Localizing a temperature of a device for testing
First Claim
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1. A method of testing a device at a target temperature, said device being one of a plurality of devices included on a structure having at least one structure surface with a structure surface area, said method comprising the steps of:
- (a) inducing a first heat flux through a structure surface over a substantial portion of said structure surface area;
(b) inducing a second heat flux through a surface of a local area of said structure, said local area being smaller than, and within, said structure surface area and proximate said device to be tested;
(c) sensing the temperature of said local area of said structure while said first heat flux and said second heat flux are induced through said surface;
(d) varying said second heat flux in response to the sensed said temperature of said local area so as to achieve said target temperature at said device to be tested; and
(e) measuring a performance parameter for said device at said target temperature.
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Abstract
Wafers or other structures comprising a plurality of dies or devices are tested at non-ambient temperatures by inducing a first heat flux through a substantial portion of a surface of the structure to modify a temperature of the structure and inducing a second heat flux through a local area of a surface of the structure, proximate the device under test, to modify the temperature the device under test.
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Citations
36 Claims
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1. A method of testing a device at a target temperature, said device being one of a plurality of devices included on a structure having at least one structure surface with a structure surface area, said method comprising the steps of:
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(a) inducing a first heat flux through a structure surface over a substantial portion of said structure surface area; (b) inducing a second heat flux through a surface of a local area of said structure, said local area being smaller than, and within, said structure surface area and proximate said device to be tested; (c) sensing the temperature of said local area of said structure while said first heat flux and said second heat flux are induced through said surface; (d) varying said second heat flux in response to the sensed said temperature of said local area so as to achieve said target temperature at said device to be tested; and (e) measuring a performance parameter for said device at said target temperature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. An apparatus for testing a device at a temperature, said device being one of a plurality of devices included on a structure having at least one structure surface with a structure surface area, said apparatus comprising:
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(a) a first heat flux origin inducing a first heat flux through a structure surface over a substantial portion of said structure surface area; (b) a second heat flux origin inducing a second heat flux through a local area of a structure surface, said local area being smaller than said structure surface area and proximate said device to be tested; (c) a probe for measuring a performance parameter of said device by contacting a test pad on a surface of said device; (d) a temperature sensor sensing a temperature of said local area wherein said temperature sensor comprises; (ii) a source of excitation connectable to said device; (ii) an output instrument to measure a response of said device to excitation by said source; (iii) an arithmetic device to determine a difference between a first response from said output instrument and a temporally successive second response from said output instrument; and (iv) a comparator to compare said difference to a value that calibrates a response of said output instrument to a temperature of said device; and (e) a control responding to said sensed temperature of said local area to vary at least one of said first heat flux and said second heat flux. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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Specification