Electric range
First Claim
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1. An electric range comprising:
- a circuit board provided with at least one semiconductor chip and adapted to control an electric current to be applied to an induction heating device;
a heat sink to absorb heat of the semiconductor chip to discharge the heat to the outside; and
at least one heat spread clip to fix the semiconductor chip to the heat sink separably, and to conduct the heat of the semiconductor chip to the heat sink by contacting with the semiconductor chip.
1 Assignment
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Accused Products
Abstract
An electric range includes a circuit board provided with at least one semiconductor chip and adapted to control an electric current to be applied to an induction heating device, a heat sink to absorb heat of the semiconductor chip to discharge the heat to the outside, and at least one heat spread clip to fix the semiconductor chip to the heat sink to conduct the heat of the semiconductor chip to the heat sink.
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Citations
18 Claims
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1. An electric range comprising:
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a circuit board provided with at least one semiconductor chip and adapted to control an electric current to be applied to an induction heating device; a heat sink to absorb heat of the semiconductor chip to discharge the heat to the outside; and at least one heat spread clip to fix the semiconductor chip to the heat sink separably, and to conduct the heat of the semiconductor chip to the heat sink by contacting with the semiconductor chip. - View Dependent Claims (2, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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3. An electric range comprising:
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a circuit board provided with at least one semiconductor chip and adapted to control an electric current to be applied to an induction heating device; a heat sink to absorb heat of the semiconductor chip to discharge the heat to the outside; and at least one heat spread clip to fix the semiconductor chip to the heat sink to conduct the heat of the semiconductor chip to the heat sink, wherein the heat spread clip includes; a coupling portion having a receiving recess to come into contact with the upper surface of the semiconductor chip; and extensions extending from opposite sides of the coupling portion to come into contact with the heat sink at their lower surfaces. - View Dependent Claims (4, 5, 6, 7)
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Specification