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Copper alloy via bottom liner

  • US 7,327,033 B2
  • Filed: 08/05/2004
  • Issued: 02/05/2008
  • Est. Priority Date: 08/05/2004
  • Status: Expired due to Term
First Claim
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1. An integrated circuit includinga first layer having metal or metal alloy at a surface thereof,a second layer adjacent to said surface having a metal or metal alloy via therein,an interlayer connection between metal or metal alloy of said first layer and said metal or metal alloy via comprising a stable alloy region having graded mechanical characteristics, containing a predetermined quantity of alloying material and restricted to an interfacial region of said metal or metal alloy of said first layer and said metal or metal alloy via by a barrier layer,wherein said metal alloy of said interlayer connection is formed as an annulus in said metal or metal alloy at a surface of said first layer.

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