Inductors for integrated circuits
First Claim
1. An integrated circuit package comprising an inductive element fabricated by:
- forming at least one multi-level inductive element on a substrate in a serpentine pattern comprising at least two rows, wherein each row comprises upper conductive segments and lower conductive segments, and in at least one row the upper conductive segments are longer than the lower conductive segments; and
mounting an integrated circuit on the substrate,wherein, in forming, the at least one multi-level inductive element comprises at least one layer of magnetic material.
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Abstract
An inductor for an integrated circuit or integrated circuit package comprises a three-dimensional structure. In one embodiment the inductor is arranged on an integrated circuit substrate in at least two rows, each row comprising upper segments and lower segments, with the upper segments being longer than the lower segments. The upper segments in a first row are offset 180 degrees from those in an adjoining row to provide greater coupling of magnetic flux. The materials and geometry are optimized to provide a low resistance inductor for use in high performance integrated circuits. In another embodiment the inductor is arranged on an integrated circuit package substrate. Also described are methods of fabricating the inductor on an integrated circuit or as part of an integrated circuit package.
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Citations
20 Claims
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1. An integrated circuit package comprising an inductive element fabricated by:
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forming at least one multi-level inductive element on a substrate in a serpentine pattern comprising at least two rows, wherein each row comprises upper conductive segments and lower conductive segments, and in at least one row the upper conductive segments are longer than the lower conductive segments; and mounting an integrated circuit on the substrate, wherein, in forming, the at least one multi-level inductive element comprises at least one layer of magnetic material. - View Dependent Claims (2, 3, 4)
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5. An integrated circuit component comprising an inductive element fabricated by:
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forming a substrate; and forming at least one multi-level inductive element on the substrate in a serpentine pattern comprising at least two rows, wherein each row comprises upper conductive segments and lower conductive segments, and in at least one row the upper conductive segments are longer than the lower conductive segments, wherein, in forming the at least one multi-level inductive element, the at least one multi-level inductive element comprises at least one layer of magnetic material. - View Dependent Claims (6, 7, 8, 9)
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10. An integrated circuit package comprising an inductive element fabricated by:
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forming a substrate; forming at least one multi-level inductive element on the substrate in a serpentine pattern comprising at least two rows, wherein each row comprises upper conductive segments and lower conductive segments, and in at least one row the upper conductive segments are longer than the lower conductive segments; and mounting an integrated circuit on the substrate, wherein, in forming the at least one multi-level inductive element, the at least one multi-level inductive element comprises at least one layer of magnetic material. - View Dependent Claims (11, 12, 13, 14)
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15. An integrated circuit component comprising an inductive element fabricated by:
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forming a silicon substrate; and forming at least one multi-level inductive element on the substrate in a serpentine pattern comprising at least two rows, wherein each row comprises upper conductive segments and lower conductive segments, and in at least one row the upper conductive segments are longer than the lower conductive segments, wherein, in forming the at least one multi-level inductive element, the at least one multi-level inductive element comprises at least one layer of magnetic material. - View Dependent Claims (16)
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17. An integrated circuit comprising an inductive element fabricated by:
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forming at least one multi-level inductive element on a substrate in a serpentine pattern comprising at least two rows, wherein each row comprises upper conductive segments and lower conductive segments, and in at least one row the upper conductive segments are longer than the lower conductive segments, wherein, in forming, the at least one multi-level inductive element comprises at least one layer of magnetic material. - View Dependent Claims (18, 19, 20)
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Specification