Electric range

• US 7,329,846 B2
• Filed: 08/16/2005
• Issued: 02/12/2008
• Est. Priority Date: 02/25/2005
• Status: Expired due to Fees

• Current Assignee: LG Electronics, Inc. (LG Corporation)
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: Kwag, Dong Seong, Park, Byeong Wook
• Primary Examiner(s): ROBINSON, DANIEL LEON
• Application Number:
  US11/204,156
• Publication Number:
  US 20060191908A1
• Time in Patent Office: 910 Days
• Field of Search: 219/622, 219/620, 219/623, 219/385, 219/647, 312/236
• US Class Current: 219/622
• CPC Class Codes: H01L 2023/4031 Packaged discrete devices, e.g. to-3 housings, diodes
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 2023/4062 heatsink to or through board or cabinet
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05B 2206/022 Special supports for the induction coils
• CPC Class Codes: H05B 6/1263 using coil cooling arrangements

Abstract

An electric range includes a circuit board provided with at least one semiconductor chip and adapted to control an electric current to be applied to an induction heating device, a heat sink to absorb heat of the semiconductor chip to discharge the heat to the outside, and at least one heat spread clip to fix the semiconductor chip to the heat sink to conduct the heat of the semiconductor chip to the heat sink.

Claims

1. An electric range comprising:

a circuit board provided with at least one semiconductor chip and adapted to control an electric current to be applied to an induction heating device;

a heat sink to absorb heat of the semiconductor chip to discharge the heat to the outside; and

at least one heat spread clip to fix the semiconductor chip to the heat sink separably, and to conduct the heat of the semiconductor chip to the heat sink by contacting with the semiconductor chip.

2. The electric range as set forth in claim 1, wherein the heat spread clip is provided to cover an upper surface of the semiconductor chip.

8. The electric range as set forth in claim 1, further comprising an electrical insulating sheet provided between the semiconductor chip and the heat sink.

9. The electric range as set forth in claim 1, wherein the heat spread clip is coupled to the heat sink by fastening screws.

10. The electric range as set forth in claim 9, wherein the screws are fastened to the heat sink by simultaneously penetrating through both the circuit board and the heat spread clip.

11. The electric range as set forth in claim 1, further comprising:

an electrical insulating sheet provided between a lower surface of the semiconductor chip and the heat sink,

wherein the heat spread clip includes a coupling portion having a receiving recess to come into contact with an upper surface of the semiconductor chip and extensions extending from opposite sides of the coupling portion to come into contact with the heat sink at their lower surfaces.

12. The electric range as set forth in claim 1, wherein the semiconductor chip directly contacts the heat sink.

13. The electric range as set forth in claim 1, wherein the at least one semiconductor chip is in contact with the heat sink and the at least one heat spread clip.

14. The electric range as set forth in claim 13, wherein the at least one semiconductor chip has a first surface and a second surface, the heat sink being in contact with the first surface of the at least one semiconductor chip, the at least one heat spread clip being in contact with the second surface of the at least one semiconductor chip.

15. The electric range as set forth in claim 14, wherein the first surface is opposite to the second surface.

16. The electric range as set forth in claim 14, wherein the at least one heat spread clip covers the entire second surface of the at least one semiconductor chip.

17. The electric range as set forth in claim 14, wherein the at least one heat spread clip presses the second surface of the at least one semiconductor chip by a resilience of the at least one heat spread clip toward the heat sink.

18. The electric range as set forth in claim 1, wherein the at least one semiconductor chip is an insulated gate bipolar transistor (IGBT).

3. An electric range comprising:

a circuit board provided with at least one semiconductor chip and adapted to control an electric current to be applied to an induction heating device;

a heat sink to absorb heat of the semiconductor chip to discharge the heat to the outside; and

at least one heat spread clip to fix the semiconductor chip to the heat sink to conduct the heat of the semiconductor chip to the heat sink,

wherein the heat spread clip includes;

a coupling portion having a receiving recess to come into contact with the upper surface of the semiconductor chip; and

extensions extending from opposite sides of the coupling portion to come into contact with the heat sink at their lower surfaces.

4. The electric range as set forth in claim 3, wherein the extensions are coupled to the heat sink by fastening screws.

5. The electric range as set forth in claim 3, wherein an electrical insulating sheet is provided between each of the extensions and the heat sink.

6. The electric range as set forth in claim 3, wherein the heat spread clip is made of aluminum.

7. The electric range as set forth in claim 3, wherein the receiving recess is convexly rounded upwards, and the upper surface of the semiconductor chip is rounded convexly to correspond to the receiving recess.