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Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers

  • US 7,327,577 B2
  • Filed: 11/03/2005
  • Issued: 02/05/2008
  • Est. Priority Date: 11/03/2005
  • Status: Expired due to Fees
First Claim
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1. A heat sink grounding spring, comprising:

  • a base comprising a conductive material having a generally planar portion, wherein the generally planar portion of the base is configured to contact at least a portion of a peripheral surface of a heat sink;

    a multiple-jointed spring finger comprising a conductive material extending from the generally planar portion of the base, wherein the multiple-jointed spring finger is double-jointed and includes a first v-shaped joint connecting the generally planar portion of the base to a central finger portion, and a second v-shaped joint connecting the central finger portion to a distal finger portion, and wherein the generally planar portion of the base includes a cut-out from which are formed the central finger portion, and the central finger portion includes a cut-out from which is formed the distal finger portion.

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