Semiconductor package

• US 7,327,006 B2
• Filed: 06/23/2005
• Issued: 02/05/2008
• Est. Priority Date: 06/23/2005
• Status: Expired due to Fees

• Current Assignee: Nokia Corporation
• Original Assignee: Nokia Corporation
• Inventors: Svard, Mikael, Martin, Nigel
• Primary Examiner(s): LEE, HSIEN MING
• Application Number:
  US11/166,493
• Publication Number:
  US 20060290006A1
• Time in Patent Office: 957 Days
• Field of Search: 438106-109, 257/678, 257/687, 257/693, 257/700, 257/459
• US Class Current: 257/459
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides

Abstract

A semiconductor package includes a combination die embedded in a base. The combination die includes a plurality of functional blocks, where the functional blocks are insulated from one another on the combination die. Each functional block has plural die connectors. The base includes insulating layers conductive layers and vias. Each conductive layer has parts removed to form a pattern. The base is provided with a plurality of external connectors. A conductive path, made from a part of at least one of the conductive layers and at least one of the vias, connects one of the die connectors to a respective one of the external connectors.

Claims

1. A semiconductor package comprising:

a base, the base having external connectors at one or more exterior surfaces thereof; and

a combination die embedded within the base, the combination die comprising a plurality of functional blocks, the functional blocks being electrically insulated from one another on the die, each of said functional blocks having plural die connectors;

wherein the base comprises a plurality of conductive paths each arranged to connect one of the die connectors to a respective one of the external connectors.

2. A semiconductor package as claimed in claim 1, wherein the base is arranged to insulate electrically all of the die connectors of a given functional block from the die connectors of every other functional block.

3. A semiconductor package as claimed in claim 2, wherein the semiconductor package is mounted on a motherboard, and wherein one or more connections between the functional blocks are provided on the motherboard.

4. A semiconductor package as claimed in claim 1, wherein the external connectors are provided by a ball grid array.

5. A semiconductor package as claimed in claim 1, wherein the external connectors are provided by a land grid array.

9. A semiconductor package as in claim 1, wherein the base comprises a cavity to allow the embedding of a combination die within the base.

10. A semiconductor package as in claim 1, wherein the functional blocks are disposed in the combination die in a side-by-side relationship with respect to each other.

6. A mobile phone engine comprising a semiconductor package,

the semiconductor package comprising:

a base, the base having external connectors at one or more exterior surfaces thereof; and

a combination die embedded within the base, the combination die comprising a plurality of functional blocks, the functional blocks being electrically insulated from one another on the die, each of said functional blocks having plural die connectors;

wherein the base comprises a plurality of conductive paths each arranged to connect one of the die connectors to a respective one of the external connectors.

11. A mobile phone engine as in claim 6, wherein the base comprises a cavity to allow the embedding of a combination die within the base.

12. A mobile phone engine as in claim 6, wherein the functional blocks are disposed in the combination die in a side-by-side relationship with respect to each other.

7. A cellular modem comprising a semiconductor package,

the semiconductor package comprising:

a base, the base having external connectors at one or more exterior surfaces thereof; and

a combination die embedded within the base, the combination die comprising a plurality of functional blocks, the functional blocks being electrically insulated from one another on the die, each of said functional blocks having plural die connectors;

wherein the base comprises a plurality of conductive paths each arranged to connect one of the die connectors to a respective one of the external connectors.

13. A cellular modem as in claim 7, wherein the base comprises a cavity to allow the embedding of a combination die within the base.

14. A cellular modem block as in claim 7, wherein the functional blocks are disposed in the combination die in a side-by-side relationship with respect to each other.

8. A method of making a semiconductor package, the method comprising:

providing a base;

providing the base with external connectors at one or more exterior surfaces thereof;

providing a combination die with a plurality of functional blocks, the functional blocks being electrically insulated from one another on the die,

providing each of said functional blocks with plural die connectors;

embedding the combination die within the base; and

providing the base with a plurality of conductive paths each connecting one of the die connectors to a respective one of the external connectors.

15. A method of making a semiconductor package as in claim 8, wherein the functional blocks are disposed in the combination die in a side-by-side relationship with respect to each other.

16. A method of making a semiconductor package as in claim 8, the method further comprising adding conductive layers over the combination die when embedded within the base.

17. A method of making a semiconductor package as in claim 16, wherein the added conductive layers are separated from each other by insulating layers.