Microelectromechanical (MEM) viscosity sensor and method

• US 7,329,932 B2
• Filed: 09/12/2005
• Issued: 02/12/2008
• Est. Priority Date: 09/12/2005
• Status: Active Grant

• Current Assignee: Teledyne Scientific & Imaging, LLC (Teledyne Technologies Incorporated)
• Original Assignee: Teledyne Licensing, LLC (Teledyne Technologies Incorporated)
• Inventors: DeNatale, Jeffrey F., Stupar, Philip A., Borwick, Robert L. III
• Primary Examiner(s): Chambliss; Alonzo
• Application Number:
  US11/224,798
• Publication Number:
  US 20070057336A1
• Time in Patent Office: 883 Days
• Field of Search: None
• US Class Current: 257/417
• CPC Class Codes: G01N 11/16 by measuring damping effect upon oscillatory body

Abstract

A MEM viscosity sensor comprises a substrate, with first and second support structures affixed to the substrate and spaced-apart. A compliant member is affixed to the support structures such that it is suspended above and can flex vertically with respect to the substrate. The member has a high density of perforations, through which a fluid whose viscosity is to be sensed can flow. The sensor includes a drive means to apply a force to the member, and a sensing means to sense the vertical motion of the member in response to the applied force. The member'"'"'s perforations ensure that its resistance to motion will be shear in nature, and minimizes sensitivity to particulates. The substrate is also preferably perforated to further reduce non-shear forces and facilitate fluid exchange.

Claims

1. A microelectromechanical (MEM) viscosity sensor, comprising:

a substrate;

first and second support structures on said substrate, said support structures spaced-apart;

a compliant member having first and second ends, said first and second ends affixed to said first and second support structures, respectively, such that said member is suspended between said support structures and above said substrate and can flex vertically with respect to said substrate, said member having a high density of perforations through which a fluid whose viscosity is to be sensed can flow;

a drive means coupled to said compliant member and arranged to apply a force to said member such that said member moves vertically with respect to said substrate; and

a sensing means coupled to said compliant member and arranged to sense the motion of said member in response to said force.

2. The sensor of claim 1, wherein said sensor is arranged such that said compliant member is subjected to a predominately shear force when moving through said fluid.

3. The sensor of claim 1, wherein said drive means is selected from a group consisting of an electrostatic actuator, thermal actuator, electromagnetic actuator, Lorentz force actuator, or piezoelectric actuator.

4. The sensor of claim 1, wherein said sensing means is arranged to provide an output which varies with the position between said compliant member and said substrate based on said sensing means.

5. The sensor of claim 1, wherein said sensing means is arranged to provide an output which varies with the position of the compliant member based on piezoresistive or optical sensing methods.

6. The sensor of claim 1, wherein said compliant member is a plate having a thickness of 20-50 μ

m.

7. The sensor of claim 1, wherein said compliant member comprises single crystal silicon.

8. The sensor of claim 1, wherein the portion of said substrate beneath said compliant member has a high density of perforations such that said fluid can flow through said substrate portion via said perforations.

9. The sensor of claim 8, wherein the perforations in said substrate portion are larger than those in said compliant member.

10. The sensor of claim 1, wherein the portion of said substrate beneath said compliant member comprises a recessed area to facilitate fluid flow through said compliant member.

11. The sensor of claim 1, wherein said drive means is arranged to apply said force as a step input.

12. The sensor of claim 1, wherein said sensor is arranged to operate in an overdamped mode when said force is applied to said compliant member.

13. The sensor of claim 1, further comprising a housing which encapsulates said substrate, support structures, compliant member, drive means and sensing means, said housing including a perforated portion through which said fluid can flow.

14. The sensor of claim 1, wherein said complaint member comprises:

a rigid perforated plate; and

compliant mechanical flexures coupled between said plate and said support structures such that said plate is suspended between said support structures via said compliant mechanical flexures.

15. The sensor of claim 1, further comprising an insulating layer arranged to enable a voltage differential to be applied between said substrate and said compliant member.

16. The sensor of claim 1, further comprising an insulating layer arranged to electrically isolate said substrate from said compliant member.

17. The sensor of claim 1, wherein said drive means comprises one or more electrodes on said substrate, further comprising an insulating layer arranged to electrically isolate said electrodes from said substrate.

18. The sensor of claim 17, wherein said sensing means comprises one or more electrodes on said substrate and said insulating layer is arranged to electrically isolate said drive electrodes from said sensing electrodes.

19. The sensor of claim 1, further comprising an insulating means which prevents electrical contact between said compliant member and said substrate and/or electrodes on said substrate.

20. The sensor of claim 19, wherein said insulating means comprises an insulating layer affixed to the substrate side of said compliant member.

21. The sensor of claim 19, wherein said insulating means comprises insulating standoffs.

22. A microelectromechanical (MEM) viscosity sensor, comprising:

a substrate;

first and second support structures on said substrate, said support structures spaced-apart;

a compliant member having first and second ends, said first and second ends affixed to said first and second support structures, respectively, such that said member is suspended between said support structures and above said substrate and can flex vertically with respect to said substrate, said member and the portion of said substrate beneath said member each having a high density of perforations through which a fluid whose viscosity is to be sensed can flow and such that said compliant member is subjected to a predominately shear force when moving through said fluid;

an electrostatic drive means coupled to said compliant member and arranged to apply a force to said member such that said member moves vertically with respect to said substrate; and

a capacitive sensing means coupled to said compliant member and arranged to sense the motion of said member in response to said force.

23. The sensor of claim 22, wherein said drive means is arranged to apply said force as a step input and said sensor is arranged to operate in an overdamped mode in response to said step input.

24. A microelectromechanical (MEM) viscosity sensor, comprising:

a semiconductor wafer; and

a substrate bonded to said wafer and thereby forming a composite structure, portions of said composite structure patterned and etched to form;

first and second support structures on said substrate, said support structures spaced-apart; and

a compliant member having first and second ends, said first and second ends affixed to said first and second support structures, respectively, such that said member is suspended between said support structures and above said substrate and can flex vertically with respect to said substrate, said member having a high density of perforations through which a fluid whose viscosity is to be sensed can flow;

a drive means coupled to said compliant member and for displacing said compliant member vertically relative to said substrate; and

a sensing means coupled to said compliant member and arranged to sense the motion of said member in response to said force.

25. The sensor of claim 24, further comprising an organic adhesive which bonds said substrate to said wafer.

26. The sensor of claim 24, wherein said wafer and substrate have respective bonding pads which are aligned and mechanically connected such that a thermocompression bond is formed to effect the bonding of said wafer to said substrate.

27. The sensor of claim 26, wherein said bonding pads are gold (Au) and said thermocompression bond is an Au—

Au thermocompression bond.

28. The sensor of claim 24, wherein said wafer and substrate have respective bonding regions which are aligned and mechanically connected such that an anodic bond is formed to effect the bonding of said wafer to said substrate.

29. The sensor of claim 24, wherein said wafer is a silicon-on-insulator (SOI) wafer.

30. The sensor of claim 24, wherein said substrate is a semiconductor wafer containing additional circuitry.

31. The sensor of claim 24, further comprising one or more metallization layers deposited on said composite structure and patterned through etching or liftoff methods to provide electrical interconnections for said sensor.

32. The sensor of claim 31, wherein said metallization layers comprise a conductive refractory material.

33. A method of measuring the viscosity of a fluid, comprising:

providing a microelectromechanical (MEM) viscosity sensor, comprising;

a substrate;

first and second support structures on said substrate, said support structures spaced-apart;

a compliant member having first and second ends, said first and second ends affixed to said first and second support structures, respectively, such that said member is suspended between said support structures and above said substrate and can flex vertically with respect to said substrate, said member having a high density of perforations through which a fluid whose viscosity is to be sensed can flow;

a drive means coupled to said compliant member and arranged to apply a force to said member such that said member moves vertically with respect to said substrate; and

a sensing means coupled to said compliant member and arranged to sense the motion of said member in response to said force;

immersing said sensor in said fluid;

operating said drive means such that said force is applied to said compliant member as a step input; and

measuring the time response of said compliant member using said sensing means.

34. The method of claim 33, wherein the portion of said substrate beneath said compliant member has a high density of perforations such that said fluid can flow through said substrate portion via said perforations.

35. The method of claim 33, wherein said sensor is arranged to operate in an overdamped mode when said force is applied to said compliant member.

36. A method of fabricating a microelectromechanical (MEM) viscosity sensor, comprising:

providing a semiconductor wafer;

providing a substrate;

forming first and second support structures on said substrate, said support structures spaced-apart; and

bonding said wafer and substrate together to form a composite structure; and

patterning and etching portions of said composite structure to form a compliant member having first and second ends, said first and second ends affixed to said first and second support structures, respectively, such that said member is suspended between said support structures and above said substrate and can flex vertically with respect to said substrate, said member having a high density of perforations through which a fluid whose viscosity is to be sensed can flow.

37. The method of claim 36, further comprising patterning and etching said substrate to provide a high density of perforations through said substrate such that said fluid can flow through said substrate via said perforations.

38. The method of claim 36, further comprising:

patterning and etching a recessed area into said substrate beneath said compliant member to facilitate fluid flow through said compliant member.

39. The method of claim 36, wherein said bonding comprises:

patterning one or more bonding pads on said wafer;

patterning one or more bonding pads on said substrate such that said substrate'"'"'s bonding pads can be aligned with said wafer'"'"'s bonding pads;

aligning said wafer'"'"'s bonding pads with said substrate'"'"'s bonding pads; and

mechanically connecting the bonding pads of said wafer and substrate to produce a thermocompression bond which bonds said wafer and substrate.

40. The method of claim 39, wherein said bonding pads are gold bonding pads and said thermocompression bond is an Au—

Au thermocompression bond.

41. The method of claim 36, further comprising depositing one or more metallization layers on said composite structure and patterning through etching or liftoff methods to provide electrical interconnections for said sensor.

42. The method of claim 41, wherein said metallization layers comprise a conductive refractory material.

43. The method of claim 36, further comprising depositing an insulating layer between said substrate and said compliant member.