Interleaved MEMS-based probes for testing integrated circuits
First Claim
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1. An apparatus for testing an integrated circuit, the apparatus comprising:
- a substrate;
a plurality of probes formed on the substrate, each of the probes being configured to contact a corresponding pad on a die, each of the probes having a supported portion fixedly attached to the substrate and an unsupported portion that flexes upon contact with a die pad, the unsupported portion having a non-uniform cross-section along its entire length that begins at a base where the supported portion and the unsupported portion meet;
wherein the probes comprise a first set of probes and a second set of probes, the first set of probes having unsupported portions that have bases along a first line, the second set of probes having unsupported portions that have bases along a second line, and the first and second sets of probes having tips for contacting pads on the die and that curl up along a same third line that is between the first line and the second line as viewed from a perspective view of the first and second sets of probes.
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Abstract
In one embodiment, a probe card includes a substrate and a plurality of probes. Each of the probes may have a supported portion and an unsupported portion that meet at a base. The unsupported portion may have a non-uniform (e.g. triangular) cross-section along a length that begins at the base. The probes may be interleaved and fabricated using MEMS fabrication techniques.
28 Citations
10 Claims
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1. An apparatus for testing an integrated circuit, the apparatus comprising:
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a substrate; a plurality of probes formed on the substrate, each of the probes being configured to contact a corresponding pad on a die, each of the probes having a supported portion fixedly attached to the substrate and an unsupported portion that flexes upon contact with a die pad, the unsupported portion having a non-uniform cross-section along its entire length that begins at a base where the supported portion and the unsupported portion meet; wherein the probes comprise a first set of probes and a second set of probes, the first set of probes having unsupported portions that have bases along a first line, the second set of probes having unsupported portions that have bases along a second line, and the first and second sets of probes having tips for contacting pads on the die and that curl up along a same third line that is between the first line and the second line as viewed from a perspective view of the first and second sets of probes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification