Bulk non-planar transistor having strained enhanced mobility and methods of fabrication
First Claim
1. A method of forming a semiconductor device comprising:
- forming a pair of isolation regions in a semiconductor substrate, said pair of isolation regions defining an active substrate region in said semiconductor substrate therebetween, said isolation region extending above said substrate;
forming a semiconductor film on said active region of said semiconductor substrate between said pair of isolation regions;
etching back said isolation regions to form a semiconductor body from said semiconductor film wherein said semiconductor body has a top surface and a pair of laterally opposite sidewalls;
forming a semiconductor capping layer on said top surface and said sidewalls of said semiconductor body;
forming a gate dielectric layer over said capping layer formed on said sidewalls of said top surface of said semiconductor body;
forming a gate electrode having a pair of laterally opposite sidewalls on and around said gate dielectric layer; and
forming a pair of source/drain regions in said semiconductor body on opposite sides of said gate electrode.
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Accused Products
Abstract
A method of a bulk tri-gate transistor having stained enhanced mobility and its method of fabrication. The present invention is a nonplanar transistor having a strained enhanced mobility and its method of fabrication. The transistor has a semiconductor body formed on a semiconductor substrate wherein the semiconductor body has a top surface on laterally opposite sidewalls. A semiconductor capping layer is formed on the top surface and on the sidewalls of the semiconductor body. A gate dielectric layer is formed on the semiconductor capping layer on the top surface of a semiconductor body and is formed on the capping layer on the sidewalls of the semiconductor body. A gate electrode having a pair of laterally opposite sidewalls is formed on and around the gate dielectric layer. A pair of source/drain regions are formed in the semiconductor body on opposite sides of the gate electrode.
171 Citations
18 Claims
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1. A method of forming a semiconductor device comprising:
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forming a pair of isolation regions in a semiconductor substrate, said pair of isolation regions defining an active substrate region in said semiconductor substrate therebetween, said isolation region extending above said substrate; forming a semiconductor film on said active region of said semiconductor substrate between said pair of isolation regions; etching back said isolation regions to form a semiconductor body from said semiconductor film wherein said semiconductor body has a top surface and a pair of laterally opposite sidewalls; forming a semiconductor capping layer on said top surface and said sidewalls of said semiconductor body; forming a gate dielectric layer over said capping layer formed on said sidewalls of said top surface of said semiconductor body; forming a gate electrode having a pair of laterally opposite sidewalls on and around said gate dielectric layer; and forming a pair of source/drain regions in said semiconductor body on opposite sides of said gate electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of forming a semiconductor device comprising:
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forming a pair of spaced apart isolation regions in a semiconductor substrate, said spaced apart isolation regions defining an active substrate area in said substrate wherein said isolation regions extend above said active substrate area; forming a semiconductor film on said active area of said substrate between said isolation regions; forming a first capping layer on said top surface of said semiconductor film between said isolation regions; etching back said isolation regions to form a semiconductor body having a top surface with said first capping layer and a pair of laterally opposite sidewalls; forming a second capping layer on said first capping layer on the top surface of said semiconductor body and on said sidewalls of said semiconductor body; forming a gate dielectric layer on said second capping layer on said first capping layer on said semiconductor body and on said second capping layer on said sidewalls of said semiconductor body; forming a gate electrode having a pair of laterally opposite sidewalls on and around said gate dielectric layer; and forming a pair of source/drain regions in said semiconductor body on opposite sides of said gate electrode. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification