Integrally packaged imaging module
First Claim
1. An integrally packaged imaging module, comprising:
- an integrated circuit (IC) including an image sensing device formed on a semiconductor substrate;
a first adhesive layer located on at least a portion of a top surface of the semiconductor substrate;
a first spacing structure having a first height, the first spacing structure affixed to the semiconductor structure using the first adhesive layer;
a lens assembly located on at least a portion of a top surface of the first spacing structure, the lens assembly providing a second spacing structure;
a transparent enclosure portion having a surface area extending substantially to the periphery of the second spacing structure, the transparent enclosure portion disposed on top of the second spacing structure defining a cavity above the image sensing device of the IC, the cavity having a cavity height that is substantially equal to the first and second heights of the first and second spacing structures, andthe lens assembly includes a lens, wherein only the lens is disposed in the cavity.
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Accused Products
Abstract
An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.
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Citations
13 Claims
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1. An integrally packaged imaging module, comprising:
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an integrated circuit (IC) including an image sensing device formed on a semiconductor substrate; a first adhesive layer located on at least a portion of a top surface of the semiconductor substrate; a first spacing structure having a first height, the first spacing structure affixed to the semiconductor structure using the first adhesive layer; a lens assembly located on at least a portion of a top surface of the first spacing structure, the lens assembly providing a second spacing structure; a transparent enclosure portion having a surface area extending substantially to the periphery of the second spacing structure, the transparent enclosure portion disposed on top of the second spacing structure defining a cavity above the image sensing device of the IC, the cavity having a cavity height that is substantially equal to the first and second heights of the first and second spacing structures, and the lens assembly includes a lens, wherein only the lens is disposed in the cavity. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An integrally packaged imaging module, comprising:
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an integrated circuit (IC) including an image sensing device formed on a semiconductor substrate; wafer-level packaging enclosing the IC and formed at a semiconductor wafer level when the IC is positioned on a semiconductor wafer, and including; a packaging substrate, wherein the semiconductor substrate is positioned over the packaging substrate and extends over substantially an entire top surface of the packaging substrate; a transparent enclosure portion extending over substantially an entire top surface of the packaging substrate and adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths; a first lens support adapted to suspend a first lens so that the first lens directs the image onto the image sensing device; a first spacing structure adapted to provide a spacing between the suspended first lens and the image sensing device; a second spacing structure, formed by the first lens support, positioned on top of the first spacing structure; the transparent enclosure portion positioned on top of the second spacing structure; the semiconductor substrate, the first and second spacing structures, and the transparent enclosure portion forming a single cavity; and the first lens is disposed in the single cavity. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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Specification