate being moveable between the open and closed positions to enable addition, replacement, or removal of the heat-dissipating component.

9. The server according to claim 6 wherein:

the cold plate configured for rotation up and away from the heat-dissipating component to enable access to the heat-dissipating component.

10. The server according to claim 6 further comprising:

a pump coupled to the tubing; and

a liquid-to-air heat exchanger coupled to the tubing.

11. The server according to claim 6 further comprising:

a reservoir coupled to the tubing and capable of accumulating cooling fluid.

12. A method of arranging a liquid loop cooling system in an electronic system comprising:

providing a cold plate that rotates between an open position and a closed position;

convertibly containing a heat-dissipating component within the cold plate; and

rigidly coupling the cold plate to a liquid loop tubing; and

coupling at least one flexible bellows to the liquid loop tubing to enable convertible rotation of the cold plate between the open and closed positions whereby the heat-dissipating component is selectively accessed or covered.

13. The method according to claim 12 further comprising:

distributing a plurality of electronic system components including at least one heat-dissipating component in a chassis; and

arranging a rigid or semi-rigid tubing enclosing an interior lumen within which a cooling fluid can circulate among the at least one heat-dissipating component in a closed-loop system.

14. The method according to claim 12 further comprising:

rigidly connecting at least one cold plate to the tubing in a location that dissipates heat from a heat-dissipating component.

15. The method according to claim 12 further comprising:

rigidly connecting a pump to the tubing; and

rigidly connecting a liquid-to-air heat exchanger to the tubing.

16. The method according to claim 12 further comprising:

rigidly connecting a reservoir to the tubing.

17. A liquid loop cooling apparatus comprising:

a cold plate component further comprising;

a heat-dissipating component; and

a cover plate that rotates between an open position and a closed position convertibly enclosing the heat-dissipating component;

a tubing coupled to the cold plate component and enclosing an interior lumen within which a cooling fluid can circulate; and

a flexible bellows coupled to the tubing that flexibly enables convertible movement of the cover plate between the open and closed positions.

18. The cooling apparatus according to claim 17 further comprising:

a pump coupled to the tubing; and

a liquid-to-air heat exchanger coupled to the tubing.

19. The cooling apparatus according to claim 17 further comprising:

a reservoir coupled to the tubing and capable of accumulating cooling fluid.

20. A liquid loop cooling apparatus comprising:

means for carrying a circulating cooling fluid among at least one heat-dissipating component in a closed-loop system;

means coupled to the carrying means for dissipating heat;

means for containing the heat dissipating means;

means for convertibly rotating the containing means between an open position and a closed position whereby the heat dissipating means is selectively accessed and covered; and

means coupled to the carrying means for flexibly enabling movement of the convertibly containing means between the open and closed positions whereby the heat dissipating means is selectively accessed or covered.