Trench structure having a void and inductor including the trench structure
First Claim
1. A method of forming a trench structure comprising:
- forming a deep trench having a first width and a first depth on a substrate, wherein forming the deep trench comprises;
forming a pad oxide layer pattern on the substrate;
forming a first nitride layer pattern on the pad oxide layer pattern;
forming a first oxide layer pattern on the first nitride layer pattern;
partially etching the substrate using the first oxide layer pattern, the first nitride layer pattern and the pad oxide layer pattern as etching masks; and
removing the first oxide layer pattern;
forming an enclosed void in the deep trench by filling the deep trench with a first insulation layer pattern in a manner that defines the enclosed void in the deep trench,wherein forming the enclosed void in the deep trench comprises;
forming a second oxide layer pattern on a sidewall of the deep trench;
forming a second nitride layer pattern on the second oxide layer pattern to form an opening in the deep trench; and
forming a third oxide layer pattern on the second nitride layer pattern to complete the enclosed void by covering a top portion of the opening;
forming a shallow trench on the deep trench, the shallow trench having a second width substantially wider than the first width and a second depth substantially shallower than the first depth; and
filling up the shallow trench with a second insulation layer pattern.
1 Assignment
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Accused Products
Abstract
In a method of forming a trench structure having a wide void therein, a first trench having a first width and a first depth is formed in a substrate. The first trench is filled with a first insulation layer pattern defining the void in the first trench. A second trench is formed on the first trench. The second trench has a second width wider than the first width and a second depth shallower than the first depth. The second trench is filled with a second insulation layer pattern. After an insulating interlayer on the substrate including the first and second trenches, a conductive line is formed on a portion of the insulating interlayer where the second trench is positioned so that an inductor is formed over the trench structure.
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Citations
11 Claims
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1. A method of forming a trench structure comprising:
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forming a deep trench having a first width and a first depth on a substrate, wherein forming the deep trench comprises; forming a pad oxide layer pattern on the substrate; forming a first nitride layer pattern on the pad oxide layer pattern; forming a first oxide layer pattern on the first nitride layer pattern; partially etching the substrate using the first oxide layer pattern, the first nitride layer pattern and the pad oxide layer pattern as etching masks; and removing the first oxide layer pattern; forming an enclosed void in the deep trench by filling the deep trench with a first insulation layer pattern in a manner that defines the enclosed void in the deep trench, wherein forming the enclosed void in the deep trench comprises; forming a second oxide layer pattern on a sidewall of the deep trench; forming a second nitride layer pattern on the second oxide layer pattern to form an opening in the deep trench; and forming a third oxide layer pattern on the second nitride layer pattern to complete the enclosed void by covering a top portion of the opening; forming a shallow trench on the deep trench, the shallow trench having a second width substantially wider than the first width and a second depth substantially shallower than the first depth; and filling up the shallow trench with a second insulation layer pattern. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification